ATE334237T1 - Lösung für das elektroplattieren einer glänzenden zinn-kupfer-legierung - Google Patents
Lösung für das elektroplattieren einer glänzenden zinn-kupfer-legierungInfo
- Publication number
- ATE334237T1 ATE334237T1 AT00309301T AT00309301T ATE334237T1 AT E334237 T1 ATE334237 T1 AT E334237T1 AT 00309301 T AT00309301 T AT 00309301T AT 00309301 T AT00309301 T AT 00309301T AT E334237 T1 ATE334237 T1 AT E334237T1
- Authority
- AT
- Austria
- Prior art keywords
- copper alloy
- solution
- tin copper
- electro plating
- shiny tin
- Prior art date
Links
- 238000009713 electroplating Methods 0.000 title abstract 3
- 229910000597 tin-copper alloy Inorganic materials 0.000 title 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 2
- 239000000243 solution Substances 0.000 abstract 2
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- 229910001128 Sn alloy Inorganic materials 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 150000001879 copper Chemical class 0.000 abstract 1
- 239000002270 dispersing agent Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP36540599A JP2001181889A (ja) | 1999-12-22 | 1999-12-22 | 光沢錫−銅合金電気めっき浴 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE334237T1 true ATE334237T1 (de) | 2006-08-15 |
Family
ID=18484176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00309301T ATE334237T1 (de) | 1999-12-22 | 2000-10-23 | Lösung für das elektroplattieren einer glänzenden zinn-kupfer-legierung |
Country Status (8)
Country | Link |
---|---|
US (1) | US6372117B1 (de) |
EP (1) | EP1111097B1 (de) |
JP (1) | JP2001181889A (de) |
CN (1) | CN1134558C (de) |
AT (1) | ATE334237T1 (de) |
DE (1) | DE60029549T2 (de) |
ES (1) | ES2267469T3 (de) |
TW (1) | TW581828B (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE50106133D1 (de) * | 2000-09-20 | 2005-06-09 | Schloetter Fa Dr Ing Max | Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten |
JP4698904B2 (ja) | 2001-09-20 | 2011-06-08 | 株式会社大和化成研究所 | 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品 |
US6562221B2 (en) * | 2001-09-28 | 2003-05-13 | David Crotty | Process and composition for high speed plating of tin and tin alloys |
US6652731B2 (en) * | 2001-10-02 | 2003-11-25 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
US6773573B2 (en) | 2001-10-02 | 2004-08-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
EP1408141B1 (de) * | 2002-10-11 | 2014-12-17 | Enthone Inc. | Verfahren und Elektrolyt zur galvanischen Abscheidung von Bronzen |
US20060260948A2 (en) * | 2005-04-14 | 2006-11-23 | Enthone Inc. | Method for electrodeposition of bronzes |
CN101351577B (zh) * | 2005-12-30 | 2011-08-31 | 阿科玛股份有限公司 | 高速镀锡方法 |
JP4925835B2 (ja) * | 2007-01-12 | 2012-05-09 | 日東電工株式会社 | 物質検知センサ |
DE502007002479D1 (de) | 2007-02-14 | 2010-02-11 | Umicore Galvanotechnik Gmbh | Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten |
CN101270492B (zh) * | 2007-03-21 | 2010-12-29 | 来明工业(厦门)有限公司 | 锡铜合金镀层的电镀液及电镀方法 |
TWI341554B (en) * | 2007-08-02 | 2011-05-01 | Enthone | Copper metallization of through silicon via |
US8585885B2 (en) | 2007-08-28 | 2013-11-19 | Rohm And Haas Electronic Materials Llc | Electrochemically deposited indium composites |
ATE486157T1 (de) * | 2008-05-08 | 2010-11-15 | Umicore Galvanotechnik Gmbh | Modifizierter kupfer-zinn-elektrolyt und verfahren zur abscheidung von bronzeschichten |
DE102008032398A1 (de) | 2008-07-10 | 2010-01-14 | Umicore Galvanotechnik Gmbh | Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten |
DE102011008836B4 (de) | 2010-08-17 | 2013-01-10 | Umicore Galvanotechnik Gmbh | Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten |
CN101922027B (zh) * | 2010-08-19 | 2011-10-26 | 武汉风帆电镀技术有限公司 | 无氰碱性镀铜液及其制备方法 |
EP2660360A1 (de) * | 2011-08-30 | 2013-11-06 | Rohm and Haas Electronic Materials LLC | Haftungsförderung von cyanidfreier weißer Bronze |
CN102605394B (zh) * | 2012-03-07 | 2015-02-18 | 深圳市华傲创表面技术有限公司 | 一种无氰酸性白铜锡电镀液 |
CN103422130B (zh) * | 2012-05-14 | 2016-06-29 | 中国科学院金属研究所 | 一种电镀光亮锡镀层的镀液及其方法 |
CN102748391A (zh) * | 2012-06-15 | 2012-10-24 | 湖北东风佳华汽车部件有限公司 | 轴瓦的表面无铅电镀减摩层及电镀工艺方法 |
CN103668359B (zh) * | 2012-09-06 | 2016-03-02 | 上海造币有限公司 | 一种多层无氰电镀铜-锡合金镀层的电镀液、电镀工艺及其硬币 |
CN102953098B (zh) * | 2012-11-20 | 2016-06-01 | 广东致卓精密金属科技有限公司 | 一种碱性溶液电镀白铜锡电镀液及工艺 |
CN103008530A (zh) * | 2012-12-21 | 2013-04-03 | 安徽中兴华汉机械有限公司 | 铝合金泡沫模表面光亮剂及其制造方法 |
CN103215624B (zh) * | 2013-04-18 | 2016-03-23 | 江门市瑞期精细化学工程有限公司 | 一种酸性无氰铜锡合金电镀液 |
US20150122661A1 (en) * | 2013-11-05 | 2015-05-07 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
US20160097139A1 (en) * | 2014-10-02 | 2016-04-07 | Jx Nippon Mining & Metals Corporation | Method For Manufacturing High Purity Tin, Electrowinning Apparatus For High Purity Tin And High Purity Tin |
CN106498463A (zh) * | 2016-12-25 | 2017-03-15 | 苏州锆钒电子科技有限公司 | 一种新型无氰电镀铜锡合金工艺 |
JP7070360B2 (ja) * | 2018-11-16 | 2022-05-18 | トヨタ自動車株式会社 | スズ膜形成用のスズ溶液、及びそれを用いたスズ膜の形成方法 |
JP7140176B2 (ja) * | 2020-11-25 | 2022-09-21 | 三菱マテリアル株式会社 | 錫合金めっき液 |
CN113026064A (zh) * | 2021-02-26 | 2021-06-25 | 深圳市新富华表面技术有限公司 | 一种无氰无铅白铜锡电镀工艺 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5760092A (en) | 1980-09-29 | 1982-04-10 | Seiko Instr & Electronics Ltd | Copper-tin alloy plating bath |
JPS57101687A (en) | 1980-12-18 | 1982-06-24 | Seiko Instr & Electronics Ltd | Copper-tin alloy plating bath |
US4347107A (en) * | 1981-04-02 | 1982-08-31 | Hooker Chemicals & Plastics Corp. | Electroplating tin and tin alloys and baths therefor |
JPS589839A (ja) | 1981-07-03 | 1983-01-20 | Nippon Telegr & Teleph Corp <Ntt> | 光フアイバの被覆方法 |
US4384930A (en) * | 1981-08-21 | 1983-05-24 | Mcgean-Rohco, Inc. | Electroplating baths, additives therefor and methods for the electrodeposition of metals |
JPS5891181A (ja) | 1981-11-24 | 1983-05-31 | Seiko Instr & Electronics Ltd | 銅−スズ合金めつき浴 |
JPS594518A (ja) | 1982-06-25 | 1984-01-11 | Matsushita Electric Works Ltd | 整列供給装置 |
US4641827A (en) | 1983-06-02 | 1987-02-10 | Richard R. Walton | Fabric pickup and the like |
JP2725438B2 (ja) | 1990-05-07 | 1998-03-11 | 三菱マテリアル株式会社 | 恒温鍛造法および恒温鍛造用潤滑シート |
US5385661A (en) * | 1993-09-17 | 1995-01-31 | International Business Machines Corporation | Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition |
JPH0827591A (ja) | 1994-07-13 | 1996-01-30 | Okuno Chem Ind Co Ltd | 光沢銅−錫合金めっき浴 |
JPH0827590A (ja) | 1994-07-13 | 1996-01-30 | Okuno Chem Ind Co Ltd | 光沢銅−錫合金めっき浴 |
AU1813397A (en) * | 1996-03-04 | 1997-09-22 | Naganoken | Tin-silver alloy plating bath and process for producing plated object using the plating bath |
JP3816241B2 (ja) * | 1998-07-14 | 2006-08-30 | 株式会社大和化成研究所 | 金属を還元析出させるための水溶液 |
US6508927B2 (en) * | 1998-11-05 | 2003-01-21 | C. Uyemura & Co., Ltd. | Tin-copper alloy electroplating bath |
-
1999
- 1999-12-22 JP JP36540599A patent/JP2001181889A/ja active Pending
-
2000
- 2000-07-05 US US09/609,785 patent/US6372117B1/en not_active Expired - Lifetime
- 2000-10-23 EP EP00309301A patent/EP1111097B1/de not_active Expired - Lifetime
- 2000-10-23 AT AT00309301T patent/ATE334237T1/de not_active IP Right Cessation
- 2000-10-23 DE DE60029549T patent/DE60029549T2/de not_active Expired - Lifetime
- 2000-10-23 ES ES00309301T patent/ES2267469T3/es not_active Expired - Lifetime
- 2000-12-08 TW TW089126190A patent/TW581828B/zh not_active IP Right Cessation
- 2000-12-22 CN CNB001358340A patent/CN1134558C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1302921A (zh) | 2001-07-11 |
ES2267469T3 (es) | 2007-03-16 |
JP2001181889A (ja) | 2001-07-03 |
DE60029549T2 (de) | 2007-07-26 |
EP1111097A3 (de) | 2003-02-05 |
CN1134558C (zh) | 2004-01-14 |
DE60029549D1 (de) | 2006-09-07 |
US6372117B1 (en) | 2002-04-16 |
EP1111097B1 (de) | 2006-07-26 |
TW581828B (en) | 2004-04-01 |
EP1111097A2 (de) | 2001-06-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |