CA2093924A1 - Acid bath for copper plating - Google Patents

Acid bath for copper plating

Info

Publication number
CA2093924A1
CA2093924A1 CA002093924A CA2093924A CA2093924A1 CA 2093924 A1 CA2093924 A1 CA 2093924A1 CA 002093924 A CA002093924 A CA 002093924A CA 2093924 A CA2093924 A CA 2093924A CA 2093924 A1 CA2093924 A1 CA 2093924A1
Authority
CA
Canada
Prior art keywords
copper plating
acid bath
bath
copper
invention concerns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002093924A
Other languages
French (fr)
Other versions
CA2093924C (en
Inventor
Wolfgang Dahms
Horst Westphal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2093924A1 publication Critical patent/CA2093924A1/en
Application granted granted Critical
Publication of CA2093924C publication Critical patent/CA2093924C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

The invention concerns an aqueous acid copper-electroplating bath and the use of the bath for the electrolytic deposition of copper.
CA002093924A 1990-10-13 1991-10-11 Acid bath for copper plating Expired - Lifetime CA2093924C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DEP4032864.3 1990-10-13
DE4032864A DE4032864A1 (en) 1990-10-13 1990-10-13 ACIDIC BATH FOR THE GALVANIC DEPOSITION OF COPPER COVERS AND METHODS USING THIS COMBINATION
PCT/DE1991/000811 WO1992007116A1 (en) 1990-10-13 1991-10-11 Acid bath for copper plating, and a process using a bath of this type for this purpose

Publications (2)

Publication Number Publication Date
CA2093924A1 true CA2093924A1 (en) 1992-04-14
CA2093924C CA2093924C (en) 2002-02-05

Family

ID=6416407

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002093924A Expired - Lifetime CA2093924C (en) 1990-10-13 1991-10-11 Acid bath for copper plating

Country Status (7)

Country Link
EP (1) EP0554275B1 (en)
JP (1) JPH06501986A (en)
AT (1) ATE115651T1 (en)
CA (1) CA2093924C (en)
DE (2) DE4032864A1 (en)
ES (1) ES2066477T3 (en)
WO (1) WO1992007116A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11035051B2 (en) 2016-08-15 2021-06-15 Atotech Deutschland Gmbh Acidic aqueous composition for electrolytic copper plating

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10261852B3 (en) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
DE10337669B4 (en) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Aqueous, acid solution and process for the electrodeposition of copper coatings and use of the solution
DE102004041701A1 (en) * 2004-08-28 2006-03-02 Enthone Inc., West Haven Process for the electrolytic deposition of metals
US7282602B2 (en) * 2004-09-21 2007-10-16 Bionumerik Pharmaceuticals, Inc. Medicinal disulfide salts
JP5659411B2 (en) * 2006-01-27 2015-01-28 奥野製薬工業株式会社 Additive for electrolytic copper plating solution using phosphorous copper as anode, electrolytic copper plating solution and electrolytic copper plating method
DE102014208733A1 (en) 2014-05-09 2015-11-12 Dr. Hesse Gmbh & Cie Kg Process for the electrolytic deposition of copper from water-based electrolytes

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL291575A (en) * 1962-04-16
DE1246347B (en) * 1966-03-08 1967-08-03 Schering Ag Acid galvanic copper bath
DE2039831C3 (en) * 1970-06-06 1979-09-06 Schering Ag, 1000 Berlin Und 4619 Bergkamen Acid bath for the galvanic deposition of shiny copper coatings
IT1046971B (en) * 1975-03-11 1980-09-10 Oxy Metal Industries Corp Baths for electrodeposition of copper - contg soluble prod prepd by reacting alkoxylated polyalkylene-imine with alkylating agent
DE2721985A1 (en) * 1977-05-14 1978-11-16 Bayer Ag PROCESS FOR THE PRODUCTION OF POLYISOCYANATE POLYADDITION PRODUCTS CONTAINING URETHANE AND / OR UREA GROUPS
DE2746938C2 (en) * 1977-10-17 1987-04-09 Schering AG, 1000 Berlin und 4709 Bergkamen Aqueous acid bath for the galvanic deposition of shiny and crack-free copper coatings and use of this bath
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4374709A (en) * 1980-05-01 1983-02-22 Occidental Chemical Corporation Process for plating polymeric substrates
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
FR2510145B1 (en) * 1981-07-24 1986-02-07 Rhone Poulenc Spec Chim ADDITIVE FOR AN ACID ELECTROLYTIC COPPER BATH, ITS PREPARATION METHOD AND ITS APPLICATION TO COPPER PRINTED CIRCUITS
WO1984001393A1 (en) * 1982-09-30 1984-04-12 Learonal Inc Electrolytic copper plating solutions
DE3402999A1 (en) * 1984-01-28 1985-08-01 Skw Trostberg Ag, 8223 Trostberg Fertiliser solutions
DE3721985A1 (en) * 1987-06-30 1989-01-12 Schering Ag AQUEOUS ACID BATH FOR GALVANIC DEPOSITION OF GLOSSY AND LEVELED COPPER COATINGS

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11035051B2 (en) 2016-08-15 2021-06-15 Atotech Deutschland Gmbh Acidic aqueous composition for electrolytic copper plating
US12071702B2 (en) 2016-08-15 2024-08-27 Atotech Deutschland Gmbh Acidic aqueous composition for electrolytic copper plating

Also Published As

Publication number Publication date
DE4032864A1 (en) 1992-04-16
DE59103933D1 (en) 1995-01-26
CA2093924C (en) 2002-02-05
ES2066477T3 (en) 1995-03-01
JPH06501986A (en) 1994-03-03
EP0554275A1 (en) 1993-08-11
ATE115651T1 (en) 1994-12-15
WO1992007116A1 (en) 1992-04-30
EP0554275B1 (en) 1994-12-14
DE4032864C2 (en) 1993-01-07

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed
MKEC Expiry (correction)

Effective date: 20121202