SG11201703049XA - Copper-Nickel Alloy Electroplating Apparatus - Google Patents

Copper-Nickel Alloy Electroplating Apparatus

Info

Publication number
SG11201703049XA
SG11201703049XA SG11201703049XA SG11201703049XA SG11201703049XA SG 11201703049X A SG11201703049X A SG 11201703049XA SG 11201703049X A SG11201703049X A SG 11201703049XA SG 11201703049X A SG11201703049X A SG 11201703049XA SG 11201703049X A SG11201703049X A SG 11201703049XA
Authority
SG
Singapore
Prior art keywords
copper
nickel alloy
electroplating apparatus
alloy electroplating
nickel
Prior art date
Application number
SG11201703049XA
Inventor
Hitoshi Sakurai
Kazunori Ono
Akira Hashimoto
Satoshi Yuasa
Original Assignee
Dipsol Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dipsol Chem filed Critical Dipsol Chem
Publication of SG11201703049XA publication Critical patent/SG11201703049XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/002—Alloys based on nickel or cobalt with copper as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/06—Filtering particles other than ions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
SG11201703049XA 2014-10-17 2015-06-25 Copper-Nickel Alloy Electroplating Apparatus SG11201703049XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014212524A JP6435546B2 (en) 2014-10-17 2014-10-17 Copper-nickel alloy electroplating equipment
PCT/JP2015/068332 WO2016059833A1 (en) 2014-10-17 2015-06-25 Copper-nickel alloy electroplating device

Publications (1)

Publication Number Publication Date
SG11201703049XA true SG11201703049XA (en) 2017-05-30

Family

ID=55746382

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201703049XA SG11201703049XA (en) 2014-10-17 2015-06-25 Copper-Nickel Alloy Electroplating Apparatus

Country Status (13)

Country Link
US (1) US10538854B2 (en)
EP (1) EP3208364B1 (en)
JP (1) JP6435546B2 (en)
KR (1) KR101916614B1 (en)
CN (1) CN107075713B (en)
BR (1) BR112017007630A2 (en)
MX (1) MX2017004574A (en)
MY (1) MY190427A (en)
PH (1) PH12017500597A1 (en)
RU (1) RU2648811C1 (en)
SG (1) SG11201703049XA (en)
TW (1) TWI651438B (en)
WO (1) WO2016059833A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6834070B2 (en) * 2016-06-13 2021-02-24 石原ケミカル株式会社 Electric tin and tin alloy plating bath, a method of manufacturing electronic parts on which electrodeposits are formed using the plating bath.
KR101872734B1 (en) * 2017-07-20 2018-06-29 주식회사 익스톨 Nickel electroplating solution and electroplating method using the same
JP2020097764A (en) * 2018-12-18 2020-06-25 トヨタ自動車株式会社 Film forming device, and method of forming metal film using the same
CN110387573B (en) * 2019-07-04 2021-01-05 广州兴森快捷电路科技有限公司 Multi-waste liquid shunting method and electroplating production system
CA3109026A1 (en) * 2020-02-18 2021-08-18 Magna Exteriors Inc. Tailgate accessibility

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1019027A1 (en) * 1982-02-16 1983-05-23 Проектно-конструкторский технологический институт машиностроения Batch for electroplating of parts
JPH04198499A (en) * 1990-07-20 1992-07-17 Asahi Glass Co Ltd Copper dissolving bath having potential adjusting mechanism
KR100665384B1 (en) 1998-11-30 2007-01-04 가부시키가이샤 에바라 세이사꾸쇼 Plating machine
EP2017374A3 (en) 2000-03-17 2011-04-27 Ebara Corporation Plating apparatus and method
WO2002068727A2 (en) * 2001-02-23 2002-09-06 Ebara Corporation Copper-plating solution, plating method and plating apparatus
JP2003183898A (en) * 2001-12-20 2003-07-03 Toho Kako Kensetsu Kk Apparatus and method for automatically adjusting concentration of plating solution
US20040007473A1 (en) 2002-07-11 2004-01-15 Applied Materials, Inc. Electrolyte/organic additive separation in electroplating processes
IES20030443A2 (en) * 2003-06-16 2004-12-01 Fraudhalt Ltd A method and apparatus for determining if an optical disk originated from a valid source
US8128791B1 (en) * 2006-10-30 2012-03-06 Novellus Systems, Inc. Control of electrolyte composition in a copper electroplating apparatus
US8694950B2 (en) * 2010-07-24 2014-04-08 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for implementing electronic circuit designs with electrical awareness
JP5631775B2 (en) * 2011-02-24 2014-11-26 新光電気工業株式会社 Composite plating solution
US9518332B2 (en) * 2011-03-17 2016-12-13 Taiwan Semiconductor Manufacturing Company, Ltd. Electrochemical plating
JP6047711B2 (en) * 2012-02-08 2016-12-21 石原ケミカル株式会社 Electroless nickel and nickel alloy plating method, and pretreatment liquid for the plating
CN104321470B (en) 2012-04-19 2017-03-15 迪普索尔化学株式会社 The electroplate liquid and coating method of corronil

Also Published As

Publication number Publication date
US20170241040A1 (en) 2017-08-24
EP3208364A4 (en) 2018-05-30
PH12017500597A1 (en) 2017-08-30
EP3208364A1 (en) 2017-08-23
CN107075713B (en) 2019-09-24
RU2648811C1 (en) 2018-03-28
BR112017007630A2 (en) 2018-01-30
JP6435546B2 (en) 2018-12-12
TW201615900A (en) 2016-05-01
JP2016079460A (en) 2016-05-16
MY190427A (en) 2022-04-21
CN107075713A (en) 2017-08-18
KR20170053675A (en) 2017-05-16
KR101916614B1 (en) 2018-11-07
US10538854B2 (en) 2020-01-21
WO2016059833A1 (en) 2016-04-21
TWI651438B (en) 2019-02-21
MX2017004574A (en) 2017-07-17
EP3208364B1 (en) 2019-08-07

Similar Documents

Publication Publication Date Title
HK1243742A1 (en) Metal alloys including copper
HK1200505A1 (en) Gold electroplating method and hard gold preparation method
PL3186414T3 (en) Electroplated coatings
EP3042985A4 (en) Zinc alloy plating method
SG11202001659PA (en) Plating apparatus
AU361615S (en) Exercise equipment
EP3042984A4 (en) Zinc alloy plating method
SG11201606346TA (en) Intermittent-bubbling equipment
SG10201504959UA (en) Plating method
SG11201610462WA (en) Resin plating method
GB201421949D0 (en) Alloy
SG11201700896XA (en) Copper-nickel alloy electroplating bath
SG11201703049XA (en) Copper-Nickel Alloy Electroplating Apparatus
GB2529065B (en) Rhodium alloys
PL2963134T3 (en) Low-lead brass alloy
LU93174B1 (en) Anti-resistance method
GB201408299D0 (en) An alloy
GB201401906D0 (en) Alloy
GB201513616D0 (en) Rhodium alloys
GB201501185D0 (en) Hydroelectric apparatus
GB2542519B (en) Low ductility alloy
GB201401474D0 (en) Reconfiguarble metal forming apparatus
GB201408536D0 (en) Alloy composition
PL3440022T3 (en) Copper alloy
GB201414431D0 (en) Improved electrodeposition