ATE110124T1 - ELECTRIC PLATING OF GOLD-CONTAINING ALLOYS. - Google Patents

ELECTRIC PLATING OF GOLD-CONTAINING ALLOYS.

Info

Publication number
ATE110124T1
ATE110124T1 AT90301749T AT90301749T ATE110124T1 AT E110124 T1 ATE110124 T1 AT E110124T1 AT 90301749 T AT90301749 T AT 90301749T AT 90301749 T AT90301749 T AT 90301749T AT E110124 T1 ATE110124 T1 AT E110124T1
Authority
AT
Austria
Prior art keywords
gold
bath
containing alloys
electric plating
cyanide
Prior art date
Application number
AT90301749T
Other languages
German (de)
Inventor
Rebecca Victoria Green
Peter Wilkinson
Sally Ann Peacey
Original Assignee
Engelhard Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Corp filed Critical Engelhard Corp
Application granted granted Critical
Publication of ATE110124T1 publication Critical patent/ATE110124T1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

A gold-copper alloy of good corrosion resistance is electrolytically deposited from a bath containing a cyanide compound of gold (e.g. KAu(CN)2), a cyanide compound of copper and tellurium or bismuth in the form of a soluble salt (e.g. sodium tellurite), the bath being substantially free of any other metal in an electrolytically depositable form. The bath generally also contains a cyanide salt (e.g. KCN) and may also contain a surface-active agent. Foreign metals, e.g. zinc, may be chelated or complexed to prevent deposition thereof.
AT90301749T 1989-02-20 1990-02-19 ELECTRIC PLATING OF GOLD-CONTAINING ALLOYS. ATE110124T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898903818A GB8903818D0 (en) 1989-02-20 1989-02-20 Electrolytic deposition of gold-containing alloys

Publications (1)

Publication Number Publication Date
ATE110124T1 true ATE110124T1 (en) 1994-09-15

Family

ID=10651985

Family Applications (1)

Application Number Title Priority Date Filing Date
AT90301749T ATE110124T1 (en) 1989-02-20 1990-02-19 ELECTRIC PLATING OF GOLD-CONTAINING ALLOYS.

Country Status (4)

Country Link
EP (1) EP0384679B1 (en)
AT (1) ATE110124T1 (en)
DE (1) DE69011549T2 (en)
GB (1) GB8903818D0 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1983077B1 (en) 2007-04-19 2016-12-28 Enthone, Inc. Electrolyte and method for electrolytic deposition of gold-copper alloys
CH710184B1 (en) 2007-09-21 2016-03-31 Aliprandini Laboratoires G Process for obtaining a yellow gold alloy deposit by electroplating without the use of toxic metals or metalloids.
EP2312021B1 (en) 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Method for obtaining a deposit of a yellow gold alloy by galvanoplasty without using toxic metals
DE102011056318B3 (en) 2011-12-13 2013-04-18 Doduco Gmbh Electrolytic bath for depositing a gold-copper alloy
IT201900001769A1 (en) * 2019-02-07 2020-08-07 Italfimet Srl Rose gold alloy, manufacturing process and use.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3319772A1 (en) * 1983-05-27 1984-11-29 Schering AG, 1000 Berlin und 4709 Bergkamen BATH FOR GALVANIC DEPOSITION OF GOLD ALLOYS
DE3505473C1 (en) * 1985-02-16 1986-06-05 Degussa Ag, 6000 Frankfurt Electroplating bath for gold-indium alloy coatings
CH662583A5 (en) * 1985-03-01 1987-10-15 Heinz Emmenegger GALVANIC BATH FOR THE ELECTROLYTIC DEPOSITION OF GOLD-COPPER-CADMIUM-ZINC ALLOYS.

Also Published As

Publication number Publication date
EP0384679B1 (en) 1994-08-17
EP0384679A1 (en) 1990-08-29
GB8903818D0 (en) 1989-04-05
DE69011549T2 (en) 1995-04-06
DE69011549D1 (en) 1994-09-22

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties