HK1232261A1 - 銅-錫合金鍍敷浴 - Google Patents

銅-錫合金鍍敷浴

Info

Publication number
HK1232261A1
HK1232261A1 HK17105769.9A HK17105769A HK1232261A1 HK 1232261 A1 HK1232261 A1 HK 1232261A1 HK 17105769 A HK17105769 A HK 17105769A HK 1232261 A1 HK1232261 A1 HK 1232261A1
Authority
HK
Hong Kong
Prior art keywords
plating bath
alloy plating
tin alloy
copper tin
copper
Prior art date
Application number
HK17105769.9A
Other languages
English (en)
Inventor
辻本貴光
長尾敏光
�原健二
片山順
大塚邦顯
Original Assignee
Okuno Chem Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okuno Chem Ind Co filed Critical Okuno Chem Ind Co
Publication of HK1232261A1 publication Critical patent/HK1232261A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
HK17105769.9A 2014-08-08 2017-06-12 銅-錫合金鍍敷浴 HK1232261A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014162294 2014-08-08
PCT/JP2015/071330 WO2016021439A1 (ja) 2014-08-08 2015-07-28 銅－スズ合金めっき浴

Publications (1)

Publication Number Publication Date
HK1232261A1 true HK1232261A1 (zh) 2018-01-05

Family

ID=55263710

Family Applications (1)

Application Number Title Priority Date Filing Date
HK17105769.9A HK1232261A1 (zh) 2014-08-08 2017-06-12 銅-錫合金鍍敷浴

Country Status (8)

Country Link
US (1) US20170204528A1 (zh)
EP (1) EP3178969B1 (zh)
JP (1) JP6048712B2 (zh)
CN (1) CN106661752B (zh)
CA (1) CA2957587C (zh)
HK (1) HK1232261A1 (zh)
TW (1) TWI641729B (zh)
WO (1) WO2016021439A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019052355A (ja) * 2017-09-15 2019-04-04 上村工業株式会社 電解Ｓｎ又はＳｎ合金めっき液及びＳｎ又はＳｎ合金めっき物の製造方法
JP6645609B2 (ja) * 2018-07-27 2020-02-14 三菱マテリアル株式会社 錫合金めっき液
CN110205659B (zh) * 2019-07-17 2020-06-16 广州三孚新材料科技股份有限公司 一种电镀锡添加剂及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3871013B2 (ja) * 1998-11-05 2007-01-24 上村工業株式会社 錫−銅合金電気めっき浴及びそれを使用するめっき方法
EP1325175B1 (de) * 2000-09-20 2005-05-04 Dr.Ing. Max Schlötter GmbH & Co. KG Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
ES2531163T3 (es) * 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
US20110210007A1 (en) * 2008-11-11 2011-09-01 Yuken Industry Co., Ltd. Zincate zinc plating bath
EP2221396A1 (en) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
JP5313773B2 (ja) * 2009-06-04 2013-10-09 三菱伸銅株式会社 めっき付き銅条材及びその製造方法
JP6133056B2 (ja) * 2012-12-27 2017-05-24 ローム・アンド・ハース電子材料株式会社 スズまたはスズ合金めっき液

Also Published As

Publication number Publication date
CA2957587A1 (en) 2016-02-11
JP6048712B2 (ja) 2016-12-21
CN106661752A (zh) 2017-05-10
CA2957587C (en) 2019-03-05
TWI641729B (zh) 2018-11-21
CN106661752B (zh) 2021-08-10
US20170204528A1 (en) 2017-07-20
TW201612362A (en) 2016-04-01
WO2016021439A1 (ja) 2016-02-11
EP3178969A4 (en) 2017-12-27
JPWO2016021439A1 (ja) 2017-04-27
EP3178969B1 (en) 2020-01-01
EP3178969A1 (en) 2017-06-14

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