DE69011549D1 - Elektroplattierung von Gold enthaltenden Legierungen. - Google Patents

Elektroplattierung von Gold enthaltenden Legierungen.

Info

Publication number
DE69011549D1
DE69011549D1 DE69011549T DE69011549T DE69011549D1 DE 69011549 D1 DE69011549 D1 DE 69011549D1 DE 69011549 T DE69011549 T DE 69011549T DE 69011549 T DE69011549 T DE 69011549T DE 69011549 D1 DE69011549 D1 DE 69011549D1
Authority
DE
Germany
Prior art keywords
bath
gold
alloys containing
containing gold
cyanide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69011549T
Other languages
English (en)
Other versions
DE69011549T2 (de
Inventor
Rebecca Victoria Green
Peter Wilkinson
Sally Ann Peacey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Catalysts LLC
Original Assignee
Engelhard Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Corp filed Critical Engelhard Corp
Publication of DE69011549D1 publication Critical patent/DE69011549D1/de
Application granted granted Critical
Publication of DE69011549T2 publication Critical patent/DE69011549T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
DE69011549T 1989-02-20 1990-02-19 Elektroplattierung von Gold enthaltenden Legierungen. Expired - Fee Related DE69011549T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898903818A GB8903818D0 (en) 1989-02-20 1989-02-20 Electrolytic deposition of gold-containing alloys

Publications (2)

Publication Number Publication Date
DE69011549D1 true DE69011549D1 (de) 1994-09-22
DE69011549T2 DE69011549T2 (de) 1995-04-06

Family

ID=10651985

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69011549T Expired - Fee Related DE69011549T2 (de) 1989-02-20 1990-02-19 Elektroplattierung von Gold enthaltenden Legierungen.

Country Status (4)

Country Link
EP (1) EP0384679B1 (de)
AT (1) ATE110124T1 (de)
DE (1) DE69011549T2 (de)
GB (1) GB8903818D0 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3170924A1 (de) 2007-04-19 2017-05-24 Enthone, Inc. Elektrolyt und verfahren zur elektrolytischen ablagerung von gold-kupfer-legierungen
CH710184B1 (fr) 2007-09-21 2016-03-31 Aliprandini Laboratoires G Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.
EP2312021B1 (de) 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Verfahren zum erhalten einer gelben goldlegierungsablagerung durch galvanoplastik ohne verwendung von giftigen metallen
DE102011056318B3 (de) 2011-12-13 2013-04-18 Doduco Gmbh Elektrolytisches Bad zum Abscheiden einer Goldkupferlegierung
IT201900001769A1 (it) * 2019-02-07 2020-08-07 Italfimet Srl Lega d'oro rosa, procedimento di realizzazione ed uso.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3319772A1 (de) * 1983-05-27 1984-11-29 Schering AG, 1000 Berlin und 4709 Bergkamen Bad fuer die galvanische abscheidung von goldlegierungen
DE3505473C1 (de) * 1985-02-16 1986-06-05 Degussa Ag, 6000 Frankfurt Bad zur galvanischen Abscheidung von Gold-Indium-Legierungsueberzuegen
CH662583A5 (fr) * 1985-03-01 1987-10-15 Heinz Emmenegger Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc.

Also Published As

Publication number Publication date
GB8903818D0 (en) 1989-04-05
ATE110124T1 (de) 1994-09-15
EP0384679B1 (de) 1994-08-17
DE69011549T2 (de) 1995-04-06
EP0384679A1 (de) 1990-08-29

Similar Documents

Publication Publication Date Title
US5514261A (en) Electroplating bath for the electrodeposition of silver-tin alloys
US3980531A (en) Bath and process for the electrolytic separation of rare metal alloys
ES8308366A1 (es) "un procedimiento para obtener depositos electroliticos brillantes y uniformes de aleacion de zinc-niquel".
ATE86313T1 (de) Bad fuer das elektroplattieren einer gold-kupfer- zink-legierung.
DE69011549D1 (de) Elektroplattierung von Gold enthaltenden Legierungen.
Natorski Zinc and Zinc Alloy Plating in the 1990 s
US4048023A (en) Electrodeposition of gold-palladium alloys
HK102891A (en) Process for the deposition of low carat brilliant gold-silver alloy coatings
IE56353B1 (en) Bath for the galvanic deposition of gold alloys
FR2398121A1 (fr) Brillanteur d'organophosphonate de cobalt et de nickel pour le depot electrolytique d'or brillant ou d'alliage d'or
JPS57140891A (en) Pretreating solution for silver plating
JPS5747891A (en) Gold-palladium alloy plating bath
US4566953A (en) Pulse plating of nickel-antimony films
JPH0684553B2 (ja) 金/スズ合金被膜の電着浴
SE7605289L (sv) Nickel-jern-beleggning
Nobel et al. Cyanide-free plating solutions for monovalent metals
CA1272160A (en) Gold alloy plating bath and process
GB1080291A (en) Plating metal
ES2002580A6 (es) Un electrolito acido acuoso adecuado para electrodepositar aleaciones de cinc en un sustrato conductor
Nobel et al. Bath and Process for Plating Lead and Lead/Tin Alloys
Schulze-Berge Palladium--Nickel as a Gold Alternative: Development of a Palladium--Nickel Electrolyte
Okubo et al. High-Speed Silver Plating
Green et al. Electrolytic Deposition of Gold Containing Alloys
GB1181964A (en) Improvements in or relating to the Electrodeposition of Copper
JPS6070197A (ja) 銀合金めつき法

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee