GB8903818D0 - Electrolytic deposition of gold-containing alloys - Google Patents

Electrolytic deposition of gold-containing alloys

Info

Publication number
GB8903818D0
GB8903818D0 GB898903818A GB8903818A GB8903818D0 GB 8903818 D0 GB8903818 D0 GB 8903818D0 GB 898903818 A GB898903818 A GB 898903818A GB 8903818 A GB8903818 A GB 8903818A GB 8903818 D0 GB8903818 D0 GB 8903818D0
Authority
GB
United Kingdom
Prior art keywords
gold
bath
electrolytic deposition
containing alloys
cyanide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB898903818A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Catalysts LLC
Original Assignee
Engelhard Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Corp filed Critical Engelhard Corp
Priority to GB898903818A priority Critical patent/GB8903818D0/en
Publication of GB8903818D0 publication Critical patent/GB8903818D0/en
Priority to EP90301749A priority patent/EP0384679B1/en
Priority to DE69011549T priority patent/DE69011549T2/en
Priority to AT90301749T priority patent/ATE110124T1/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

A gold-copper alloy of good corrosion resistance is electrolytically deposited from a bath containing a cyanide compound of gold (e.g. KAu(CN)2), a cyanide compound of copper and tellurium or bismuth in the form of a soluble salt (e.g. sodium tellurite), the bath being substantially free of any other metal in an electrolytically depositable form. The bath generally also contains a cyanide salt (e.g. KCN) and may also contain a surface-active agent. Foreign metals, e.g. zinc, may be chelated or complexed to prevent deposition thereof.
GB898903818A 1989-02-20 1989-02-20 Electrolytic deposition of gold-containing alloys Pending GB8903818D0 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB898903818A GB8903818D0 (en) 1989-02-20 1989-02-20 Electrolytic deposition of gold-containing alloys
EP90301749A EP0384679B1 (en) 1989-02-20 1990-02-19 Electrolytic deposition of gold-containing alloys
DE69011549T DE69011549T2 (en) 1989-02-20 1990-02-19 Electroplating alloys containing gold.
AT90301749T ATE110124T1 (en) 1989-02-20 1990-02-19 ELECTRIC PLATING OF GOLD-CONTAINING ALLOYS.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898903818A GB8903818D0 (en) 1989-02-20 1989-02-20 Electrolytic deposition of gold-containing alloys

Publications (1)

Publication Number Publication Date
GB8903818D0 true GB8903818D0 (en) 1989-04-05

Family

ID=10651985

Family Applications (1)

Application Number Title Priority Date Filing Date
GB898903818A Pending GB8903818D0 (en) 1989-02-20 1989-02-20 Electrolytic deposition of gold-containing alloys

Country Status (4)

Country Link
EP (1) EP0384679B1 (en)
AT (1) ATE110124T1 (en)
DE (1) DE69011549T2 (en)
GB (1) GB8903818D0 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3170924A1 (en) 2007-04-19 2017-05-24 Enthone, Inc. Electrolyte and method for electrolytic deposition of gold-copper alloys
CH710184B1 (en) 2007-09-21 2016-03-31 Aliprandini Laboratoires G Process for obtaining a yellow gold alloy deposit by electroplating without the use of toxic metals or metalloids.
EP2312021B1 (en) 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Method for obtaining a deposit of a yellow gold alloy by galvanoplasty without using toxic metals
DE102011056318B3 (en) * 2011-12-13 2013-04-18 Doduco Gmbh Electrolytic bath for depositing a gold-copper alloy
IT201900001769A1 (en) * 2019-02-07 2020-08-07 Italfimet Srl Rose gold alloy, manufacturing process and use.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3319772A1 (en) * 1983-05-27 1984-11-29 Schering AG, 1000 Berlin und 4709 Bergkamen BATH FOR GALVANIC DEPOSITION OF GOLD ALLOYS
DE3505473C1 (en) * 1985-02-16 1986-06-05 Degussa Ag, 6000 Frankfurt Electroplating bath for gold-indium alloy coatings
CH662583A5 (en) * 1985-03-01 1987-10-15 Heinz Emmenegger GALVANIC BATH FOR THE ELECTROLYTIC DEPOSITION OF GOLD-COPPER-CADMIUM-ZINC ALLOYS.

Also Published As

Publication number Publication date
EP0384679A1 (en) 1990-08-29
DE69011549D1 (en) 1994-09-22
DE69011549T2 (en) 1995-04-06
ATE110124T1 (en) 1994-09-15
EP0384679B1 (en) 1994-08-17

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