HK1200506A1 - 種無氰電鍍液及其應用 - Google Patents
種無氰電鍍液及其應用Info
- Publication number
- HK1200506A1 HK1200506A1 HK15100761.0A HK15100761A HK1200506A1 HK 1200506 A1 HK1200506 A1 HK 1200506A1 HK 15100761 A HK15100761 A HK 15100761A HK 1200506 A1 HK1200506 A1 HK 1200506A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- cyanide
- application
- electroplating solution
- free electroplating
- free
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/005—Jewels; Clockworks; Coins
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410077619.2A CN103938232B (zh) | 2014-03-04 | 2014-03-04 | 一种无氰电镀液及其应用 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1200506A1 true HK1200506A1 (zh) | 2015-08-07 |
Family
ID=51186093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15100761.0A HK1200506A1 (zh) | 2014-03-04 | 2015-01-23 | 種無氰電鍍液及其應用 |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN103938232B (zh) |
HK (1) | HK1200506A1 (zh) |
WO (1) | WO2015131796A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103938232B (zh) * | 2014-03-04 | 2015-04-01 | 深圳市联合蓝海新技术有限公司 | 一种无氰电镀液及其应用 |
CN103938231B (zh) * | 2014-03-04 | 2015-04-01 | 深圳市联合蓝海科技开发有限公司 | 一种电镀黄金的方法和硬质黄金的制备方法 |
CN104862752B (zh) * | 2015-06-12 | 2016-02-17 | 深圳市联合蓝海投资控股集团有限公司 | 改性无氰镀金液及其应用和硬质黄金的制备方法 |
CN106968002A (zh) * | 2017-05-09 | 2017-07-21 | 句容市博远电子有限公司 | 一种含稀散金属的电镀液 |
CN106929889A (zh) * | 2017-05-09 | 2017-07-07 | 句容市博远电子有限公司 | 一种无氰电镀液及其制备方法 |
CN110205654A (zh) * | 2019-06-05 | 2019-09-06 | 深圳市尚美金品有限公司 | 一种空心首饰件的制作工艺 |
CN110106537A (zh) * | 2019-06-26 | 2019-08-09 | 浙江金卓首饰有限公司 | 一种用于制备3d硬金的电铸液和3d硬金的制备方法 |
CN111826698A (zh) * | 2020-07-16 | 2020-10-27 | 深圳市联合蓝海黄金材料科技股份有限公司 | 一种使用硬质黄金制备钟表零部件的方法 |
CN114164465B (zh) * | 2021-11-15 | 2022-08-16 | 深圳市联合蓝海黄金材料科技股份有限公司 | 亚硫酸金钠金水及其合成方法和应用 |
CN114686941A (zh) * | 2022-03-28 | 2022-07-01 | 中国地质大学(武汉) | 减少黄金损耗的亚硫酸盐无氰镀金电解液及硬金电铸方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1047808C (zh) * | 1995-02-24 | 1999-12-29 | 清华大学 | 无氰电铸k金制品的电铸液 |
JP4183240B2 (ja) * | 2001-02-28 | 2008-11-19 | ヴィーラント デンタル ウント テクニーク ゲーエムベーハー ウント コー カーゲー | 金および金合金の電着浴とその用法 |
JP4881129B2 (ja) * | 2006-11-07 | 2012-02-22 | メタローテクノロジーズジャパン株式会社 | 金バンプ又は金配線形成用非シアン系電解金めっき浴 |
CN101560676B (zh) * | 2009-04-24 | 2011-09-28 | 武汉金凰珠宝股份有限公司 | 电铸硬黄金制品的方法 |
CN102845889B (zh) * | 2012-10-18 | 2014-07-30 | 范社强 | 一种带有金银层的工艺花卉及其制备方法 |
CN102862440B (zh) * | 2012-10-18 | 2015-06-03 | 范社强 | 一种用鲜花制备的银或金银牡丹花及其制备工艺 |
CN103938232B (zh) * | 2014-03-04 | 2015-04-01 | 深圳市联合蓝海新技术有限公司 | 一种无氰电镀液及其应用 |
CN103938231B (zh) * | 2014-03-04 | 2015-04-01 | 深圳市联合蓝海科技开发有限公司 | 一种电镀黄金的方法和硬质黄金的制备方法 |
CN104047037B (zh) * | 2014-06-16 | 2015-06-03 | 深圳市联合蓝海科技开发有限公司 | 一种硬化剂 |
-
2014
- 2014-03-04 CN CN201410077619.2A patent/CN103938232B/zh active Active
-
2015
- 2015-01-23 HK HK15100761.0A patent/HK1200506A1/zh unknown
- 2015-03-03 WO PCT/CN2015/073547 patent/WO2015131796A1/zh active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN103938232B (zh) | 2015-04-01 |
WO2015131796A1 (zh) | 2015-09-11 |
CN103938232A (zh) | 2014-07-23 |
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