ATE86313T1 - Bad fuer das elektroplattieren einer gold-kupfer- zink-legierung. - Google Patents
Bad fuer das elektroplattieren einer gold-kupfer- zink-legierung.Info
- Publication number
- ATE86313T1 ATE86313T1 AT88307696T AT88307696T ATE86313T1 AT E86313 T1 ATE86313 T1 AT E86313T1 AT 88307696 T AT88307696 T AT 88307696T AT 88307696 T AT88307696 T AT 88307696T AT E86313 T1 ATE86313 T1 AT E86313T1
- Authority
- AT
- Austria
- Prior art keywords
- bath
- electroplating
- gold
- copper
- zinc alloy
- Prior art date
Links
- 229910001297 Zn alloy Inorganic materials 0.000 title 1
- SXKZZFLSYPUIAN-UHFFFAOYSA-N [Cu].[Zn].[Au] Chemical compound [Cu].[Zn].[Au] SXKZZFLSYPUIAN-UHFFFAOYSA-N 0.000 title 1
- 238000009713 electroplating Methods 0.000 title 1
- 150000003839 salts Chemical class 0.000 abstract 2
- 229910017518 Cu Zn Inorganic materials 0.000 abstract 1
- 229910017752 Cu-Zn Inorganic materials 0.000 abstract 1
- 229910017943 Cu—Zn Inorganic materials 0.000 abstract 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract 1
- 229910052783 alkali metal Inorganic materials 0.000 abstract 1
- 150000001340 alkali metals Chemical class 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- ICAIHGOJRDCMHE-UHFFFAOYSA-O ammonium cyanide Chemical compound [NH4+].N#[C-] ICAIHGOJRDCMHE-UHFFFAOYSA-O 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 150000002825 nitriles Chemical class 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH322687 | 1987-08-21 | ||
| EP88307696A EP0304315B1 (de) | 1987-08-21 | 1988-08-19 | Bad für das Elektroplattieren einer Gold-Kupfer-Zink-Legierung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE86313T1 true ATE86313T1 (de) | 1993-03-15 |
Family
ID=4251367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT88307696T ATE86313T1 (de) | 1987-08-21 | 1988-08-19 | Bad fuer das elektroplattieren einer gold-kupfer- zink-legierung. |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4980035A (de) |
| EP (1) | EP0304315B1 (de) |
| AT (1) | ATE86313T1 (de) |
| DE (1) | DE3878783T2 (de) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5085744A (en) * | 1990-11-06 | 1992-02-04 | Learonal, Inc. | Electroplated gold-copper-zinc alloys |
| DE19745602C1 (de) * | 1997-10-08 | 1999-07-15 | Atotech Deutschland Gmbh | Verfahren und Lösung zur Herstellung von Goldschichten |
| FR2849532B1 (fr) * | 2002-12-26 | 2005-08-19 | Electricite De France | Procede de fabrication d'un compose i-iii-vi2 en couches minces, favorisant l'incorporation d'elements iii |
| JP4272951B2 (ja) * | 2003-08-06 | 2009-06-03 | 田中貴金属工業株式会社 | 金属コロイド及び該金属コロイドにより製造される機能材料 |
| WO2005110287A2 (en) * | 2004-05-11 | 2005-11-24 | Technic, Inc. | Electroplating solution for gold-tin eutectic alloy |
| SG127854A1 (en) | 2005-06-02 | 2006-12-29 | Rohm & Haas Elect Mat | Improved gold electrolytes |
| US20090104463A1 (en) | 2006-06-02 | 2009-04-23 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
| CH714243B1 (fr) * | 2006-10-03 | 2019-04-15 | Swatch Group Res & Dev Ltd | Procédé d'électroformage et pièce ou couche obtenue par ce procédé. |
| EP3170924A1 (de) | 2007-04-19 | 2017-05-24 | Enthone, Inc. | Elektrolyt und verfahren zur elektrolytischen ablagerung von gold-kupfer-legierungen |
| CH710184B1 (fr) * | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques. |
| EP2312021B1 (de) | 2009-10-15 | 2020-03-18 | The Swatch Group Research and Development Ltd. | Verfahren zum erhalten einer gelben goldlegierungsablagerung durch galvanoplastik ohne verwendung von giftigen metallen |
| EP2505691B1 (de) * | 2011-03-31 | 2014-03-12 | The Swatch Group Research and Development Ltd. | Verfahren zur Herhaltung einer Beschichtung aus einer Goldlegierung 18 Karat 3N |
| DE102012004348B4 (de) | 2012-03-07 | 2014-01-09 | Umicore Galvanotechnik Gmbh | Verwendung von organischen Thioharnstoffverbindungen zur Erhöhung der galvanischen Abscheiderate von Gold und Goldlegierungen |
| IT201900001769A1 (it) * | 2019-02-07 | 2020-08-07 | Italfimet Srl | Lega d'oro rosa, procedimento di realizzazione ed uso. |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH615464A5 (en) * | 1976-06-01 | 1980-01-31 | Systemes Traitements Surfaces | Special compositions and particular additives for gold electrolysis baths and their use |
| DE3020765A1 (de) * | 1980-05-31 | 1981-12-10 | Degussa Ag, 6000 Frankfurt | Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten |
| DE3345795A1 (de) * | 1983-12-17 | 1985-07-04 | LPW-Chemie GmbH, 4040 Neuss | Elektrolyt zur galvanischen abscheidung niedrigkaraetiger gold-kupfer-zink-legierungen |
| CH662583A5 (fr) * | 1985-03-01 | 1987-10-15 | Heinz Emmenegger | Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc. |
-
1988
- 1988-08-19 EP EP88307696A patent/EP0304315B1/de not_active Expired - Lifetime
- 1988-08-19 DE DE8888307696T patent/DE3878783T2/de not_active Expired - Fee Related
- 1988-08-19 AT AT88307696T patent/ATE86313T1/de not_active IP Right Cessation
-
1989
- 1989-07-17 US US07/382,011 patent/US4980035A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US4980035A (en) | 1990-12-25 |
| DE3878783T2 (de) | 1993-07-22 |
| DE3878783D1 (de) | 1993-04-08 |
| EP0304315A1 (de) | 1989-02-22 |
| EP0304315B1 (de) | 1993-03-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |