GB1181964A - Improvements in or relating to the Electrodeposition of Copper - Google Patents
Improvements in or relating to the Electrodeposition of CopperInfo
- Publication number
- GB1181964A GB1181964A GB2151866A GB2151866A GB1181964A GB 1181964 A GB1181964 A GB 1181964A GB 2151866 A GB2151866 A GB 2151866A GB 2151866 A GB2151866 A GB 2151866A GB 1181964 A GB1181964 A GB 1181964A
- Authority
- GB
- United Kingdom
- Prior art keywords
- bath
- chloride
- cuprous
- thiourea
- electro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
1,181,964. Electro-deposition of copper. ENGLISH ELECTRIC CO. Ltd. April 13, 1967 [May 14, 1966], No.21518/66. Heading C7B. Copper is electro-deposited from an acid bath which is sufficiently stable to prevent the formation of immersion deposits on iron, iron alloys and other metals of similar electro-chemical character, the bath including Cu<SP>++ -</SP> thiourea complexions formed by rendering a cuprous salt soluble with thiourea. Preferably the acid is hydrochloric acid at sufficient strength to pickle the metal to be plated, e. g. mild steel but below 3M and the cuprous salt is the chloride. Typically the bath comprises not less than 3 moles of urea per mole of cuprous chloride, and the mole ratio of hydrochloric acid to the sum of urea and cuprous chloride is between 0 and 2, and plating is effected at a bath temperature of 45 to 60‹ C. The bath may also contain potassium, calcium, or ammonium chloride. As an alternative cuprous sulphate may be used instead of the chloride and ethylene thiourea used in place of thiourea.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2151866A GB1181964A (en) | 1966-05-14 | 1966-05-14 | Improvements in or relating to the Electrodeposition of Copper |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2151866A GB1181964A (en) | 1966-05-14 | 1966-05-14 | Improvements in or relating to the Electrodeposition of Copper |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1181964A true GB1181964A (en) | 1970-02-18 |
Family
ID=10164276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2151866A Expired GB1181964A (en) | 1966-05-14 | 1966-05-14 | Improvements in or relating to the Electrodeposition of Copper |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1181964A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2224748A (en) * | 1988-11-01 | 1990-05-16 | Metal Leve Sa | Manufacture of sliding layer of plain bearings using a single electroplating bath |
CN104120463A (en) * | 2014-06-25 | 2014-10-29 | 济南大学 | Cyanide-free cuprous copper-plating surface modification method for steel matrix |
CN104120468A (en) * | 2014-06-25 | 2014-10-29 | 济南大学 | Cyanide-free cuprous copper-zinc alloy electroplating solution |
-
1966
- 1966-05-14 GB GB2151866A patent/GB1181964A/en not_active Expired
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2224748A (en) * | 1988-11-01 | 1990-05-16 | Metal Leve Sa | Manufacture of sliding layer of plain bearings using a single electroplating bath |
US5156729A (en) * | 1988-11-01 | 1992-10-20 | Metal Leve, S.A. | Method of making a plain bearing sliding layer |
GB2224748B (en) * | 1988-11-01 | 1993-06-30 | Metal Leve Sa | Method of making a plain bearing sliding layer |
CN104120463A (en) * | 2014-06-25 | 2014-10-29 | 济南大学 | Cyanide-free cuprous copper-plating surface modification method for steel matrix |
CN104120468A (en) * | 2014-06-25 | 2014-10-29 | 济南大学 | Cyanide-free cuprous copper-zinc alloy electroplating solution |
CN104120463B (en) * | 2014-06-25 | 2016-06-22 | 济南大学 | The one of steel substrate is without the cuprous electroplated copper surface method of modifying of cyanogen |
CN104120468B (en) * | 2014-06-25 | 2016-08-03 | 济南大学 | A kind of without cyanogen cuprous electro-coppering zinc alloy solution |
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