EP0636713A3 - Alcaline cyanide baths for electroplating copper-tin alloys coatings. - Google Patents

Alcaline cyanide baths for electroplating copper-tin alloys coatings. Download PDF

Info

Publication number
EP0636713A3
EP0636713A3 EP94109336A EP94109336A EP0636713A3 EP 0636713 A3 EP0636713 A3 EP 0636713A3 EP 94109336 A EP94109336 A EP 94109336A EP 94109336 A EP94109336 A EP 94109336A EP 0636713 A3 EP0636713 A3 EP 0636713A3
Authority
EP
European Patent Office
Prior art keywords
alcaline
tin alloys
electroplating copper
cyanide baths
coatings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP94109336A
Other languages
German (de)
French (fr)
Other versions
EP0636713A2 (en
Inventor
Gerd Hoffacker
Hasso Kaiser
Klaus Reissmueller
Guenter Wirth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
Demetron GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa GmbH, Demetron GmbH filed Critical Degussa GmbH
Publication of EP0636713A2 publication Critical patent/EP0636713A2/en
Publication of EP0636713A3 publication Critical patent/EP0636713A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP94109336A 1993-07-26 1994-06-17 Alcaline cyanide baths for electroplating copper-tin alloys coatings. Withdrawn EP0636713A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4324995A DE4324995C2 (en) 1993-07-26 1993-07-26 Cyanide-alkaline baths for the galvanic deposition of copper-tin alloy coatings
DE4324995 1993-07-26

Publications (2)

Publication Number Publication Date
EP0636713A2 EP0636713A2 (en) 1995-02-01
EP0636713A3 true EP0636713A3 (en) 1995-07-26

Family

ID=6493699

Family Applications (1)

Application Number Title Priority Date Filing Date
EP94109336A Withdrawn EP0636713A3 (en) 1993-07-26 1994-06-17 Alcaline cyanide baths for electroplating copper-tin alloys coatings.

Country Status (5)

Country Link
US (1) US5534129A (en)
EP (1) EP0636713A3 (en)
JP (1) JP3305504B2 (en)
BR (1) BR9402931A (en)
DE (1) DE4324995C2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3313277B2 (en) * 1995-09-22 2002-08-12 古河サーキットフォイル株式会社 Electrodeposited copper foil for fine pattern and its manufacturing method
EP1091023A3 (en) * 1999-10-08 2003-05-14 Shipley Company LLC Alloy composition and plating method
JP3455712B2 (en) * 2000-04-14 2003-10-14 日本ニュークローム株式会社 Pyrophosphate bath for copper-tin alloy plating
DE502007002479D1 (en) * 2007-02-14 2010-02-11 Umicore Galvanotechnik Gmbh Copper-tin electrolyte and process for the deposition of bronze layers
EP2085502A1 (en) * 2008-01-29 2009-08-05 Enthone, Incorporated Electrolyte composition and method for the deposition of a tin-zinc alloy
ATE486157T1 (en) * 2008-05-08 2010-11-15 Umicore Galvanotechnik Gmbh MODIFIED COPPER-TIN ELECTROLYTE AND METHOD FOR DEPOSITING BRONZE LAYERS
DE102008032398A1 (en) 2008-07-10 2010-01-14 Umicore Galvanotechnik Gmbh Improved copper-tin electrolyte and process for depositing bronze layers
DE102008050135B4 (en) 2008-10-04 2010-08-05 Umicore Galvanotechnik Gmbh Process for depositing platinum rhodium layers with improved brightness
DE102009041250B4 (en) 2009-09-11 2011-09-01 Umicore Galvanotechnik Gmbh Process for the electrolytic copper plating of zinc die casting with reduced tendency to blister
EP2620529B1 (en) * 2012-01-25 2014-04-30 Atotech Deutschland GmbH Method for producing matt copper deposits
CN103422079B (en) * 2012-05-22 2016-04-13 比亚迪股份有限公司 A kind of chemical bronze plating liquid and preparation method thereof
JP6093143B2 (en) * 2012-10-19 2017-03-08 株式会社シミズ Non-cyanide copper-tin alloy plating bath
AT514427B1 (en) 2013-07-05 2015-01-15 W Garhöfer Ges M B H Ing Electrolyte bath and thus available objects or articles
AT514818B1 (en) 2013-09-18 2015-10-15 W Garhöfer Ges M B H Ing Deposition of Cu, Sn, Zn coatings on metallic substrates

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2916423A (en) * 1957-06-19 1959-12-08 Metal & Thermit Corp Electrodeposition of copper and copper alloys
JPS58133391A (en) * 1982-02-01 1983-08-09 Oosakashi Electroplating bath for bright copper-nickel alloy

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE496261A (en) * 1949-06-11
BE556462A (en) * 1956-06-15
DE3339541C2 (en) * 1983-11-02 1986-08-07 Degussa Ag, 6000 Frankfurt Alkaline-cyanide bath for the galvanic deposition of copper-tin alloy coatings
GB8822641D0 (en) * 1988-09-27 1988-11-02 Int Paint Plc Improvements related to coatings

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2916423A (en) * 1957-06-19 1959-12-08 Metal & Thermit Corp Electrodeposition of copper and copper alloys
JPS58133391A (en) * 1982-02-01 1983-08-09 Oosakashi Electroplating bath for bright copper-nickel alloy

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CHEMICAL ABSTRACTS, vol. 100, no. 12, 19 March 1984, Columbus, Ohio, US; abstract no. 93503n, "bath for bright electroplating of copper-nickel alloy" page 498; *

Also Published As

Publication number Publication date
JP3305504B2 (en) 2002-07-22
DE4324995C2 (en) 1995-12-21
US5534129A (en) 1996-07-09
EP0636713A2 (en) 1995-02-01
JPH0754187A (en) 1995-02-28
DE4324995A1 (en) 1995-02-02
BR9402931A (en) 1995-04-11

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