SG11201710709SA - Electrolytic hard gold plating solution substitution inhibitor and electrolytic hard gold plating solution including same - Google Patents
Electrolytic hard gold plating solution substitution inhibitor and electrolytic hard gold plating solution including sameInfo
- Publication number
- SG11201710709SA SG11201710709SA SG11201710709SA SG11201710709SA SG11201710709SA SG 11201710709S A SG11201710709S A SG 11201710709SA SG 11201710709S A SG11201710709S A SG 11201710709SA SG 11201710709S A SG11201710709S A SG 11201710709SA SG 11201710709S A SG11201710709S A SG 11201710709SA
- Authority
- SG
- Singapore
- Prior art keywords
- plating solution
- gold plating
- hard gold
- electrolytic hard
- including same
- Prior art date
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title 2
- 239000010931 gold Substances 0.000 title 2
- 229910052737 gold Inorganic materials 0.000 title 2
- 238000007747 plating Methods 0.000 title 2
- 239000003112 inhibitor Substances 0.000 title 1
- 238000006467 substitution reaction Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015129063 | 2015-06-26 | ||
| PCT/JP2016/066152 WO2016208340A1 (en) | 2015-06-26 | 2016-06-01 | Electrolytic hard gold plating solution substitution inhibitor and electrolytic hard gold plating solution including same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201710709SA true SG11201710709SA (en) | 2018-01-30 |
Family
ID=57586255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201710709SA SG11201710709SA (en) | 2015-06-26 | 2016-06-01 | Electrolytic hard gold plating solution substitution inhibitor and electrolytic hard gold plating solution including same |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10577704B2 (en) |
| EP (1) | EP3315635B1 (en) |
| JP (1) | JP6715246B2 (en) |
| KR (1) | KR102670599B1 (en) |
| CN (1) | CN107709628B (en) |
| SG (1) | SG11201710709SA (en) |
| TW (1) | TWI717360B (en) |
| WO (1) | WO2016208340A1 (en) |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5134974Y2 (en) | 1971-02-02 | 1976-08-30 | ||
| JPS53137035A (en) * | 1977-12-19 | 1978-11-30 | Nippon Dento Kougiyou Kk | Method of electrodepositing glossy gold and nickel |
| JP2529021Y2 (en) | 1988-06-02 | 1997-03-12 | カヤバ工業株式会社 | Active suspension |
| JP2529021B2 (en) | 1990-08-30 | 1996-08-28 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Cyan-based gold plating solution containing gold replacement / electrolytic corrosion inhibitor |
| FR2828889B1 (en) * | 2001-08-24 | 2004-05-07 | Engelhard Clal Sas | ELECTROLYTIC BATH FOR THE ELECTROCHEMICAL DEPOSITION OF GOLD AND ITS ALLOYS |
| JP2003226993A (en) * | 2002-02-01 | 2003-08-15 | Electroplating Eng Of Japan Co | Gold plating solution and gold plating treatment method |
| JP4179165B2 (en) * | 2002-02-28 | 2008-11-12 | 日本ゼオン株式会社 | Partial plating method, partial plating resin base material, and manufacturing method of multilayer circuit board |
| JP4129363B2 (en) * | 2002-03-15 | 2008-08-06 | エヌ・イーケムキャット株式会社 | Electrolytic gold plating solution and gold plating method |
| JP2004176171A (en) * | 2002-09-30 | 2004-06-24 | Shinko Electric Ind Co Ltd | Non-cyanogen type electrolytic solution for plating gold |
| JP2004190093A (en) * | 2002-12-11 | 2004-07-08 | Ne Chemcat Corp | Displacement electroless gold plating bath |
| JP5558675B2 (en) | 2007-04-03 | 2014-07-23 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | Metal plating composition |
| CN102105623B (en) | 2008-06-11 | 2013-10-02 | 日本高纯度化学株式会社 | Electrolytic gold plating solution and gold film obtained using same |
| JP5513784B2 (en) | 2008-08-25 | 2014-06-04 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Hard gold plating solution |
| JP5619348B2 (en) | 2008-11-21 | 2014-11-05 | 住友化学株式会社 | Mold sheet inspection system |
| US8608931B2 (en) * | 2009-09-25 | 2013-12-17 | Rohm And Haas Electronic Materials Llc | Anti-displacement hard gold compositions |
| JP6145671B2 (en) * | 2012-12-24 | 2017-06-14 | 石原ケミカル株式会社 | A tin or tin alloy plating bath and an electronic component formed using the plating bath |
| EP2982743B1 (en) * | 2013-04-04 | 2019-07-17 | Hitachi Chemical Company, Ltd. | Filter for capturing biological substance |
| EP2990507A1 (en) * | 2014-08-25 | 2016-03-02 | ATOTECH Deutschland GmbH | Composition, use thereof and method for electrodepositing gold containing layers |
| CN104264195A (en) * | 2014-10-22 | 2015-01-07 | 华文蔚 | Mercaptoiminazole cyanide-free gold-electroplating solution and electroplating method thereof |
-
2016
- 2016-06-01 EP EP16814111.7A patent/EP3315635B1/en active Active
- 2016-06-01 US US15/738,398 patent/US10577704B2/en active Active
- 2016-06-01 WO PCT/JP2016/066152 patent/WO2016208340A1/en active Application Filing
- 2016-06-01 SG SG11201710709SA patent/SG11201710709SA/en unknown
- 2016-06-01 JP JP2017524793A patent/JP6715246B2/en active Active
- 2016-06-01 CN CN201680037111.7A patent/CN107709628B/en active Active
- 2016-06-01 KR KR1020177037694A patent/KR102670599B1/en active IP Right Grant
- 2016-06-21 TW TW105119439A patent/TWI717360B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3315635A1 (en) | 2018-05-02 |
| KR102670599B1 (en) | 2024-05-29 |
| EP3315635A4 (en) | 2019-05-08 |
| CN107709628B (en) | 2020-06-16 |
| JPWO2016208340A1 (en) | 2018-04-12 |
| TW201715090A (en) | 2017-05-01 |
| EP3315635B1 (en) | 2020-11-04 |
| TWI717360B (en) | 2021-02-01 |
| US10577704B2 (en) | 2020-03-03 |
| WO2016208340A1 (en) | 2016-12-29 |
| US20180187321A1 (en) | 2018-07-05 |
| CN107709628A (en) | 2018-02-16 |
| KR20180021734A (en) | 2018-03-05 |
| JP6715246B2 (en) | 2020-07-01 |
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