PL1961840T3 - Elektrolit miedziowo-cynowy i sposób osadzania warstw brązu - Google Patents

Elektrolit miedziowo-cynowy i sposób osadzania warstw brązu

Info

Publication number
PL1961840T3
PL1961840T3 PL07003097T PL07003097T PL1961840T3 PL 1961840 T3 PL1961840 T3 PL 1961840T3 PL 07003097 T PL07003097 T PL 07003097T PL 07003097 T PL07003097 T PL 07003097T PL 1961840 T3 PL1961840 T3 PL 1961840T3
Authority
PL
Poland
Prior art keywords
copper
electrolyte
tin electrolyte
bronze layers
tin
Prior art date
Application number
PL07003097T
Other languages
English (en)
Inventor
Klaus Bronder
Bernd Weyhmüller
Frank Oberst
Sascha Berger
Michael Lauster
Original Assignee
Umicore Galvanotechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Umicore Galvanotechnik Gmbh filed Critical Umicore Galvanotechnik Gmbh
Publication of PL1961840T3 publication Critical patent/PL1961840T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Physical Vapour Deposition (AREA)
PL07003097T 2007-02-14 2007-02-14 Elektrolit miedziowo-cynowy i sposób osadzania warstw brązu PL1961840T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07003097A EP1961840B1 (de) 2007-02-14 2007-02-14 Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten

Publications (1)

Publication Number Publication Date
PL1961840T3 true PL1961840T3 (pl) 2010-06-30

Family

ID=38293349

Family Applications (1)

Application Number Title Priority Date Filing Date
PL07003097T PL1961840T3 (pl) 2007-02-14 2007-02-14 Elektrolit miedziowo-cynowy i sposób osadzania warstw brązu

Country Status (10)

Country Link
US (1) US8211285B2 (pl)
EP (1) EP1961840B1 (pl)
JP (1) JP2010518260A (pl)
CN (1) CN101622379B (pl)
AT (1) ATE453740T1 (pl)
DE (1) DE502007002479D1 (pl)
HK (1) HK1137785A1 (pl)
PL (1) PL1961840T3 (pl)
TW (1) TW200844266A (pl)
WO (1) WO2008098666A1 (pl)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008032398A1 (de) * 2008-07-10 2010-01-14 Umicore Galvanotechnik Gmbh Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
CN101709494B (zh) * 2009-12-14 2012-07-04 昆明理工大学 Cu-Zn-Sn三元合金无氰仿金电镀液及其使用方法
DE102011121799B4 (de) 2011-12-21 2013-08-29 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle
DE102011121798B4 (de) 2011-12-21 2013-08-29 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle
DE102012008544A1 (de) 2012-05-02 2013-11-07 Umicore Galvanotechnik Gmbh Verchromte Verbundwerkstoffe ohne Nickelschicht
AT514818B1 (de) * 2013-09-18 2015-10-15 W Garhöfer Ges M B H Ing Abscheidung von Cu, Sn, Zn-Beschichtungen auf metallischen Substraten
EP2878713A1 (en) * 2013-11-28 2015-06-03 Abbott Laboratories Vascular Enterprises Limited Electrolyte composition and method for the electropolishing treatment of Nickel-Titanium alloys and/or other metal substrates including tungsten, niob and tantal alloys
DE102013226297B3 (de) * 2013-12-17 2015-03-26 Umicore Galvanotechnik Gmbh Wässriger, cyanidfreier Elektrolyt für die Abscheidung von Kupfer-Zinn- und Kupfer-Zinn-Zink-Legierungen aus einem Elektrolyten und Verfahren zur elektrolytischen Abscheidung dieser Legierungen
DE102013021502A1 (de) * 2013-12-19 2015-06-25 Schlenk Metallfolien Gmbh & Co. Kg Elektrisch leitende Flüssigkeiten auf der Basis von Metall-Diphosphonat-Komplexen
CN103755738B (zh) * 2014-01-13 2016-06-01 孙松华 一种络合剂及其制备方法和用途
JP2018119169A (ja) * 2017-01-23 2018-08-02 学校法人関東学院 電気めっき液、電気めっき方法及び電気めっき皮膜
CN108658321B (zh) * 2018-05-18 2019-08-09 深圳市祺鑫天正环保科技有限公司 扩散渗析处理硝酸型退锡废液的系统及方法
DE102021117095A1 (de) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz
DE202021004169U1 (de) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronzeschicht als Edelmetallersatz in Smart Cards

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE267718C (pl)
BE791401A (fr) * 1971-11-15 1973-05-14 Monsanto Co Compositions et procedes electrochimiques
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
JPS513331A (ja) * 1974-06-25 1976-01-12 Lea Ronal Inc Shiankabutsuofukumanai kairyodentoyoku
JPS52106331A (en) * 1976-03-05 1977-09-06 Kosaku Kk Plating bath
US4389286A (en) * 1980-07-17 1983-06-21 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
CN1004010B (zh) * 1986-07-11 1989-04-26 南京大学 无氰仿金电镀液
JPH02175894A (ja) * 1988-12-28 1990-07-09 Kosaku:Kk スズ、スズ合金電気めっき方法及び同電気めっき装置
JPH049493A (ja) * 1990-04-27 1992-01-14 Permelec Electrode Ltd 鋼板の電気錫メッキ方法
JPH04176893A (ja) * 1990-11-08 1992-06-24 Kawasaki Steel Corp Ｓｎ―Ｎｉ合金めっき方法
DE4324995C2 (de) * 1993-07-26 1995-12-21 Demetron Gmbh Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen
JP4132247B2 (ja) * 1998-07-09 2008-08-13 株式会社大和化成研究所 電気・電子回路部品
US6508927B2 (en) 1998-11-05 2003-01-21 C. Uyemura & Co., Ltd. Tin-copper alloy electroplating bath
JP2001181889A (ja) * 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
JP3306404B2 (ja) * 2000-01-28 2002-07-24 三井金属鉱業株式会社 表面処理銅箔の製造方法及びその製造方法で得られた表面処理銅箔を用いた銅張積層板
JP3455712B2 (ja) 2000-04-14 2003-10-14 日本ニュークローム株式会社 銅−スズ合金めっき用ピロリン酸浴
DE10046600C2 (de) 2000-09-20 2003-02-20 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten
JP4249438B2 (ja) 2002-07-05 2009-04-02 日本ニュークローム株式会社 銅―錫合金めっき用ピロリン酸浴
DE10243139A1 (de) * 2002-09-17 2004-03-25 Omg Galvanotechnik Gmbh Dunkle Schichten
EP1408141B1 (de) * 2002-10-11 2014-12-17 Enthone Inc. Verfahren und Elektrolyt zur galvanischen Abscheidung von Bronzen
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法

Also Published As

Publication number Publication date
TW200844266A (en) 2008-11-16
US20100147696A1 (en) 2010-06-17
CN101622379A (zh) 2010-01-06
ATE453740T1 (de) 2010-01-15
EP1961840B1 (de) 2009-12-30
CN101622379B (zh) 2011-05-25
JP2010518260A (ja) 2010-05-27
HK1137785A1 (en) 2010-08-06
DE502007002479D1 (de) 2010-02-11
EP1961840A1 (de) 2008-08-27
US8211285B2 (en) 2012-07-03
WO2008098666A1 (de) 2008-08-21

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