IN2014CN02464A - - Google Patents
Info
- Publication number
- IN2014CN02464A IN2014CN02464A IN2464CHN2014A IN2014CN02464A IN 2014CN02464 A IN2014CN02464 A IN 2014CN02464A IN 2464CHN2014 A IN2464CHN2014 A IN 2464CHN2014A IN 2014CN02464 A IN2014CN02464 A IN 2014CN02464A
- Authority
- IN
- India
- Prior art keywords
- relates
- coating
- microns
- thickness
- main component
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Abstract
The invention relates to an electroplated coating in the form of a gold alloy, which has a thickness of between 1 and 800 microns and contains copper. According to the invention, the coating includes indium as third main component. The invention relates to the field of electroplating processes.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH01494/07A CH710184B1 (en) | 2007-09-21 | 2007-09-21 | Process for obtaining a yellow gold alloy deposit by electroplating without the use of toxic metals or metalloids. |
PCT/EP2008/062042 WO2009037180A1 (en) | 2007-09-21 | 2008-09-11 | Method of obtaining a yellow gold alloy coating by electroplating without the use of toxic metals or metalloids |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014CN02464A true IN2014CN02464A (en) | 2015-08-07 |
Family
ID=39967872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN2464CHN2014 IN2014CN02464A (en) | 2007-09-21 | 2008-09-11 |
Country Status (12)
Country | Link |
---|---|
US (3) | US10233555B2 (en) |
EP (1) | EP2205778B1 (en) |
JP (2) | JP5563462B2 (en) |
KR (1) | KR101280675B1 (en) |
CN (1) | CN101815814B (en) |
AT (1) | ATE499461T1 (en) |
CH (1) | CH710184B1 (en) |
DE (1) | DE602008005184D1 (en) |
HK (1) | HK1147782A1 (en) |
IN (1) | IN2014CN02464A (en) |
TW (2) | TWI507571B (en) |
WO (1) | WO2009037180A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH714243B1 (en) * | 2006-10-03 | 2019-04-15 | Swatch Group Res & Dev Ltd | Electroforming process and part or layer obtained by this method. |
CH710184B1 (en) | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Process for obtaining a yellow gold alloy deposit by electroplating without the use of toxic metals or metalloids. |
EP2312021B1 (en) * | 2009-10-15 | 2020-03-18 | The Swatch Group Research and Development Ltd. | Method for obtaining a deposit of a yellow gold alloy by galvanoplasty without using toxic metals |
EP2505691B1 (en) * | 2011-03-31 | 2014-03-12 | The Swatch Group Research and Development Ltd. | Process for obtaining a gold alloy deposit of 18 carat 3N |
ITFI20120103A1 (en) * | 2012-06-01 | 2013-12-02 | Bluclad Srl | GALVANIC BATHROOMS FOR THE ACHIEVEMENT OF A LEAGUE OF LOW-CARATHED GOLD AND GALVANIC PROCESS THAT USES THESE BATHROOMS. |
WO2016020812A1 (en) * | 2014-08-04 | 2016-02-11 | Nutec International Srl | Electrolytic bath, electrolytic deposition method and item obtained with said method |
CN109504991B (en) * | 2019-01-21 | 2020-08-07 | 南京市产品质量监督检验院 | Cyanide-free 18k gold electroforming solution, and preparation method and application thereof |
Family Cites Families (47)
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US2596454A (en) * | 1949-09-10 | 1952-05-13 | Metals & Controls Corp | Gold alloys |
US2660554A (en) * | 1950-11-10 | 1953-11-24 | Barnet D Ostrow | Bright gold and gold alloy plating baths |
CH286123A (en) * | 1952-05-08 | 1952-10-15 | Spreter Victor | Bath for the galvanic deposition of gold alloys. |
US2976180A (en) * | 1957-12-17 | 1961-03-21 | Hughes Aircraft Co | Method of silver plating by chemical reduction |
FR1259407A (en) | 1960-03-10 | 1961-04-28 | Maison Murat | Electrolytic bath for thick deposit of gold-copper alloy |
CH455434A (en) * | 1963-08-15 | 1968-07-15 | Werner Fluehmann Galvanische A | Process for the production of white gold coatings |
DE1460993A1 (en) | 1965-07-23 | 1970-07-23 | Kieninger & Obergfell | Electrical program control device, preferably for electrical household appliances, especially washing machines and dishwashers |
US3475292A (en) * | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
GB1156186A (en) * | 1966-09-26 | 1969-06-25 | Sel Rex Corp | Gold Plating |
BE743946A (en) * | 1969-01-07 | 1970-05-28 | ||
US3642589A (en) * | 1969-09-29 | 1972-02-15 | Fred I Nobel | Gold alloy electroplating baths |
US3666640A (en) * | 1971-04-23 | 1972-05-30 | Sel Rex Corp | Gold plating bath and process |
DE2121150C3 (en) * | 1971-04-24 | 1980-08-21 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Process for the electrodeposition of gold alloys |
CH529843A (en) | 1971-07-09 | 1972-10-31 | Oxy Metal Finishing Europ S A | Bath for the electrolytic deposition of gold alloys and its use in electroplating |
FR2181455B1 (en) * | 1972-04-25 | 1974-08-30 | Parker Ste Continentale | |
DE2244434C3 (en) * | 1972-09-06 | 1982-02-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Aqueous bath for the galvanic deposition of gold and gold alloys |
US3902977A (en) * | 1973-12-13 | 1975-09-02 | Engelhard Min & Chem | Gold plating solutions and method |
CH621367A5 (en) | 1977-07-08 | 1981-01-30 | Systemes Traitements Surfaces | Electrolytic bath for plating gold-copper-cadmium alloys and its use in galvanoplasty |
CH622829A5 (en) * | 1977-08-29 | 1981-04-30 | Systemes Traitements Surfaces | |
FR2405312A1 (en) * | 1977-10-10 | 1979-05-04 | Oxy Metal Industries Corp | Bath for electrodeposition of gold-zinc alloys - contains alkali sulphite, gold-sulphite complex, zinc salt, complex or chelate, complexing or chelating agent and metal |
US4168214A (en) * | 1978-06-14 | 1979-09-18 | American Chemical And Refining Company, Inc. | Gold electroplating bath and method of making the same |
DE3020765A1 (en) * | 1980-05-31 | 1981-12-10 | Degussa Ag, 6000 Frankfurt | ALKALINE BATH FOR GALVANIC DEPOSITION OF LOW-CARAINE PINK TO YELLOW-COLORED GOLD ALLOY LAYERS |
GB8334226D0 (en) * | 1983-12-22 | 1984-02-01 | Learonal Uk Ltd | Electrodeposition of gold alloys |
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CH662583A5 (en) | 1985-03-01 | 1987-10-15 | Heinz Emmenegger | GALVANIC BATH FOR THE ELECTROLYTIC DEPOSITION OF GOLD-COPPER-CADMIUM-ZINC ALLOYS. |
JPS62164890A (en) | 1986-01-16 | 1987-07-21 | Seiko Instr & Electronics Ltd | Gold-silver-copper alloy plating solution |
DE3878783T2 (en) * | 1987-08-21 | 1993-07-22 | Engelhard Ltd | BATH FOR ELECTROPLATING A GOLD-COPPER-ZINC ALLOY. |
JPH01247540A (en) | 1988-03-29 | 1989-10-03 | Seiko Instr Inc | Manufacture of outer ornament parts made of hard gold alloy |
GB8903818D0 (en) * | 1989-02-20 | 1989-04-05 | Engelhard Corp | Electrolytic deposition of gold-containing alloys |
DE3929569C1 (en) * | 1989-09-06 | 1991-04-18 | Degussa Ag, 6000 Frankfurt, De | |
GB2242200B (en) * | 1990-02-20 | 1993-11-17 | Omi International | Plating compositions and processes |
CH680927A5 (en) | 1990-10-08 | 1992-12-15 | Metaux Precieux Sa | |
US5085744A (en) * | 1990-11-06 | 1992-02-04 | Learonal, Inc. | Electroplated gold-copper-zinc alloys |
US5244593A (en) * | 1992-01-10 | 1993-09-14 | The Procter & Gamble Company | Colorless detergent compositions with enhanced stability |
US5256275A (en) * | 1992-04-15 | 1993-10-26 | Learonal, Inc. | Electroplated gold-copper-silver alloys |
US5340529A (en) * | 1993-07-01 | 1994-08-23 | Dewitt Troy C | Gold jewelry alloy |
ES2179952T3 (en) * | 1995-11-03 | 2003-02-01 | Enthone Omi Inc | COMPOSITIONS AND DEPOSITS OF ELECTRODEPOSITION PROCEDURES. |
DE19629658C2 (en) | 1996-07-23 | 1999-01-14 | Degussa | Cyanide-free galvanic bath for the deposition of gold and gold alloys |
US6814850B1 (en) * | 1999-06-17 | 2004-11-09 | Umicore Galvanotechnik Gmbh | Acid bath for electrodeposition of glossy gold and gold alloy layers and a gloss additive for same |
JP2001198693A (en) | 2000-01-17 | 2001-07-24 | Ishifuku Metal Ind Co Ltd | Gold brazing filler metal for industrial use and jewel and ornament |
JP4023138B2 (en) * | 2001-02-07 | 2007-12-19 | 日立金属株式会社 | Compound containing iron-based rare earth alloy powder and iron-based rare earth alloy powder, and permanent magnet using the same |
FR2828889B1 (en) * | 2001-08-24 | 2004-05-07 | Engelhard Clal Sas | ELECTROLYTIC BATH FOR THE ELECTROCHEMICAL DEPOSITION OF GOLD AND ITS ALLOYS |
EP1548525B2 (en) * | 2003-12-23 | 2017-08-16 | Rolex Sa | Ceramic element for watch case and method of manufacturing the same |
JP4566667B2 (en) * | 2004-01-16 | 2010-10-20 | キヤノン株式会社 | Plating solution, method of manufacturing structure using plating solution, and apparatus using plating solution |
JP2005214903A (en) * | 2004-01-30 | 2005-08-11 | Kawaguchiko Seimitsu Co Ltd | Method of manufacturing dial with index, and dial with index manufactured using the same |
SG127854A1 (en) | 2005-06-02 | 2006-12-29 | Rohm & Haas Elect Mat | Improved gold electrolytes |
CH710184B1 (en) * | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Process for obtaining a yellow gold alloy deposit by electroplating without the use of toxic metals or metalloids. |
-
2007
- 2007-09-21 CH CH01494/07A patent/CH710184B1/en unknown
-
2008
- 2008-09-11 AT AT08804009T patent/ATE499461T1/en not_active IP Right Cessation
- 2008-09-11 KR KR1020107008598A patent/KR101280675B1/en active IP Right Grant
- 2008-09-11 EP EP08804009A patent/EP2205778B1/en active Active
- 2008-09-11 US US12/678,984 patent/US10233555B2/en active Active
- 2008-09-11 DE DE602008005184T patent/DE602008005184D1/en active Active
- 2008-09-11 WO PCT/EP2008/062042 patent/WO2009037180A1/en active Application Filing
- 2008-09-11 JP JP2010525308A patent/JP5563462B2/en active Active
- 2008-09-11 CN CN200880107881XA patent/CN101815814B/en active Active
- 2008-09-11 IN IN2464CHN2014 patent/IN2014CN02464A/en unknown
- 2008-09-17 TW TW103113847A patent/TWI507571B/en active
- 2008-09-17 TW TW097135667A patent/TWI441959B/en active
-
2011
- 2011-02-24 HK HK11101836.3A patent/HK1147782A1/en unknown
-
2014
- 2014-04-03 US US14/244,071 patent/US9683303B2/en active Active
- 2014-06-12 JP JP2014121169A patent/JP5887381B2/en active Active
-
2019
- 2019-01-28 US US16/259,444 patent/US10619260B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
HK1147782A1 (en) | 2011-08-19 |
TWI507571B (en) | 2015-11-11 |
DE602008005184D1 (en) | 2011-04-07 |
JP2014194087A (en) | 2014-10-09 |
US20140299481A1 (en) | 2014-10-09 |
CN101815814B (en) | 2012-05-16 |
JP2010539335A (en) | 2010-12-16 |
JP5563462B2 (en) | 2014-07-30 |
TW201428143A (en) | 2014-07-16 |
US9683303B2 (en) | 2017-06-20 |
EP2205778A1 (en) | 2010-07-14 |
US20190153608A1 (en) | 2019-05-23 |
TWI441959B (en) | 2014-06-21 |
WO2009037180A1 (en) | 2009-03-26 |
JP5887381B2 (en) | 2016-03-16 |
US10233555B2 (en) | 2019-03-19 |
CN101815814A (en) | 2010-08-25 |
KR101280675B1 (en) | 2013-07-01 |
TW200930844A (en) | 2009-07-16 |
EP2205778B1 (en) | 2011-02-23 |
US10619260B2 (en) | 2020-04-14 |
KR20100075935A (en) | 2010-07-05 |
CH710184B1 (en) | 2016-03-31 |
ATE499461T1 (en) | 2011-03-15 |
US20100206739A1 (en) | 2010-08-19 |
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