SG11201700896XA - Copper-nickel alloy electroplating bath - Google Patents
Copper-nickel alloy electroplating bathInfo
- Publication number
- SG11201700896XA SG11201700896XA SG11201700896XA SG11201700896XA SG11201700896XA SG 11201700896X A SG11201700896X A SG 11201700896XA SG 11201700896X A SG11201700896X A SG 11201700896XA SG 11201700896X A SG11201700896X A SG 11201700896XA SG 11201700896X A SG11201700896X A SG 11201700896XA
- Authority
- SG
- Singapore
- Prior art keywords
- copper
- nickel alloy
- electroplating bath
- alloy electroplating
- bath
- Prior art date
Links
- 229910000570 Cupronickel Inorganic materials 0.000 title 1
- 229910045601 alloy Inorganic materials 0.000 title 1
- 239000000956 alloy Substances 0.000 title 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 title 1
- 238000009713 electroplating Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014162802A JP6439172B2 (en) | 2014-08-08 | 2014-08-08 | Copper-nickel alloy electroplating bath |
| PCT/JP2015/069944 WO2016021369A1 (en) | 2014-08-08 | 2015-07-10 | Copper-nickel alloy electroplating bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201700896XA true SG11201700896XA (en) | 2017-03-30 |
Family
ID=55263643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201700896XA SG11201700896XA (en) | 2014-08-08 | 2015-07-10 | Copper-nickel alloy electroplating bath |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US10316421B2 (en) |
| EP (1) | EP3178968B1 (en) |
| JP (1) | JP6439172B2 (en) |
| KR (1) | KR102001322B1 (en) |
| CN (1) | CN106574387B (en) |
| BR (1) | BR112017002269A2 (en) |
| MX (1) | MX2017001680A (en) |
| PH (1) | PH12017500218B1 (en) |
| RU (1) | RU2666391C1 (en) |
| SG (1) | SG11201700896XA (en) |
| TW (1) | TWI652378B (en) |
| WO (1) | WO2016021369A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6988826B2 (en) * | 2016-12-16 | 2022-01-05 | コニカミノルタ株式会社 | Method for forming transparent conductive film and plating solution for electrolytic plating |
| US11800648B2 (en) | 2018-02-22 | 2023-10-24 | Konica Minolta, Inc. | Pattern forming method |
| RU2694398C1 (en) * | 2018-12-14 | 2019-07-12 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Елецкий государственный университет им. И.А. Бунина" | Electrolyte for production of iron-nickel alloys |
| CN111321437B (en) * | 2020-03-31 | 2021-04-27 | 安徽铜冠铜箔集团股份有限公司 | Copper-nickel alloy foil and electrodeposition preparation method thereof |
| WO2021260723A1 (en) * | 2020-06-22 | 2021-12-30 | Offgrid Energy Labs Private Limited | Novel eutectic solvent |
| KR102587490B1 (en) * | 2022-12-05 | 2023-10-11 | 동국제강 주식회사 | Plating method of slab for clad steel plate with excellent corrosion resistance and slab for clad steel plate with excellent corrosion resistance manufactured therewith |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1837835A (en) * | 1926-12-20 | 1931-12-22 | Gen Spring Bumper Corp | Process for electrodepositing bright nickel |
| US3833481A (en) * | 1972-12-18 | 1974-09-03 | Buckbel Mears Co | Electroforming nickel copper alloys |
| JPS58133391A (en) * | 1982-02-01 | 1983-08-09 | Oosakashi | Electroplating bath for bright copper-nickel alloy |
| JPS58133392A (en) * | 1982-02-01 | 1983-08-09 | Oosakashi | Electroplating bath for bright copper-nickel-cobalt alloy |
| JPH02285091A (en) | 1989-04-26 | 1990-11-22 | Kobe Steel Ltd | Nickel-copper alloy plating bath |
| JPH04198499A (en) * | 1990-07-20 | 1992-07-17 | Asahi Glass Co Ltd | Copper dissolving bath having potential adjusting mechanism |
| JPH0598488A (en) * | 1991-06-05 | 1993-04-20 | Daiwa Kasei Kenkyusho:Kk | Copper-nickel alloy electroplating bath |
| RU2106436C1 (en) | 1996-07-22 | 1998-03-10 | Тюменский государственный нефтегазовый университет | Electrolyte for depositing copper-nickel alloy |
| RU2365683C1 (en) * | 2008-09-30 | 2009-08-27 | Государственное образовательное учреждение высшего профессионального образования "Пензенский государственный университет" (ПГУ) | Sulphosalicylate electrolyte for sedimentation of copper-nickel alloy |
| KR101077890B1 (en) * | 2008-12-26 | 2011-10-31 | 주식회사 포스코 | Additives for Zn-Ni alloy electrodeposition electrolyte, Zn-Ni alloy electrodeposition electrolyte comprising the same and method for manufacturing Zn-Ni alloy electrodeposited steel sheet using the same |
| MX355999B (en) * | 2012-04-19 | 2018-05-08 | Dipsol Chem | Copper-nickel alloy electroplating bath and plating method. |
| CN104233302B (en) * | 2014-09-15 | 2016-09-14 | 南通万德科技有限公司 | A kind of etching solution and application thereof |
-
2014
- 2014-08-08 JP JP2014162802A patent/JP6439172B2/en active Active
-
2015
- 2015-07-10 MX MX2017001680A patent/MX2017001680A/en unknown
- 2015-07-10 CN CN201580041242.8A patent/CN106574387B/en active Active
- 2015-07-10 BR BR112017002269-9A patent/BR112017002269A2/en not_active IP Right Cessation
- 2015-07-10 RU RU2017107186A patent/RU2666391C1/en not_active IP Right Cessation
- 2015-07-10 KR KR1020177006127A patent/KR102001322B1/en active IP Right Grant
- 2015-07-10 EP EP15829590.7A patent/EP3178968B1/en active Active
- 2015-07-10 SG SG11201700896XA patent/SG11201700896XA/en unknown
- 2015-07-10 WO PCT/JP2015/069944 patent/WO2016021369A1/en active Application Filing
- 2015-07-10 US US15/502,197 patent/US10316421B2/en active Active
- 2015-07-22 TW TW104123663A patent/TWI652378B/en active
-
2017
- 2017-02-06 PH PH12017500218A patent/PH12017500218B1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP3178968A4 (en) | 2018-01-17 |
| KR102001322B1 (en) | 2019-07-17 |
| PH12017500218A1 (en) | 2017-07-10 |
| PH12017500218B1 (en) | 2017-07-10 |
| KR20170038918A (en) | 2017-04-07 |
| US20170241031A1 (en) | 2017-08-24 |
| TW201610241A (en) | 2016-03-16 |
| BR112017002269A2 (en) | 2018-01-16 |
| WO2016021369A1 (en) | 2016-02-11 |
| EP3178968A1 (en) | 2017-06-14 |
| MX2017001680A (en) | 2017-05-09 |
| RU2666391C1 (en) | 2018-09-07 |
| US10316421B2 (en) | 2019-06-11 |
| JP2016037649A (en) | 2016-03-22 |
| EP3178968B1 (en) | 2019-09-04 |
| CN106574387B (en) | 2019-10-18 |
| JP6439172B2 (en) | 2018-12-19 |
| CN106574387A (en) | 2017-04-19 |
| TWI652378B (en) | 2019-03-01 |
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