EP0636713A3 - Alcaline cyanide baths for electroplating copper-tin alloys coatings. - Google Patents
Alcaline cyanide baths for electroplating copper-tin alloys coatings. Download PDFInfo
- Publication number
- EP0636713A3 EP0636713A3 EP94109336A EP94109336A EP0636713A3 EP 0636713 A3 EP0636713 A3 EP 0636713A3 EP 94109336 A EP94109336 A EP 94109336A EP 94109336 A EP94109336 A EP 94109336A EP 0636713 A3 EP0636713 A3 EP 0636713A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- alcaline
- tin alloys
- electroplating copper
- cyanide baths
- coatings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 title 1
- 229910001128 Sn alloy Inorganic materials 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 title 1
- 238000009713 electroplating Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4324995A DE4324995C2 (en) | 1993-07-26 | 1993-07-26 | Cyanide-alkaline baths for the galvanic deposition of copper-tin alloy coatings |
DE4324995 | 1993-07-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0636713A2 EP0636713A2 (en) | 1995-02-01 |
EP0636713A3 true EP0636713A3 (en) | 1995-07-26 |
Family
ID=6493699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP94109336A Withdrawn EP0636713A3 (en) | 1993-07-26 | 1994-06-17 | Alcaline cyanide baths for electroplating copper-tin alloys coatings. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5534129A (en) |
EP (1) | EP0636713A3 (en) |
JP (1) | JP3305504B2 (en) |
BR (1) | BR9402931A (en) |
DE (1) | DE4324995C2 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3313277B2 (en) * | 1995-09-22 | 2002-08-12 | 古河サーキットフォイル株式会社 | Electrodeposited copper foil for fine pattern and its manufacturing method |
EP1091023A3 (en) * | 1999-10-08 | 2003-05-14 | Shipley Company LLC | Alloy composition and plating method |
JP3455712B2 (en) * | 2000-04-14 | 2003-10-14 | 日本ニュークローム株式会社 | Pyrophosphate bath for copper-tin alloy plating |
DE502007002479D1 (en) * | 2007-02-14 | 2010-02-11 | Umicore Galvanotechnik Gmbh | Copper-tin electrolyte and process for the deposition of bronze layers |
EP2085502A1 (en) * | 2008-01-29 | 2009-08-05 | Enthone, Incorporated | Electrolyte composition and method for the deposition of a tin-zinc alloy |
ATE486157T1 (en) * | 2008-05-08 | 2010-11-15 | Umicore Galvanotechnik Gmbh | MODIFIED COPPER-TIN ELECTROLYTE AND METHOD FOR DEPOSITING BRONZE LAYERS |
DE102008032398A1 (en) | 2008-07-10 | 2010-01-14 | Umicore Galvanotechnik Gmbh | Improved copper-tin electrolyte and process for depositing bronze layers |
DE102008050135B4 (en) | 2008-10-04 | 2010-08-05 | Umicore Galvanotechnik Gmbh | Process for depositing platinum rhodium layers with improved brightness |
DE102009041250B4 (en) | 2009-09-11 | 2011-09-01 | Umicore Galvanotechnik Gmbh | Process for the electrolytic copper plating of zinc die casting with reduced tendency to blister |
EP2620529B1 (en) * | 2012-01-25 | 2014-04-30 | Atotech Deutschland GmbH | Method for producing matt copper deposits |
CN103422079B (en) * | 2012-05-22 | 2016-04-13 | 比亚迪股份有限公司 | A kind of chemical bronze plating liquid and preparation method thereof |
JP6093143B2 (en) * | 2012-10-19 | 2017-03-08 | 株式会社シミズ | Non-cyanide copper-tin alloy plating bath |
AT514427B1 (en) | 2013-07-05 | 2015-01-15 | W Garhöfer Ges M B H Ing | Electrolyte bath and thus available objects or articles |
AT514818B1 (en) | 2013-09-18 | 2015-10-15 | W Garhöfer Ges M B H Ing | Deposition of Cu, Sn, Zn coatings on metallic substrates |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2916423A (en) * | 1957-06-19 | 1959-12-08 | Metal & Thermit Corp | Electrodeposition of copper and copper alloys |
JPS58133391A (en) * | 1982-02-01 | 1983-08-09 | Oosakashi | Electroplating bath for bright copper-nickel alloy |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE496261A (en) * | 1949-06-11 | |||
BE556462A (en) * | 1956-06-15 | |||
DE3339541C2 (en) * | 1983-11-02 | 1986-08-07 | Degussa Ag, 6000 Frankfurt | Alkaline-cyanide bath for the galvanic deposition of copper-tin alloy coatings |
GB8822641D0 (en) * | 1988-09-27 | 1988-11-02 | Int Paint Plc | Improvements related to coatings |
-
1993
- 1993-07-26 DE DE4324995A patent/DE4324995C2/en not_active Expired - Fee Related
-
1994
- 1994-06-17 EP EP94109336A patent/EP0636713A3/en not_active Withdrawn
- 1994-07-20 US US08/277,631 patent/US5534129A/en not_active Expired - Lifetime
- 1994-07-25 BR BR9402931A patent/BR9402931A/en not_active IP Right Cessation
- 1994-07-26 JP JP17424894A patent/JP3305504B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2916423A (en) * | 1957-06-19 | 1959-12-08 | Metal & Thermit Corp | Electrodeposition of copper and copper alloys |
JPS58133391A (en) * | 1982-02-01 | 1983-08-09 | Oosakashi | Electroplating bath for bright copper-nickel alloy |
Non-Patent Citations (1)
Title |
---|
CHEMICAL ABSTRACTS, vol. 100, no. 12, 19 March 1984, Columbus, Ohio, US; abstract no. 93503n, "bath for bright electroplating of copper-nickel alloy" page 498; * |
Also Published As
Publication number | Publication date |
---|---|
JP3305504B2 (en) | 2002-07-22 |
DE4324995C2 (en) | 1995-12-21 |
US5534129A (en) | 1996-07-09 |
EP0636713A2 (en) | 1995-02-01 |
JPH0754187A (en) | 1995-02-28 |
DE4324995A1 (en) | 1995-02-02 |
BR9402931A (en) | 1995-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 19940617 |
|
AK | Designated contracting states |
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PUAL | Search report despatched |
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RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: DEGUSSA AKTIENGESELLSCHAFT |
|
17Q | First examination report despatched |
Effective date: 19960315 |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Withdrawal date: 19970114 |