KR870011277A - 금 전기 도금조 - Google Patents

금 전기 도금조 Download PDF

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Publication number
KR870011277A
KR870011277A KR870004986A KR870004986A KR870011277A KR 870011277 A KR870011277 A KR 870011277A KR 870004986 A KR870004986 A KR 870004986A KR 870004986 A KR870004986 A KR 870004986A KR 870011277 A KR870011277 A KR 870011277A
Authority
KR
South Korea
Prior art keywords
gold
electroplating bath
acid
acrylic acid
gold electroplating
Prior art date
Application number
KR870004986A
Other languages
English (en)
Inventor
윌킨스 피터
Original Assignee
케니쓰 에이. 제노니
엥겔하드 코오포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 케니쓰 에이. 제노니, 엥겔하드 코오포레이션 filed Critical 케니쓰 에이. 제노니
Publication of KR870011277A publication Critical patent/KR870011277A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Building Environments (AREA)
  • Residential Or Office Buildings (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

내용 없음

Description

금 전기 도금조
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. 전착 가능한 형태의 금 및 3-(3-피리딜)아크릴산, 3-(3-퀴놀릴)아크릴산 및 이들의 혼합물 중에서 선택되는 1가지 이상의 첨가제로 되는 산 금 전기 도금조.
  2. 제1항에 있어서, 추가로 금속 첨가제를 함유하는 산 금 전기 도금조.
  3. 제1항에 또는 제2항에 있어서, 금속 첨가제가 코발트염, 니켈염 또는 철염인 산 금 전기 도금조.
  4. 전항중 어느 하나의 항에 있어서, 3-(3-피리딜)아크릴산이 0.01g/l 내지 5g/l의 농도로 존재하는 산금 전기 도금조.
  5. 전항중 어느 하나의 항에 있어서, 3-(3-피리딜)아크릴산이 0.5g/l 내지 1.0g/l의 농도로 존재하는 산금 전기 도금조.
  6. 전항중 어느 하나의 항에 있어서, 금이 수용성 착물로서 1 내지 20g/l의 농도로 존재하는 산 금 전기 도금조.
  7. 전항중 어느 하나의 항에서 청구된 전기 도금조 주우에서 금속물품을 전기 도금 시키는 것으로 되는 금속 물품상에 금을 전착시키는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR870004986A 1986-05-21 1987-05-20 금 전기 도금조 KR870011277A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB868612361A GB8612361D0 (en) 1986-05-21 1986-05-21 Gold electroplating bath
GB8612361 1986-05-21

Publications (1)

Publication Number Publication Date
KR870011277A true KR870011277A (ko) 1987-12-22

Family

ID=10598205

Family Applications (1)

Application Number Title Priority Date Filing Date
KR870004986A KR870011277A (ko) 1986-05-21 1987-05-20 금 전기 도금조

Country Status (14)

Country Link
US (1) US4767507A (ko)
EP (1) EP0246869B1 (ko)
JP (1) JPS62287094A (ko)
KR (1) KR870011277A (ko)
AT (1) ATE68835T1 (ko)
DE (1) DE3773990D1 (ko)
DK (1) DK168303B1 (ko)
ES (1) ES2026910T3 (ko)
FI (1) FI872065A (ko)
GB (1) GB8612361D0 (ko)
GR (1) GR3002980T3 (ko)
HK (1) HK58592A (ko)
NO (1) NO872114L (ko)
SG (1) SG16192G (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5039381A (en) * 1989-05-25 1991-08-13 Mullarkey Edward J Method of electroplating a precious metal on a semiconductor device, integrated circuit or the like
JP2779207B2 (ja) * 1989-06-06 1998-07-23 富士通株式会社 半導体装置の製造方法
US6417366B2 (en) 1999-06-24 2002-07-09 Abbott Laboratories Preparation of quinoline-substituted carbonate and carbamate derivatives
FR2807422B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages
FR2807450B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
FR2828889B1 (fr) * 2001-08-24 2004-05-07 Engelhard Clal Sas Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
US7279086B2 (en) * 2003-05-21 2007-10-09 Technic, Inc. Electroplating solution for alloys of gold with tin
JP5116956B2 (ja) * 2005-07-14 2013-01-09 関東化学株式会社 無電解硬質金めっき液
JP4868116B2 (ja) * 2005-09-30 2012-02-01 学校法人早稲田大学 金−コバルト系アモルファス合金めっき皮膜、電気めっき液及び電気めっき方法
JP5317433B2 (ja) * 2007-06-06 2013-10-16 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 酸性金合金めっき液
EP2431502B1 (en) * 2010-09-21 2017-05-24 Rohm and Haas Electronic Materials LLC Cyanide-free silver electroplating solutions
DE102016211594A1 (de) * 2016-06-28 2017-12-28 Voith Patent Gmbh Elektrokontakt-Kupplung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH455434A (de) * 1963-08-15 1968-07-15 Werner Fluehmann Galvanische A Verfahren zur Herstellung von Weissgoldüberzügen
DE2237807C3 (de) * 1972-08-01 1978-04-27 Langbein-Pfanhauser Werke Ag, 4040 Neuss Verfahren zur Erzeugung mikrorissiger Chromschichten über Zwischenschichten
DE2355581C3 (de) * 1973-11-07 1979-07-12 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit
US4038161A (en) * 1976-03-05 1977-07-26 R. O. Hull & Company, Inc. Acid copper plating and additive composition therefor
GB8334226D0 (en) * 1983-12-22 1984-02-01 Learonal Uk Ltd Electrodeposition of gold alloys

Also Published As

Publication number Publication date
EP0246869A1 (en) 1987-11-25
DE3773990D1 (de) 1991-11-28
HK58592A (en) 1992-08-14
US4767507A (en) 1988-08-30
GR3002980T3 (en) 1993-01-25
FI872065A0 (fi) 1987-05-11
DK252987A (da) 1987-11-22
DK168303B1 (da) 1994-03-07
GB8612361D0 (en) 1986-06-25
JPS62287094A (ja) 1987-12-12
EP0246869B1 (en) 1991-10-23
ATE68835T1 (de) 1991-11-15
NO872114D0 (no) 1987-05-20
DK252987D0 (da) 1987-05-19
ES2026910T3 (es) 1992-05-16
FI872065A (fi) 1987-11-22
NO872114L (no) 1987-11-23
SG16192G (en) 1992-04-16

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WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid