ATE334237T1 - Lösung für das elektroplattieren einer glänzenden zinn-kupfer-legierung - Google Patents

Lösung für das elektroplattieren einer glänzenden zinn-kupfer-legierung

Info

Publication number
ATE334237T1
ATE334237T1 AT00309301T AT00309301T ATE334237T1 AT E334237 T1 ATE334237 T1 AT E334237T1 AT 00309301 T AT00309301 T AT 00309301T AT 00309301 T AT00309301 T AT 00309301T AT E334237 T1 ATE334237 T1 AT E334237T1
Authority
AT
Austria
Prior art keywords
copper alloy
solution
tin copper
electro plating
shiny tin
Prior art date
Application number
AT00309301T
Other languages
English (en)
Inventor
Takaaki Tamura
Original Assignee
Nippon Macdermid Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Macdermid Co Ltd filed Critical Nippon Macdermid Co Ltd
Application granted granted Critical
Publication of ATE334237T1 publication Critical patent/ATE334237T1/de

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
AT00309301T 1999-12-22 2000-10-23 Lösung für das elektroplattieren einer glänzenden zinn-kupfer-legierung ATE334237T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36540599A JP2001181889A (ja) 1999-12-22 1999-12-22 光沢錫−銅合金電気めっき浴

Publications (1)

Publication Number Publication Date
ATE334237T1 true ATE334237T1 (de) 2006-08-15

Family

ID=18484176

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00309301T ATE334237T1 (de) 1999-12-22 2000-10-23 Lösung für das elektroplattieren einer glänzenden zinn-kupfer-legierung

Country Status (8)

Country Link
US (1) US6372117B1 (de)
EP (1) EP1111097B1 (de)
JP (1) JP2001181889A (de)
CN (1) CN1134558C (de)
AT (1) ATE334237T1 (de)
DE (1) DE60029549T2 (de)
ES (1) ES2267469T3 (de)
TW (1) TW581828B (de)

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* Cited by examiner, † Cited by third party
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DE50106133D1 (de) * 2000-09-20 2005-06-09 Schloetter Fa Dr Ing Max Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
JP4698904B2 (ja) * 2001-09-20 2011-06-08 株式会社大和化成研究所 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品
US6562221B2 (en) * 2001-09-28 2003-05-13 David Crotty Process and composition for high speed plating of tin and tin alloys
US6773573B2 (en) 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US6652731B2 (en) * 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
EP1408141B1 (de) * 2002-10-11 2014-12-17 Enthone Inc. Verfahren und Elektrolyt zur galvanischen Abscheidung von Bronzen
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
KR20080088593A (ko) * 2005-12-30 2008-10-02 알케마 인코포레이티드 고속 주석 도금 방법
JP4925835B2 (ja) * 2007-01-12 2012-05-09 日東電工株式会社 物質検知センサ
ATE453740T1 (de) 2007-02-14 2010-01-15 Umicore Galvanotechnik Gmbh Kupfer-zinn-elektrolyt und verfahren zur abscheidung von bronzeschichten
CN101270492B (zh) * 2007-03-21 2010-12-29 来明工业(厦门)有限公司 锡铜合金镀层的电镀液及电镀方法
TWI341554B (en) * 2007-08-02 2011-05-01 Enthone Copper metallization of through silicon via
EP2031098B1 (de) 2007-08-28 2019-05-29 Rohm and Haas Electronic Materials LLC Zusammensetzung und entsprechendes verfahren zur galvanischen abscheidung von indiumverbundwerkstoffen
DE502008001647D1 (de) * 2008-05-08 2010-12-09 Umicore Galvanotechnik Gmbh Modifizierter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
DE102008032398A1 (de) 2008-07-10 2010-01-14 Umicore Galvanotechnik Gmbh Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
DE102011008836B4 (de) 2010-08-17 2013-01-10 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten
CN101922027B (zh) * 2010-08-19 2011-10-26 武汉风帆电镀技术有限公司 无氰碱性镀铜液及其制备方法
EP2738290A1 (de) * 2011-08-30 2014-06-04 Rohm and Haas Electronic Materials LLC Haftungsförderung von cyanidfreier weißer Bronze
CN102605394B (zh) * 2012-03-07 2015-02-18 深圳市华傲创表面技术有限公司 一种无氰酸性白铜锡电镀液
CN103422130B (zh) * 2012-05-14 2016-06-29 中国科学院金属研究所 一种电镀光亮锡镀层的镀液及其方法
CN102748391A (zh) * 2012-06-15 2012-10-24 湖北东风佳华汽车部件有限公司 轴瓦的表面无铅电镀减摩层及电镀工艺方法
CN103668359B (zh) * 2012-09-06 2016-03-02 上海造币有限公司 一种多层无氰电镀铜-锡合金镀层的电镀液、电镀工艺及其硬币
CN102953098B (zh) * 2012-11-20 2016-06-01 广东致卓精密金属科技有限公司 一种碱性溶液电镀白铜锡电镀液及工艺
CN103008530A (zh) * 2012-12-21 2013-04-03 安徽中兴华汉机械有限公司 铝合金泡沫模表面光亮剂及其制造方法
CN103215624B (zh) * 2013-04-18 2016-03-23 江门市瑞期精细化学工程有限公司 一种酸性无氰铜锡合金电镀液
US20150122661A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
US20160097139A1 (en) * 2014-10-02 2016-04-07 Jx Nippon Mining & Metals Corporation Method For Manufacturing High Purity Tin, Electrowinning Apparatus For High Purity Tin And High Purity Tin
CN106498463A (zh) * 2016-12-25 2017-03-15 苏州锆钒电子科技有限公司 一种新型无氰电镀铜锡合金工艺
JP7070360B2 (ja) * 2018-11-16 2022-05-18 トヨタ自動車株式会社 スズ膜形成用のスズ溶液、及びそれを用いたスズ膜の形成方法
JP7140176B2 (ja) * 2020-11-25 2022-09-21 三菱マテリアル株式会社 錫合金めっき液
CN113026064A (zh) * 2021-02-26 2021-06-25 深圳市新富华表面技术有限公司 一种无氰无铅白铜锡电镀工艺

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JPS5760092A (en) 1980-09-29 1982-04-10 Seiko Instr & Electronics Ltd Copper-tin alloy plating bath
JPS57101687A (en) 1980-12-18 1982-06-24 Seiko Instr & Electronics Ltd Copper-tin alloy plating bath
US4347107A (en) * 1981-04-02 1982-08-31 Hooker Chemicals & Plastics Corp. Electroplating tin and tin alloys and baths therefor
JPS589839A (ja) 1981-07-03 1983-01-20 Nippon Telegr & Teleph Corp <Ntt> 光フアイバの被覆方法
US4384930A (en) * 1981-08-21 1983-05-24 Mcgean-Rohco, Inc. Electroplating baths, additives therefor and methods for the electrodeposition of metals
JPS5891181A (ja) 1981-11-24 1983-05-31 Seiko Instr & Electronics Ltd 銅−スズ合金めつき浴
JPS594518A (ja) 1982-06-25 1984-01-11 Matsushita Electric Works Ltd 整列供給装置
US4641827A (en) 1983-06-02 1987-02-10 Richard R. Walton Fabric pickup and the like
JP2725438B2 (ja) 1990-05-07 1998-03-11 三菱マテリアル株式会社 恒温鍛造法および恒温鍛造用潤滑シート
US5385661A (en) * 1993-09-17 1995-01-31 International Business Machines Corporation Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
JPH0827590A (ja) 1994-07-13 1996-01-30 Okuno Chem Ind Co Ltd 光沢銅−錫合金めっき浴
JPH0827591A (ja) 1994-07-13 1996-01-30 Okuno Chem Ind Co Ltd 光沢銅−錫合金めっき浴
KR100435608B1 (ko) * 1996-03-04 2004-09-30 나가노켄 주석-은계합금도금용액및그도금용액을이용한도금물의제조방법
JP3816241B2 (ja) * 1998-07-14 2006-08-30 株式会社大和化成研究所 金属を還元析出させるための水溶液
TW577938B (en) * 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith

Also Published As

Publication number Publication date
CN1302921A (zh) 2001-07-11
EP1111097B1 (de) 2006-07-26
EP1111097A3 (de) 2003-02-05
TW581828B (en) 2004-04-01
DE60029549T2 (de) 2007-07-26
JP2001181889A (ja) 2001-07-03
ES2267469T3 (es) 2007-03-16
US6372117B1 (en) 2002-04-16
DE60029549D1 (de) 2006-09-07
EP1111097A2 (de) 2001-06-27
CN1134558C (zh) 2004-01-14

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