FR2828889B1 - Bain electrolytique pour le depot electrochimique de l'or et de ses alliages - Google Patents

Bain electrolytique pour le depot electrochimique de l'or et de ses alliages

Info

Publication number
FR2828889B1
FR2828889B1 FR0111092A FR0111092A FR2828889B1 FR 2828889 B1 FR2828889 B1 FR 2828889B1 FR 0111092 A FR0111092 A FR 0111092A FR 0111092 A FR0111092 A FR 0111092A FR 2828889 B1 FR2828889 B1 FR 2828889B1
Authority
FR
France
Prior art keywords
gold
organic compound
deposition
alloys
electrochemical deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0111092A
Other languages
English (en)
Other versions
FR2828889A1 (fr
Inventor
Lionel Chalumeau
Christian Leclere
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Engelhard CLAL SAS
Original Assignee
Engelhard CLAL SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0111092A priority Critical patent/FR2828889B1/fr
Application filed by Engelhard CLAL SAS filed Critical Engelhard CLAL SAS
Priority to US10/485,830 priority patent/US20040195107A1/en
Priority to DE60202378T priority patent/DE60202378T2/de
Priority to CNA028191943A priority patent/CN1561407A/zh
Priority to AT02774881T priority patent/ATE285489T1/de
Priority to PCT/FR2002/002922 priority patent/WO2003018880A1/fr
Priority to EP02774881A priority patent/EP1423557B1/fr
Publication of FR2828889A1 publication Critical patent/FR2828889A1/fr
Application granted granted Critical
Publication of FR2828889B1 publication Critical patent/FR2828889B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacture And Refinement Of Metals (AREA)
FR0111092A 2001-08-24 2001-08-24 Bain electrolytique pour le depot electrochimique de l'or et de ses alliages Expired - Fee Related FR2828889B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR0111092A FR2828889B1 (fr) 2001-08-24 2001-08-24 Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
DE60202378T DE60202378T2 (de) 2001-08-24 2002-08-22 Elektrolytisches bad zum elektrochemischen abscheiden von gold und goldlegierungen
CNA028191943A CN1561407A (zh) 2001-08-24 2002-08-22 用于电化学沉积金及其合金的电解槽
AT02774881T ATE285489T1 (de) 2001-08-24 2002-08-22 Elektrolytisches bad zum elektrochemischen abscheiden von gold und goldlegierungen
US10/485,830 US20040195107A1 (en) 2001-08-24 2002-08-22 Electrolytic solution for electrochemical deposition gold and its alloys
PCT/FR2002/002922 WO2003018880A1 (fr) 2001-08-24 2002-08-22 Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
EP02774881A EP1423557B1 (fr) 2001-08-24 2002-08-22 Bain electrolytique pour le depot electrochimique de l'or et de ses alliages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0111092A FR2828889B1 (fr) 2001-08-24 2001-08-24 Bain electrolytique pour le depot electrochimique de l'or et de ses alliages

Publications (2)

Publication Number Publication Date
FR2828889A1 FR2828889A1 (fr) 2003-02-28
FR2828889B1 true FR2828889B1 (fr) 2004-05-07

Family

ID=8866724

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0111092A Expired - Fee Related FR2828889B1 (fr) 2001-08-24 2001-08-24 Bain electrolytique pour le depot electrochimique de l'or et de ses alliages

Country Status (7)

Country Link
US (1) US20040195107A1 (fr)
EP (1) EP1423557B1 (fr)
CN (1) CN1561407A (fr)
AT (1) ATE285489T1 (fr)
DE (1) DE60202378T2 (fr)
FR (1) FR2828889B1 (fr)
WO (1) WO2003018880A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6828898B2 (en) * 2003-04-03 2004-12-07 Cts Corporation Fuel tank resistor card having improved corrosion resistance
US20050092616A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Baths, methods, and tools for superconformal deposition of conductive materials other than copper
JP4945193B2 (ja) * 2006-08-21 2012-06-06 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 硬質金合金めっき液
CH714243B1 (fr) * 2006-10-03 2019-04-15 Swatch Group Res & Dev Ltd Procédé d'électroformage et pièce ou couche obtenue par ce procédé.
CH710184B1 (fr) 2007-09-21 2016-03-31 Aliprandini Laboratoires G Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.
CN102105623B (zh) * 2008-06-11 2013-10-02 日本高纯度化学株式会社 电镀金液和使用该电镀金液而得的金皮膜
EP2312021B1 (fr) * 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux toxiques
JP2011122192A (ja) * 2009-12-09 2011-06-23 Ne Chemcat Corp 電解硬質金めっき液及びこれを用いるめっき方法
JP5731802B2 (ja) * 2010-11-25 2015-06-10 ローム・アンド・ハース電子材料株式会社 金めっき液
CN102586830B (zh) * 2011-01-10 2015-12-09 深圳市奥美特科技有限公司 金属丝表面镀金或镀钯的设备及方法
CN103741180B (zh) * 2014-01-10 2015-11-25 哈尔滨工业大学 无氰光亮电镀金添加剂及其应用
EP3315635B1 (fr) * 2015-06-26 2020-11-04 Metalor Technologies (Japan) Corporation Solution électrolytique d'or dure comprenant un inhibiteur de substitution
DE102019202899B3 (de) * 2019-03-04 2019-11-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber
CN110344089B (zh) * 2019-06-26 2021-11-09 深圳市瑞世兴科技有限公司 一种亚硫酸金钠镀液及其电镀方法
CN114836794B (zh) * 2021-06-25 2024-01-30 深圳市铭轩珠宝首饰有限公司 一种金-铜合金电铸工艺及其应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2244434C3 (de) * 1972-09-06 1982-02-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen
SU709719A1 (ru) * 1977-07-27 1980-01-15 Предприятие П/Я М-5068 Электролит золочени
CH662583A5 (fr) * 1985-03-01 1987-10-15 Heinz Emmenegger Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc.
GB8612361D0 (en) * 1986-05-21 1986-06-25 Engelhard Corp Gold electroplating bath
JPS637390A (ja) * 1986-06-26 1988-01-13 Nippon Engeruharudo Kk 金−コバルト合金めつき液

Also Published As

Publication number Publication date
FR2828889A1 (fr) 2003-02-28
ATE285489T1 (de) 2005-01-15
US20040195107A1 (en) 2004-10-07
EP1423557B1 (fr) 2004-12-22
DE60202378D1 (de) 2005-01-27
WO2003018880A1 (fr) 2003-03-06
DE60202378T2 (de) 2005-12-08
CN1561407A (zh) 2005-01-05
EP1423557A1 (fr) 2004-06-02

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse

Effective date: 20070430