FR2354398A1 - Solutions de depot electrolytique d'argent, ne renfermant pas de cyanure - Google Patents

Solutions de depot electrolytique d'argent, ne renfermant pas de cyanure

Info

Publication number
FR2354398A1
FR2354398A1 FR7717581A FR7717581A FR2354398A1 FR 2354398 A1 FR2354398 A1 FR 2354398A1 FR 7717581 A FR7717581 A FR 7717581A FR 7717581 A FR7717581 A FR 7717581A FR 2354398 A1 FR2354398 A1 FR 2354398A1
Authority
FR
France
Prior art keywords
silver
cyanide
bath
free
containing antimony
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7717581A
Other languages
English (en)
Other versions
FR2354398B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Industries Corp
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of FR2354398A1 publication Critical patent/FR2354398A1/fr
Application granted granted Critical
Publication of FR2354398B1 publication Critical patent/FR2354398B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Solutions de dépôt électrolytique d'argent Ces solutions aqueuses d'électrolyte pour le revêtement électrolytique d'argent sur des surfaces conductrices contiennent un sel d'argent non constitué de cyanure et un thiophosphate et sont tamponnées à un pH d'environ 3,5-7,0. La présente invention est particulièrement utile pour le revêtement électrolytique d'argent, en utilisant des solutions ne contenant pas de cyanure.
FR7717581A 1976-06-09 1977-06-08 Solutions de depot electrolytique d'argent, ne renfermant pas de cyanure Granted FR2354398A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69410776A 1976-06-09 1976-06-09

Publications (2)

Publication Number Publication Date
FR2354398A1 true FR2354398A1 (fr) 1978-01-06
FR2354398B1 FR2354398B1 (fr) 1982-06-18

Family

ID=24787428

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7717581A Granted FR2354398A1 (fr) 1976-06-09 1977-06-08 Solutions de depot electrolytique d'argent, ne renfermant pas de cyanure

Country Status (5)

Country Link
JP (1) JPS52150744A (fr)
CA (1) CA1081651A (fr)
CH (1) CH632532A5 (fr)
DE (1) DE2725312A1 (fr)
FR (1) FR2354398A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61195986A (ja) * 1985-02-25 1986-08-30 Nippon Engeruharudo Kk 無光沢高速銀めつき液
JP5879093B2 (ja) * 2011-10-26 2016-03-08 株式会社フジクラ コネクタの製造方法及び銀のめっき方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR704663A (fr) * 1929-10-22 1931-05-23 Kodak Pathe Procédé de séparation de l'argent par électrolyse
FR2262705A1 (fr) * 1974-03-01 1975-09-26 Schering Ag

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR704663A (fr) * 1929-10-22 1931-05-23 Kodak Pathe Procédé de séparation de l'argent par électrolyse
FR2262705A1 (fr) * 1974-03-01 1975-09-26 Schering Ag

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/39 *

Also Published As

Publication number Publication date
JPS52150744A (en) 1977-12-14
DE2725312A1 (de) 1977-12-22
FR2354398B1 (fr) 1982-06-18
CH632532A5 (en) 1982-10-15
CA1081651A (fr) 1980-07-15

Similar Documents

Publication Publication Date Title
ATE134726T1 (de) Platin- oder platinlegierung-plattierungsbad
SE8203232L (sv) Elektropleteringskomposition med zinklegering innehallande ett glansmedel
Sriveeraraghavan et al. Silver electrodeposition from thiosulfate solutions
ATE6527T1 (de) Galvanisches bad zur abscheidung von gold- und goldlegierungsueberzuegen.
CA1104091A (fr) Traduction non-disponible
DE3878783T2 (de) Bad fuer das elektroplattieren einer gold-kupfer-zink-legierung.
KR870011277A (ko) 금 전기 도금조
FR2354398A1 (fr) Solutions de depot electrolytique d'argent, ne renfermant pas de cyanure
KR900001885A (ko) 내충격밀착성이 우수한 Za-Ni합금도금강판 및 그 제조방법
DE3278369D1 (en) Electrodeposition of chromium and its alloys
FR2455096A1 (fr) Bain d'electrodeposition d'un alliage d'or blanc, son application a l'obtention d'un depot electrolytique et le depot obtenu
FR2398121A1 (fr) Brillanteur d'organophosphonate de cobalt et de nickel pour le depot electrolytique d'or brillant ou d'alliage d'or
US4399006A (en) Silver plating
GB1360715A (en) Acidic bath for electroplating zinc
ES8302802A1 (es) Un metodo para la electrodeposicion de un deposito de niquel semibrillante, ductil y exento de tension.
GB1503885A (en) Electroplating
ES8106023A1 (es) Un metodo para la electrodeposicion de un deposito de niquelsustancialmente negro sobre un sustrato.
KR950011653A (ko) 전기아연 도금용 첨가제 및 이를 이용한 전기아연 도금방법
GB899020A (en) Electroplating bath and process
KR910003156A (ko) 전해 피복방법
KR880010160A (ko) 팔라듐 전기도금조 및 도금 방법
FR2343062A2 (fr) Bain d'electrolyse ne contenant pas de cyanure pour le depot electrolytique de l'argent
KR960041427A (ko) 도금층 니켈석출비 및 밀착성을 향상시키는 아연-니켈합금 전기도금용액
CA1110997A (fr) Depot electrolytique d'argent en milieu acide, sans cyanure
DE69030176D1 (de) Schutz von bleienthaltenden anoden während der elektrobeschichtung mit chrom

Legal Events

Date Code Title Description
CD Change of name or company name
TP Transmission of property
ST Notification of lapse