EP3842572A4 - Tin alloy electroplating bath and plating method using same - Google Patents

Tin alloy electroplating bath and plating method using same Download PDF

Info

Publication number
EP3842572A4
EP3842572A4 EP19852348.2A EP19852348A EP3842572A4 EP 3842572 A4 EP3842572 A4 EP 3842572A4 EP 19852348 A EP19852348 A EP 19852348A EP 3842572 A4 EP3842572 A4 EP 3842572A4
Authority
EP
European Patent Office
Prior art keywords
same
plating method
tin alloy
electroplating bath
alloy electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19852348.2A
Other languages
German (de)
French (fr)
Other versions
EP3842572A1 (en
Inventor
Yutaka Morii
Go Nagata
Satoshi Yuasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dipsol Chemicals Co Ltd
Original Assignee
Dipsol Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dipsol Chemicals Co Ltd filed Critical Dipsol Chemicals Co Ltd
Publication of EP3842572A1 publication Critical patent/EP3842572A1/en
Publication of EP3842572A4 publication Critical patent/EP3842572A4/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
EP19852348.2A 2018-08-21 2019-07-12 Tin alloy electroplating bath and plating method using same Pending EP3842572A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018154703A JP7121390B2 (en) 2018-08-21 2018-08-21 Tin alloy electroplating bath and plating method using the same
PCT/JP2019/027743 WO2020039791A1 (en) 2018-08-21 2019-07-12 Tin alloy electroplating bath and plating method using same

Publications (2)

Publication Number Publication Date
EP3842572A1 EP3842572A1 (en) 2021-06-30
EP3842572A4 true EP3842572A4 (en) 2022-05-18

Family

ID=69592564

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19852348.2A Pending EP3842572A4 (en) 2018-08-21 2019-07-12 Tin alloy electroplating bath and plating method using same

Country Status (6)

Country Link
US (1) US20210317591A1 (en)
EP (1) EP3842572A4 (en)
JP (1) JP7121390B2 (en)
KR (1) KR20210043567A (en)
CN (1) CN112513337A (en)
WO (1) WO2020039791A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114318433A (en) * 2021-10-28 2022-04-12 中国航发西安动力控制科技有限公司 Formula of tin plating and removing solution and process for plating tin on surface of part

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11152595A (en) * 1997-11-19 1999-06-08 Ishihara Chem Co Ltd Tin and tin alloy plating bath, controlling method and preparation of the same
US20050173255A1 (en) * 2004-02-05 2005-08-11 George Bokisa Electroplated quaternary alloys
US20090188807A1 (en) * 2007-12-12 2009-07-30 Rohm And Haas Electronic Materials Llc Electroplating bronze
JP2009185358A (en) * 2008-02-07 2009-08-20 Ishihara Chem Co Ltd Tin and tin alloy plating bath, and electronic component formed with the plating film
JP2014122410A (en) * 2012-12-24 2014-07-03 Ishihara Chemical Co Ltd Tin or tin alloy plating bath

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6029482A (en) 1983-07-28 1985-02-14 Nippon Kagaku Sangyo Kk Tin and tin alloy electroplating liquid
US5827413A (en) * 1995-10-25 1998-10-27 Tosoh Corporation Low hydrogen over voltage cathode and process for production thereof
JPH09241885A (en) 1996-03-11 1997-09-16 Okuno Chem Ind Co Ltd Tin-cobalt alloy plating bath
GB0106131D0 (en) * 2001-03-13 2001-05-02 Macdermid Plc Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys
JP4441726B2 (en) * 2003-01-24 2010-03-31 石原薬品株式会社 Method for producing tin or tin alloy aliphatic sulfonic acid plating bath
JP2006009039A (en) 2004-06-21 2006-01-12 Rambo Chemicals (Hong Kong) Ltd Tin based plating film in which growth of whisker is suppressed and forming method therefor
JP5150016B2 (en) * 2009-05-12 2013-02-20 石原薬品株式会社 Tin or tin alloy plating bath and barrel plating method using the plating bath
JP5412612B2 (en) 2011-08-22 2014-02-12 石原ケミカル株式会社 Tin and tin alloy plating baths, electronic parts with electrodeposited film formed by the bath
JP7009679B2 (en) * 2015-07-29 2022-01-26 石原ケミカル株式会社 Electric tin and electric tin alloy plating bath, method of forming electrodeposits using the plating bath

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11152595A (en) * 1997-11-19 1999-06-08 Ishihara Chem Co Ltd Tin and tin alloy plating bath, controlling method and preparation of the same
US20050173255A1 (en) * 2004-02-05 2005-08-11 George Bokisa Electroplated quaternary alloys
US20090188807A1 (en) * 2007-12-12 2009-07-30 Rohm And Haas Electronic Materials Llc Electroplating bronze
JP2009185358A (en) * 2008-02-07 2009-08-20 Ishihara Chem Co Ltd Tin and tin alloy plating bath, and electronic component formed with the plating film
JP2014122410A (en) * 2012-12-24 2014-07-03 Ishihara Chemical Co Ltd Tin or tin alloy plating bath

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2020039791A1 *

Also Published As

Publication number Publication date
JP2020029582A (en) 2020-02-27
JP7121390B2 (en) 2022-08-18
WO2020039791A1 (en) 2020-02-27
KR20210043567A (en) 2021-04-21
CN112513337A (en) 2021-03-16
EP3842572A1 (en) 2021-06-30
US20210317591A1 (en) 2021-10-14

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