ATE285489T1 - Elektrolytisches bad zum elektrochemischen abscheiden von gold und goldlegierungen - Google Patents

Elektrolytisches bad zum elektrochemischen abscheiden von gold und goldlegierungen

Info

Publication number
ATE285489T1
ATE285489T1 AT02774881T AT02774881T ATE285489T1 AT E285489 T1 ATE285489 T1 AT E285489T1 AT 02774881 T AT02774881 T AT 02774881T AT 02774881 T AT02774881 T AT 02774881T AT E285489 T1 ATE285489 T1 AT E285489T1
Authority
AT
Austria
Prior art keywords
gold
organic compound
deposition
electrochemical deposition
unsaturated
Prior art date
Application number
AT02774881T
Other languages
English (en)
Inventor
Lionel Chalumeau
Christian Leclere
Original Assignee
Metalor Technologies France S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metalor Technologies France S filed Critical Metalor Technologies France S
Application granted granted Critical
Publication of ATE285489T1 publication Critical patent/ATE285489T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacture And Refinement Of Metals (AREA)
AT02774881T 2001-08-24 2002-08-22 Elektrolytisches bad zum elektrochemischen abscheiden von gold und goldlegierungen ATE285489T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0111092A FR2828889B1 (fr) 2001-08-24 2001-08-24 Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
PCT/FR2002/002922 WO2003018880A1 (fr) 2001-08-24 2002-08-22 Bain electrolytique pour le depot electrochimique de l'or et de ses alliages

Publications (1)

Publication Number Publication Date
ATE285489T1 true ATE285489T1 (de) 2005-01-15

Family

ID=8866724

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02774881T ATE285489T1 (de) 2001-08-24 2002-08-22 Elektrolytisches bad zum elektrochemischen abscheiden von gold und goldlegierungen

Country Status (7)

Country Link
US (1) US20040195107A1 (de)
EP (1) EP1423557B1 (de)
CN (1) CN1561407A (de)
AT (1) ATE285489T1 (de)
DE (1) DE60202378T2 (de)
FR (1) FR2828889B1 (de)
WO (1) WO2003018880A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6828898B2 (en) * 2003-04-03 2004-12-07 Cts Corporation Fuel tank resistor card having improved corrosion resistance
US20050092616A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Baths, methods, and tools for superconformal deposition of conductive materials other than copper
JP4945193B2 (ja) * 2006-08-21 2012-06-06 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 硬質金合金めっき液
CH714243B1 (fr) * 2006-10-03 2019-04-15 Swatch Group Res & Dev Ltd Procédé d'électroformage et pièce ou couche obtenue par ce procédé.
CH710184B1 (fr) 2007-09-21 2016-03-31 Aliprandini Laboratoires G Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.
CN102105623B (zh) * 2008-06-11 2013-10-02 日本高纯度化学株式会社 电镀金液和使用该电镀金液而得的金皮膜
EP2312021B1 (de) 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Verfahren zum erhalten einer gelben goldlegierungsablagerung durch galvanoplastik ohne verwendung von giftigen metallen
JP2011122192A (ja) * 2009-12-09 2011-06-23 Ne Chemcat Corp 電解硬質金めっき液及びこれを用いるめっき方法
JP5731802B2 (ja) * 2010-11-25 2015-06-10 ローム・アンド・ハース電子材料株式会社 金めっき液
CN102586830B (zh) * 2011-01-10 2015-12-09 深圳市奥美特科技有限公司 金属丝表面镀金或镀钯的设备及方法
CN103741180B (zh) * 2014-01-10 2015-11-25 哈尔滨工业大学 无氰光亮电镀金添加剂及其应用
US10577704B2 (en) * 2015-06-26 2020-03-03 Metalor Technologies Corporation Electrolytic hard gold plating solution substitution inhibitor and electrolytic hard gold plating solution including same
DE102019202899B3 (de) * 2019-03-04 2019-11-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber
CN110344089B (zh) * 2019-06-26 2021-11-09 深圳市瑞世兴科技有限公司 一种亚硫酸金钠镀液及其电镀方法
CN114836794B (zh) * 2021-06-25 2024-01-30 深圳市铭轩珠宝首饰有限公司 一种金-铜合金电铸工艺及其应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2244434C3 (de) * 1972-09-06 1982-02-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen
SU709719A1 (ru) * 1977-07-27 1980-01-15 Предприятие П/Я М-5068 Электролит золочени
CH662583A5 (fr) * 1985-03-01 1987-10-15 Heinz Emmenegger Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc.
GB8612361D0 (en) * 1986-05-21 1986-06-25 Engelhard Corp Gold electroplating bath
JPS637390A (ja) * 1986-06-26 1988-01-13 Nippon Engeruharudo Kk 金−コバルト合金めつき液

Also Published As

Publication number Publication date
EP1423557B1 (de) 2004-12-22
EP1423557A1 (de) 2004-06-02
US20040195107A1 (en) 2004-10-07
DE60202378T2 (de) 2005-12-08
DE60202378D1 (de) 2005-01-27
FR2828889B1 (fr) 2004-05-07
FR2828889A1 (fr) 2003-02-28
CN1561407A (zh) 2005-01-05
WO2003018880A1 (fr) 2003-03-06

Similar Documents

Publication Publication Date Title
ATE285489T1 (de) Elektrolytisches bad zum elektrochemischen abscheiden von gold und goldlegierungen
TWI268292B (en) Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions
ATE334237T1 (de) Lösung für das elektroplattieren einer glänzenden zinn-kupfer-legierung
MY151335A (en) Electroplating solution containing organic acid complexing agent
BRPI0411937A (pt) soluções de eletrodeposição por imersão acìdica aquosa e processos para depositar um revestimento protetor de liga de zinco sobre substratos de alumìnio ou de ligas a base de alumìnio e produtos obtidos através dos mesmos
ATE521734T1 (de) Cyanidfreies pyrophosphorsäure-bad zum elektrolytischen abscheiden von kupfer- zinnlegierungsüberzügen
DE68925768T2 (de) Platin- oder Platinlegierung-Plattierungsbad
CA2558466A1 (en) Iron-phosphorus electroplating bath and method
DE60023190D1 (de) Zink-nickel-elektroplattierung
GB1426849A (en) Electroplating bath for depositing coatings of brilliant gold
DE60102364D1 (de) Elektrolytische lösung zur elektrochemischen abscheidung von palladium oder dessen legierungen
WO2001051688A3 (en) Electrolyte for use in electrolytic plating
TW200626754A (en) Copper electrolytic solution containing compound having specified structrue and electrolytic copper foil produced with the same
ES8307933A1 (es) Un bano de electrodeposicion.
DE69917620D1 (de) Ductilität verbessernde additive für nickel-wolframlegierungen
US4299672A (en) Bath and process for galvanic separation of palladium-nickel alloys
TWI255870B (en) Process and composition for high speed plating of tin and tin alloys
DE3878783T2 (de) Bad fuer das elektroplattieren einer gold-kupfer-zink-legierung.
AU9166701A (en) A method for electrolytic galvanising using electrolytes containing alkane sulphonic acid
EP1325972A4 (de) Galvanische abscheidung von kupfer unter verwendung einer unlöslichen anode
SE7509245L (sv) Elektrolytisk avsettning av legeringar.
DE60019428D1 (de) Legierungsplattierung
FR2375350A1 (fr) Bain de zingage electrolytique
SE7605289L (sv) Nickel-jern-beleggning
ATE220736T1 (de) Elektroplattierungsverfahren, zusammensetzungen und überzügen

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties