KR870011277A - 금 전기 도금조 - Google Patents
금 전기 도금조 Download PDFInfo
- Publication number
- KR870011277A KR870011277A KR870004986A KR870004986A KR870011277A KR 870011277 A KR870011277 A KR 870011277A KR 870004986 A KR870004986 A KR 870004986A KR 870004986 A KR870004986 A KR 870004986A KR 870011277 A KR870011277 A KR 870011277A
- Authority
- KR
- South Korea
- Prior art keywords
- gold
- electroplating bath
- acid
- acrylic acid
- gold electroplating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Building Environments (AREA)
- Residential Or Office Buildings (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (7)
- 전착 가능한 형태의 금 및 3-(3-피리딜)아크릴산, 3-(3-퀴놀릴)아크릴산 및 이들의 혼합물 중에서 선택되는 1가지 이상의 첨가제로 되는 산 금 전기 도금조.
- 제1항에 있어서, 추가로 금속 첨가제를 함유하는 산 금 전기 도금조.
- 제1항에 또는 제2항에 있어서, 금속 첨가제가 코발트염, 니켈염 또는 철염인 산 금 전기 도금조.
- 전항중 어느 하나의 항에 있어서, 3-(3-피리딜)아크릴산이 0.01g/l 내지 5g/l의 농도로 존재하는 산금 전기 도금조.
- 전항중 어느 하나의 항에 있어서, 3-(3-피리딜)아크릴산이 0.5g/l 내지 1.0g/l의 농도로 존재하는 산금 전기 도금조.
- 전항중 어느 하나의 항에 있어서, 금이 수용성 착물로서 1 내지 20g/l의 농도로 존재하는 산 금 전기 도금조.
- 전항중 어느 하나의 항에서 청구된 전기 도금조 주우에서 금속물품을 전기 도금 시키는 것으로 되는 금속 물품상에 금을 전착시키는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB868612361A GB8612361D0 (en) | 1986-05-21 | 1986-05-21 | Gold electroplating bath |
GB8612361 | 1986-05-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR870011277A true KR870011277A (ko) | 1987-12-22 |
Family
ID=10598205
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR870004986A KR870011277A (ko) | 1986-05-21 | 1987-05-20 | 금 전기 도금조 |
Country Status (14)
Country | Link |
---|---|
US (1) | US4767507A (ko) |
EP (1) | EP0246869B1 (ko) |
JP (1) | JPS62287094A (ko) |
KR (1) | KR870011277A (ko) |
AT (1) | ATE68835T1 (ko) |
DE (1) | DE3773990D1 (ko) |
DK (1) | DK168303B1 (ko) |
ES (1) | ES2026910T3 (ko) |
FI (1) | FI872065A (ko) |
GB (1) | GB8612361D0 (ko) |
GR (1) | GR3002980T3 (ko) |
HK (1) | HK58592A (ko) |
NO (1) | NO872114L (ko) |
SG (1) | SG16192G (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5039381A (en) * | 1989-05-25 | 1991-08-13 | Mullarkey Edward J | Method of electroplating a precious metal on a semiconductor device, integrated circuit or the like |
JP2779207B2 (ja) * | 1989-06-06 | 1998-07-23 | 富士通株式会社 | 半導体装置の製造方法 |
US6417366B2 (en) | 1999-06-24 | 2002-07-09 | Abbott Laboratories | Preparation of quinoline-substituted carbonate and carbamate derivatives |
FR2807422B1 (fr) * | 2000-04-06 | 2002-07-05 | Engelhard Clal Sas | Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages |
FR2807450B1 (fr) * | 2000-04-06 | 2002-07-05 | Engelhard Clal Sas | Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages |
FR2828889B1 (fr) * | 2001-08-24 | 2004-05-07 | Engelhard Clal Sas | Bain electrolytique pour le depot electrochimique de l'or et de ses alliages |
US7279086B2 (en) * | 2003-05-21 | 2007-10-09 | Technic, Inc. | Electroplating solution for alloys of gold with tin |
JP5116956B2 (ja) * | 2005-07-14 | 2013-01-09 | 関東化学株式会社 | 無電解硬質金めっき液 |
JP4868116B2 (ja) * | 2005-09-30 | 2012-02-01 | 学校法人早稲田大学 | 金−コバルト系アモルファス合金めっき皮膜、電気めっき液及び電気めっき方法 |
JP5317433B2 (ja) * | 2007-06-06 | 2013-10-16 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 酸性金合金めっき液 |
EP2431502B1 (en) * | 2010-09-21 | 2017-05-24 | Rohm and Haas Electronic Materials LLC | Cyanide-free silver electroplating solutions |
DE102016211594A1 (de) * | 2016-06-28 | 2017-12-28 | Voith Patent Gmbh | Elektrokontakt-Kupplung |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH455434A (de) * | 1963-08-15 | 1968-07-15 | Werner Fluehmann Galvanische A | Verfahren zur Herstellung von Weissgoldüberzügen |
DE2237807C3 (de) * | 1972-08-01 | 1978-04-27 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Verfahren zur Erzeugung mikrorissiger Chromschichten über Zwischenschichten |
DE2355581C3 (de) * | 1973-11-07 | 1979-07-12 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt | Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit |
US4038161A (en) * | 1976-03-05 | 1977-07-26 | R. O. Hull & Company, Inc. | Acid copper plating and additive composition therefor |
GB8334226D0 (en) * | 1983-12-22 | 1984-02-01 | Learonal Uk Ltd | Electrodeposition of gold alloys |
-
1986
- 1986-05-21 GB GB868612361A patent/GB8612361D0/en active Pending
-
1987
- 1987-05-11 FI FI872065A patent/FI872065A/fi not_active Application Discontinuation
- 1987-05-19 EP EP87304445A patent/EP0246869B1/en not_active Expired - Lifetime
- 1987-05-19 ES ES198787304445T patent/ES2026910T3/es not_active Expired - Lifetime
- 1987-05-19 DE DE8787304445T patent/DE3773990D1/de not_active Expired - Lifetime
- 1987-05-19 AT AT87304445T patent/ATE68835T1/de not_active IP Right Cessation
- 1987-05-19 DK DK252987A patent/DK168303B1/da active IP Right Grant
- 1987-05-20 NO NO872114A patent/NO872114L/no unknown
- 1987-05-20 JP JP62121429A patent/JPS62287094A/ja active Pending
- 1987-05-20 KR KR870004986A patent/KR870011277A/ko not_active Application Discontinuation
-
1988
- 1988-01-11 US US07/144,607 patent/US4767507A/en not_active Expired - Lifetime
-
1991
- 1991-10-24 GR GR91400797T patent/GR3002980T3/el unknown
-
1992
- 1992-02-19 SG SG161/92A patent/SG16192G/en unknown
- 1992-08-06 HK HK585/92A patent/HK58592A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0246869A1 (en) | 1987-11-25 |
DE3773990D1 (de) | 1991-11-28 |
HK58592A (en) | 1992-08-14 |
US4767507A (en) | 1988-08-30 |
GR3002980T3 (en) | 1993-01-25 |
FI872065A0 (fi) | 1987-05-11 |
DK252987A (da) | 1987-11-22 |
DK168303B1 (da) | 1994-03-07 |
GB8612361D0 (en) | 1986-06-25 |
JPS62287094A (ja) | 1987-12-12 |
EP0246869B1 (en) | 1991-10-23 |
ATE68835T1 (de) | 1991-11-15 |
NO872114D0 (no) | 1987-05-20 |
DK252987D0 (da) | 1987-05-19 |
ES2026910T3 (es) | 1992-05-16 |
FI872065A (fi) | 1987-11-22 |
NO872114L (no) | 1987-11-23 |
SG16192G (en) | 1992-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE134726T1 (de) | Platin- oder platinlegierung-plattierungsbad | |
KR870011277A (ko) | 금 전기 도금조 | |
ES438408A1 (es) | Procedimiento para la preparacion de un bano para la depo- sicion de aleaciones de metales nobles por via galvanica. | |
ES472902A1 (es) | Procedimiento de obtencion de una solucion acuosa de comple-jo sulfitico de oro monovalente y de amonio | |
BR9004378A (pt) | Banho de liga de ouro galvanico | |
ES382607A1 (es) | Procedimiento de obtencion de banos acuosos para el deposi-to electrolitico de oro o de una aleacion de oro sobre un articulo conductor. | |
FR2282488A1 (fr) | Procede et composition pour l'electrodeposition d'alliages de nickel ou de cobalt, ou de nickel et de cobalt avec du fer | |
ES452704A1 (es) | Un metodo para electrodepositar plata. | |
ATE27007T1 (de) | Verfahren zum abscheiden von niederkaraetigen, glaenzenden gold-silber-legierungsueberzuegen. | |
ES8306807A1 (es) | Un metodo de electrodeposicion de rutenio metalico sobre un sustrato. | |
SE7605289L (sv) | Nickel-jern-beleggning | |
ES2179952T3 (es) | Composiciones y depositos de procedimientos de electrodeposicion. | |
JPS52140403A (en) | Amorphous alloy and its production method | |
GB1507096A (en) | Electro-deposition of zinc | |
Wilkinson et al. | Gold Electroplating Bath | |
FR2335624A1 (fr) | Composition et procede pour l'electrodeposition du chrome | |
JPS5794590A (en) | High corrosion resistant zinc plating method | |
KR920000978A (ko) | 니켈-텅스텐 합금 전기도금욕 | |
KR920000977A (ko) | 고온용 금형의 니켈-텅스텐 도금방법 | |
FR2354398A1 (fr) | Solutions de depot electrolytique d'argent, ne renfermant pas de cyanure | |
ES8304222A1 (es) | Un procedimiento para la preparacion de un sustrato con un deposito de metal de paladio. | |
JPS6479395A (en) | Production of zn-ni alloy plated steel material having superior adhesion | |
Wilkinson | Theoretical Considerations on the Electrodeposition of Gold and Conclusions for the Electroplater | |
KR910021498A (ko) | 도금방법 | |
ES8304221A1 (es) | Un procedimiento para producir depositos blancos de metal depaladio sobre un sustrato. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |