HK1200506A1 - Cyanide-free electroplating solution and application thereof - Google Patents

Cyanide-free electroplating solution and application thereof

Info

Publication number
HK1200506A1
HK1200506A1 HK15100761.0A HK15100761A HK1200506A1 HK 1200506 A1 HK1200506 A1 HK 1200506A1 HK 15100761 A HK15100761 A HK 15100761A HK 1200506 A1 HK1200506 A1 HK 1200506A1
Authority
HK
Hong Kong
Prior art keywords
cyanide
application
electroplating solution
free electroplating
free
Prior art date
Application number
HK15100761.0A
Other languages
Chinese (zh)
Inventor
庄龍三
Original Assignee
Shenzhen United Blueocean New Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51186093&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1200506(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Shenzhen United Blueocean New Technology Co Ltd filed Critical Shenzhen United Blueocean New Technology Co Ltd
Publication of HK1200506A1 publication Critical patent/HK1200506A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/005—Jewels; Clockworks; Coins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
HK15100761.0A 2014-03-04 2015-01-23 Cyanide-free electroplating solution and application thereof HK1200506A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410077619.2A CN103938232B (en) 2014-03-04 2014-03-04 Cyanide-free electroplating solution and application thereof

Publications (1)

Publication Number Publication Date
HK1200506A1 true HK1200506A1 (en) 2015-08-07

Family

ID=51186093

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15100761.0A HK1200506A1 (en) 2014-03-04 2015-01-23 Cyanide-free electroplating solution and application thereof

Country Status (3)

Country Link
CN (1) CN103938232B (en)
HK (1) HK1200506A1 (en)
WO (1) WO2015131796A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103938231B (en) * 2014-03-04 2015-04-01 深圳市联合蓝海科技开发有限公司 Gold electroplating method and hard gold preparation method
CN103938232B (en) * 2014-03-04 2015-04-01 深圳市联合蓝海新技术有限公司 Cyanide-free electroplating solution and application thereof
CN104862752B (en) * 2015-06-12 2016-02-17 深圳市联合蓝海投资控股集团有限公司 The preparation method of modification cyanogen-less gold liquid and application and hard gold
CN106929889A (en) * 2017-05-09 2017-07-07 句容市博远电子有限公司 A kind of cyanideless electro-plating liquid and preparation method thereof
CN106968002A (en) * 2017-05-09 2017-07-21 句容市博远电子有限公司 A kind of electroplate liquid containing dissipated metal
CN110205654A (en) * 2019-06-05 2019-09-06 深圳市尚美金品有限公司 A kind of manufacture craft of hollow jewelry piece
CN110106537A (en) * 2019-06-26 2019-08-09 浙江金卓首饰有限公司 A kind of preparation method of the electroforming solution being used to prepare the hard gold of 3D and the hard gold of 3D
CN111826698A (en) * 2020-07-16 2020-10-27 深圳市联合蓝海黄金材料科技股份有限公司 Method for preparing clock parts by using hard gold
CN114164465B (en) * 2021-11-15 2022-08-16 深圳市联合蓝海黄金材料科技股份有限公司 Sodium gold sulfite gold water and synthesis method and application thereof
CN114686941A (en) * 2022-03-28 2022-07-01 中国地质大学（武汉） Sulfite cyanide-free gold plating electrolyte for reducing gold loss and hard gold electroforming method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1047808C (en) * 1995-02-24 1999-12-29 清华大学 Electromoulding liquid for cyanogen-free electromoulding K gold product
CN100392155C (en) * 2001-02-28 2008-06-04 威兰牙科技术有限责任两合公司 Bath for galvanic deposition of gold and gold alloys, and use thereof
JP4881129B2 (en) * 2006-11-07 2012-02-22 メタローテクノロジーズジャパン株式会社 Non-cyan electrolytic gold plating bath for gold bump or gold wiring formation
CN101560676B (en) * 2009-04-24 2011-09-28 武汉金凰珠宝股份有限公司 Method for electroforming hard gold product
CN102845889B (en) * 2012-10-18 2014-07-30 范社强 Craft flower with gold and silver layers and preparation method of craft flower
CN102862440B (en) * 2012-10-18 2015-06-03 范社强 Silver or gold and silver peony prepared by fresh flower and preparation process thereof
CN103938231B (en) * 2014-03-04 2015-04-01 深圳市联合蓝海科技开发有限公司 Gold electroplating method and hard gold preparation method
CN103938232B (en) * 2014-03-04 2015-04-01 深圳市联合蓝海新技术有限公司 Cyanide-free electroplating solution and application thereof
CN104047037B (en) * 2014-06-16 2015-06-03 深圳市联合蓝海科技开发有限公司 Hardener

Also Published As

Publication number Publication date
WO2015131796A1 (en) 2015-09-11
CN103938232A (en) 2014-07-23
CN103938232B (en) 2015-04-01

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