HK58592A - Gold electroplating bath - Google Patents

Gold electroplating bath

Info

Publication number
HK58592A
HK58592A HK585/92A HK58592A HK58592A HK 58592 A HK58592 A HK 58592A HK 585/92 A HK585/92 A HK 585/92A HK 58592 A HK58592 A HK 58592A HK 58592 A HK58592 A HK 58592A
Authority
HK
Hong Kong
Prior art keywords
electroplating bath
gold
gold electroplating
acrylic acid
metallic additive
Prior art date
Application number
HK585/92A
Other languages
English (en)
Inventor
Peter Wilkinson
Original Assignee
Engelhard Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Corp filed Critical Engelhard Corp
Publication of HK58592A publication Critical patent/HK58592A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Building Environments (AREA)
  • Residential Or Office Buildings (AREA)
HK585/92A 1986-05-21 1992-08-06 Gold electroplating bath HK58592A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB868612361A GB8612361D0 (en) 1986-05-21 1986-05-21 Gold electroplating bath

Publications (1)

Publication Number Publication Date
HK58592A true HK58592A (en) 1992-08-14

Family

ID=10598205

Family Applications (1)

Application Number Title Priority Date Filing Date
HK585/92A HK58592A (en) 1986-05-21 1992-08-06 Gold electroplating bath

Country Status (14)

Country Link
US (1) US4767507A (xx)
EP (1) EP0246869B1 (xx)
JP (1) JPS62287094A (xx)
KR (1) KR870011277A (xx)
AT (1) ATE68835T1 (xx)
DE (1) DE3773990D1 (xx)
DK (1) DK168303B1 (xx)
ES (1) ES2026910T3 (xx)
FI (1) FI872065A (xx)
GB (1) GB8612361D0 (xx)
GR (1) GR3002980T3 (xx)
HK (1) HK58592A (xx)
NO (1) NO872114L (xx)
SG (1) SG16192G (xx)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5039381A (en) * 1989-05-25 1991-08-13 Mullarkey Edward J Method of electroplating a precious metal on a semiconductor device, integrated circuit or the like
JP2779207B2 (ja) * 1989-06-06 1998-07-23 富士通株式会社 半導体装置の製造方法
US6417366B2 (en) * 1999-06-24 2002-07-09 Abbott Laboratories Preparation of quinoline-substituted carbonate and carbamate derivatives
FR2807450B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
FR2807422B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages
FR2828889B1 (fr) * 2001-08-24 2004-05-07 Engelhard Clal Sas Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
US7279086B2 (en) * 2003-05-21 2007-10-09 Technic, Inc. Electroplating solution for alloys of gold with tin
JP5116956B2 (ja) * 2005-07-14 2013-01-09 関東化学株式会社 無電解硬質金めっき液
JP4868116B2 (ja) * 2005-09-30 2012-02-01 学校法人早稲田大学 金−コバルト系アモルファス合金めっき皮膜、電気めっき液及び電気めっき方法
JP5317433B2 (ja) * 2007-06-06 2013-10-16 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 酸性金合金めっき液
JP5854727B2 (ja) 2010-09-21 2016-02-09 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ シアン化物を含まない銀電気めっき液
DE102016211594A1 (de) * 2016-06-28 2017-12-28 Voith Patent Gmbh Elektrokontakt-Kupplung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH455434A (de) * 1963-08-15 1968-07-15 Werner Fluehmann Galvanische A Verfahren zur Herstellung von Weissgoldüberzügen
DE2237807C3 (de) * 1972-08-01 1978-04-27 Langbein-Pfanhauser Werke Ag, 4040 Neuss Verfahren zur Erzeugung mikrorissiger Chromschichten über Zwischenschichten
DE2355581C3 (de) * 1973-11-07 1979-07-12 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit
US4038161A (en) * 1976-03-05 1977-07-26 R. O. Hull & Company, Inc. Acid copper plating and additive composition therefor
GB8334226D0 (en) * 1983-12-22 1984-02-01 Learonal Uk Ltd Electrodeposition of gold alloys

Also Published As

Publication number Publication date
GR3002980T3 (en) 1993-01-25
DK252987D0 (da) 1987-05-19
FI872065A (fi) 1987-11-22
US4767507A (en) 1988-08-30
SG16192G (en) 1992-04-16
EP0246869B1 (en) 1991-10-23
DE3773990D1 (de) 1991-11-28
ATE68835T1 (de) 1991-11-15
DK252987A (da) 1987-11-22
GB8612361D0 (en) 1986-06-25
NO872114D0 (no) 1987-05-20
ES2026910T3 (es) 1992-05-16
KR870011277A (ko) 1987-12-22
EP0246869A1 (en) 1987-11-25
JPS62287094A (ja) 1987-12-12
DK168303B1 (da) 1994-03-07
FI872065A0 (fi) 1987-05-11
NO872114L (no) 1987-11-23

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Legal Events

Date Code Title Description
PF Patent in force
PE Patent expired

Effective date: 20070518