HK1232261A1 - Copper tin alloy plating bath - Google Patents

Copper tin alloy plating bath

Info

Publication number
HK1232261A1
HK1232261A1 HK17105769.9A HK17105769A HK1232261A1 HK 1232261 A1 HK1232261 A1 HK 1232261A1 HK 17105769 A HK17105769 A HK 17105769A HK 1232261 A1 HK1232261 A1 HK 1232261A1
Authority
HK
Hong Kong
Prior art keywords
plating bath
alloy plating
tin alloy
copper tin
copper
Prior art date
Application number
HK17105769.9A
Other languages
Chinese (zh)
Inventor
辻本貴光
長尾敏光
�原健二
片山順
大塚邦顯
Original Assignee
Okuno Chem Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okuno Chem Ind Co filed Critical Okuno Chem Ind Co
Publication of HK1232261A1 publication Critical patent/HK1232261A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
HK17105769.9A 2014-08-08 2017-06-12 Copper tin alloy plating bath HK1232261A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014162294 2014-08-08
PCT/JP2015/071330 WO2016021439A1 (en) 2014-08-08 2015-07-28 Copper-tin alloy plating bath

Publications (1)

Publication Number Publication Date
HK1232261A1 true HK1232261A1 (en) 2018-01-05

Family

ID=55263710

Family Applications (1)

Application Number Title Priority Date Filing Date
HK17105769.9A HK1232261A1 (en) 2014-08-08 2017-06-12 Copper tin alloy plating bath

Country Status (8)

Country Link
US (1) US20170204528A1 (en)
EP (1) EP3178969B1 (en)
JP (1) JP6048712B2 (en)
CN (1) CN106661752B (en)
CA (1) CA2957587C (en)
HK (1) HK1232261A1 (en)
TW (1) TWI641729B (en)
WO (1) WO2016021439A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019052355A (en) * 2017-09-15 2019-04-04 上村工業株式会社 Tin electroplating or tin-alloy plating solution, and production method of tin or tin-alloy plated material
JP6645609B2 (en) * 2018-07-27 2020-02-14 三菱マテリアル株式会社 Tin alloy plating solution
CN110205659B (en) * 2019-07-17 2020-06-16 广州三孚新材料科技股份有限公司 Electrotinning additive and preparation method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3871013B2 (en) * 1998-11-05 2007-01-24 上村工業株式会社 Tin-copper alloy electroplating bath and plating method using the same
JP2004510053A (en) * 2000-09-20 2004-04-02 デーエル．−イーエヌゲー．マックス　シュレッター　ゲーエムベーハー　ウント　ツェーオー．カーゲー Electrolyte and method for depositing a tin-copper alloy layer
ES2531163T3 (en) * 2002-10-11 2015-03-11 Enthone Procedure and electrolyte for galvanic deposition of bronzes
JP4441726B2 (en) * 2003-01-24 2010-03-31 石原薬品株式会社 Method for producing tin or tin alloy aliphatic sulfonic acid plating bath
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
WO2010055825A1 (en) * 2008-11-11 2010-05-20 ユケン工業株式会社 Zincate zinc plating bath
EP2221396A1 (en) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
JP5313773B2 (en) * 2009-06-04 2013-10-09 三菱伸銅株式会社 Plated copper strip and method for producing the same
JP6133056B2 (en) * 2012-12-27 2017-05-24 ローム・アンド・ハース電子材料株式会社 Tin or tin alloy plating solution

Also Published As

Publication number Publication date
EP3178969A4 (en) 2017-12-27
US20170204528A1 (en) 2017-07-20
EP3178969B1 (en) 2020-01-01
TWI641729B (en) 2018-11-21
CN106661752B (en) 2021-08-10
EP3178969A1 (en) 2017-06-14
WO2016021439A1 (en) 2016-02-11
CA2957587C (en) 2019-03-05
JP6048712B2 (en) 2016-12-21
CA2957587A1 (en) 2016-02-11
TW201612362A (en) 2016-04-01
CN106661752A (en) 2017-05-10
JPWO2016021439A1 (en) 2017-04-27

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