ATE86313T1 - BATH FOR ELECTROPLATING A GOLD-COPPER-ZINC ALLOY. - Google Patents

BATH FOR ELECTROPLATING A GOLD-COPPER-ZINC ALLOY.

Info

Publication number
ATE86313T1
ATE86313T1 AT88307696T AT88307696T ATE86313T1 AT E86313 T1 ATE86313 T1 AT E86313T1 AT 88307696 T AT88307696 T AT 88307696T AT 88307696 T AT88307696 T AT 88307696T AT E86313 T1 ATE86313 T1 AT E86313T1
Authority
AT
Austria
Prior art keywords
bath
electroplating
gold
copper
zinc alloy
Prior art date
Application number
AT88307696T
Other languages
German (de)
Inventor
Heinz Emmenegger
Original Assignee
Engelhard Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Ltd filed Critical Engelhard Ltd
Application granted granted Critical
Publication of ATE86313T1 publication Critical patent/ATE86313T1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The bath for electrolytic deposition of an Au-Cu-Zn alloy contains cyanide complexes of Au, of Cu and of Zn, a surface-active agent and a soluble Te and/or Bi salt. It may also contain a non-cyanide organic Zn complex, and a conductive salt and/or an alkali metal or ammonium cyanide.
AT88307696T 1987-08-21 1988-08-19 BATH FOR ELECTROPLATING A GOLD-COPPER-ZINC ALLOY. ATE86313T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH322687 1987-08-21
EP88307696A EP0304315B1 (en) 1987-08-21 1988-08-19 Bath for electrolytic deposition of a gold-copper-zinc alloy

Publications (1)

Publication Number Publication Date
ATE86313T1 true ATE86313T1 (en) 1993-03-15

Family

ID=4251367

Family Applications (1)

Application Number Title Priority Date Filing Date
AT88307696T ATE86313T1 (en) 1987-08-21 1988-08-19 BATH FOR ELECTROPLATING A GOLD-COPPER-ZINC ALLOY.

Country Status (4)

Country Link
US (1) US4980035A (en)
EP (1) EP0304315B1 (en)
AT (1) ATE86313T1 (en)
DE (1) DE3878783T2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5085744A (en) * 1990-11-06 1992-02-04 Learonal, Inc. Electroplated gold-copper-zinc alloys
DE19745602C1 (en) * 1997-10-08 1999-07-15 Atotech Deutschland Gmbh Method and solution for the production of gold layers
FR2849532B1 (en) * 2002-12-26 2005-08-19 Electricite De France METHOD FOR MANUFACTURING THIN FILM I-III-VI2 COMPOUND, PROMOTING THE INCORPORATION OF ELEMENTS III
JP4272951B2 (en) * 2003-08-06 2009-06-03 田中貴金属工業株式会社 Metal colloid and functional material produced by the metal colloid
US7431817B2 (en) * 2004-05-11 2008-10-07 Technic, Inc. Electroplating solution for gold-tin eutectic alloy
US20090104463A1 (en) 2006-06-02 2009-04-23 Rohm And Haas Electronic Materials Llc Gold alloy electrolytes
SG127854A1 (en) 2005-06-02 2006-12-29 Rohm & Haas Elect Mat Improved gold electrolytes
CH714243B1 (en) * 2006-10-03 2019-04-15 Swatch Group Res & Dev Ltd Electroforming process and part or layer obtained by this method.
EP1983077B1 (en) 2007-04-19 2016-12-28 Enthone, Inc. Electrolyte and method for electrolytic deposition of gold-copper alloys
CH710184B1 (en) * 2007-09-21 2016-03-31 Aliprandini Laboratoires G Process for obtaining a yellow gold alloy deposit by electroplating without the use of toxic metals or metalloids.
EP2312021B1 (en) 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Method for obtaining a deposit of a yellow gold alloy by galvanoplasty without using toxic metals
EP2505691B1 (en) * 2011-03-31 2014-03-12 The Swatch Group Research and Development Ltd. Process for obtaining a gold alloy deposit of 18 carat 3N
DE102012004348B4 (en) 2012-03-07 2014-01-09 Umicore Galvanotechnik Gmbh Use of organic thiourea compounds to increase the galvanic deposition rate of gold and gold alloys
IT201900001769A1 (en) * 2019-02-07 2020-08-07 Italfimet Srl Rose gold alloy, manufacturing process and use.

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH615464A5 (en) * 1976-06-01 1980-01-31 Systemes Traitements Surfaces Special compositions and particular additives for gold electrolysis baths and their use
DE3020765A1 (en) * 1980-05-31 1981-12-10 Degussa Ag, 6000 Frankfurt ALKALINE BATH FOR GALVANIC DEPOSITION OF LOW-CARAINE PINK TO YELLOW-COLORED GOLD ALLOY LAYERS
DE3345795A1 (en) * 1983-12-17 1985-07-04 LPW-Chemie GmbH, 4040 Neuss ELECTROLYTE FOR GALVANIC DEPOSITION OF LOW-CARAE GOLD-COPPER-ZINC ALLOYS
CH662583A5 (en) * 1985-03-01 1987-10-15 Heinz Emmenegger GALVANIC BATH FOR THE ELECTROLYTIC DEPOSITION OF GOLD-COPPER-CADMIUM-ZINC ALLOYS.

Also Published As

Publication number Publication date
US4980035A (en) 1990-12-25
EP0304315B1 (en) 1993-03-03
EP0304315A1 (en) 1989-02-22
DE3878783T2 (en) 1993-07-22
DE3878783D1 (en) 1993-04-08

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Legal Events

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