ATE285489T1 - Elektrolytisches bad zum elektrochemischen abscheiden von gold und goldlegierungen - Google Patents
Elektrolytisches bad zum elektrochemischen abscheiden von gold und goldlegierungenInfo
- Publication number
- ATE285489T1 ATE285489T1 AT02774881T AT02774881T ATE285489T1 AT E285489 T1 ATE285489 T1 AT E285489T1 AT 02774881 T AT02774881 T AT 02774881T AT 02774881 T AT02774881 T AT 02774881T AT E285489 T1 ATE285489 T1 AT E285489T1
- Authority
- AT
- Austria
- Prior art keywords
- gold
- organic compound
- deposition
- electrochemical deposition
- unsaturated
- Prior art date
Links
- 238000004070 electrodeposition Methods 0.000 title abstract 3
- 229910001020 Au alloy Inorganic materials 0.000 title abstract 2
- 239000003353 gold alloy Substances 0.000 title abstract 2
- 150000002894 organic compounds Chemical class 0.000 abstract 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 2
- 239000008151 electrolyte solution Substances 0.000 abstract 2
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 229920006395 saturated elastomer Polymers 0.000 abstract 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract 1
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- JXLHNMVSKXFWAO-UHFFFAOYSA-N azane;7-fluoro-2,1,3-benzoxadiazole-4-sulfonic acid Chemical compound N.OS(=O)(=O)C1=CC=C(F)C2=NON=C12 JXLHNMVSKXFWAO-UHFFFAOYSA-N 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 150000002344 gold compounds Chemical class 0.000 abstract 1
- 150000002736 metal compounds Chemical group 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 239000011574 phosphorus Substances 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
- 229910052717 sulfur Inorganic materials 0.000 abstract 1
- 239000011593 sulfur Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacture And Refinement Of Metals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0111092A FR2828889B1 (fr) | 2001-08-24 | 2001-08-24 | Bain electrolytique pour le depot electrochimique de l'or et de ses alliages |
| PCT/FR2002/002922 WO2003018880A1 (fr) | 2001-08-24 | 2002-08-22 | Bain electrolytique pour le depot electrochimique de l'or et de ses alliages |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE285489T1 true ATE285489T1 (de) | 2005-01-15 |
Family
ID=8866724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02774881T ATE285489T1 (de) | 2001-08-24 | 2002-08-22 | Elektrolytisches bad zum elektrochemischen abscheiden von gold und goldlegierungen |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20040195107A1 (de) |
| EP (1) | EP1423557B1 (de) |
| CN (1) | CN1561407A (de) |
| AT (1) | ATE285489T1 (de) |
| DE (1) | DE60202378T2 (de) |
| FR (1) | FR2828889B1 (de) |
| WO (1) | WO2003018880A1 (de) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6828898B2 (en) * | 2003-04-03 | 2004-12-07 | Cts Corporation | Fuel tank resistor card having improved corrosion resistance |
| US20050092616A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Baths, methods, and tools for superconformal deposition of conductive materials other than copper |
| JP4945193B2 (ja) * | 2006-08-21 | 2012-06-06 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 硬質金合金めっき液 |
| CH714243B1 (fr) * | 2006-10-03 | 2019-04-15 | Swatch Group Res & Dev Ltd | Procédé d'électroformage et pièce ou couche obtenue par ce procédé. |
| CH710184B1 (fr) | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques. |
| JP4719822B2 (ja) * | 2008-06-11 | 2011-07-06 | 日本高純度化学株式会社 | 電解金めっき液及びそれを用いて得られた金皮膜 |
| EP2312021B1 (de) * | 2009-10-15 | 2020-03-18 | The Swatch Group Research and Development Ltd. | Verfahren zum erhalten einer gelben goldlegierungsablagerung durch galvanoplastik ohne verwendung von giftigen metallen |
| JP2011122192A (ja) * | 2009-12-09 | 2011-06-23 | Ne Chemcat Corp | 電解硬質金めっき液及びこれを用いるめっき方法 |
| JP5731802B2 (ja) * | 2010-11-25 | 2015-06-10 | ローム・アンド・ハース電子材料株式会社 | 金めっき液 |
| CN102586830B (zh) * | 2011-01-10 | 2015-12-09 | 深圳市奥美特科技有限公司 | 金属丝表面镀金或镀钯的设备及方法 |
| CN103741180B (zh) * | 2014-01-10 | 2015-11-25 | 哈尔滨工业大学 | 无氰光亮电镀金添加剂及其应用 |
| JP6715246B2 (ja) * | 2015-06-26 | 2020-07-01 | メタローテクノロジーズジャパン株式会社 | 電解硬質金めっき液用置換防止剤及びそれを含む電解硬質金めっき液 |
| DE102019202899B3 (de) * | 2019-03-04 | 2019-11-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber |
| CN110344089B (zh) * | 2019-06-26 | 2021-11-09 | 深圳市瑞世兴科技有限公司 | 一种亚硫酸金钠镀液及其电镀方法 |
| CN114836794B (zh) * | 2021-06-25 | 2024-01-30 | 深圳市铭轩珠宝首饰有限公司 | 一种金-铜合金电铸工艺及其应用 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2244434C3 (de) * | 1972-09-06 | 1982-02-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen |
| SU709719A1 (ru) * | 1977-07-27 | 1980-01-15 | Предприятие П/Я М-5068 | Электролит золочени |
| CH662583A5 (fr) * | 1985-03-01 | 1987-10-15 | Heinz Emmenegger | Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc. |
| GB8612361D0 (en) * | 1986-05-21 | 1986-06-25 | Engelhard Corp | Gold electroplating bath |
| JPS637390A (ja) * | 1986-06-26 | 1988-01-13 | Nippon Engeruharudo Kk | 金−コバルト合金めつき液 |
-
2001
- 2001-08-24 FR FR0111092A patent/FR2828889B1/fr not_active Expired - Fee Related
-
2002
- 2002-08-22 EP EP02774881A patent/EP1423557B1/de not_active Expired - Lifetime
- 2002-08-22 WO PCT/FR2002/002922 patent/WO2003018880A1/fr not_active Ceased
- 2002-08-22 US US10/485,830 patent/US20040195107A1/en not_active Abandoned
- 2002-08-22 AT AT02774881T patent/ATE285489T1/de not_active IP Right Cessation
- 2002-08-22 CN CNA028191943A patent/CN1561407A/zh active Pending
- 2002-08-22 DE DE60202378T patent/DE60202378T2/de not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1423557B1 (de) | 2004-12-22 |
| EP1423557A1 (de) | 2004-06-02 |
| DE60202378D1 (de) | 2005-01-27 |
| US20040195107A1 (en) | 2004-10-07 |
| CN1561407A (zh) | 2005-01-05 |
| WO2003018880A1 (fr) | 2003-03-06 |
| FR2828889A1 (fr) | 2003-02-28 |
| DE60202378T2 (de) | 2005-12-08 |
| FR2828889B1 (fr) | 2004-05-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |