CN1047808C - Electromoulding liquid for cyanogen-free electromoulding K gold product - Google Patents
Electromoulding liquid for cyanogen-free electromoulding K gold product Download PDFInfo
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- CN1047808C CN1047808C CN95101575A CN95101575A CN1047808C CN 1047808 C CN1047808 C CN 1047808C CN 95101575 A CN95101575 A CN 95101575A CN 95101575 A CN95101575 A CN 95101575A CN 1047808 C CN1047808 C CN 1047808C
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- CN
- China
- Prior art keywords
- gold
- electromoulding
- cyanogen
- solution
- diethyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000010931 gold Substances 0.000 title claims abstract description 45
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 45
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 44
- 239000007788 liquid Substances 0.000 title claims description 9
- 229960003330 pentetic acid Drugs 0.000 claims abstract description 14
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000005323 electroforming Methods 0.000 claims description 16
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 13
- -1 diethyl pentetic acid Chemical compound 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 6
- JEOOVNWNJKBHRG-UHFFFAOYSA-N [Na+].[S--].[S--].[Au+3] Chemical compound [Na+].[S--].[S--].[Au+3] JEOOVNWNJKBHRG-UHFFFAOYSA-N 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- ZIALXKMBHWELGF-UHFFFAOYSA-N [Na].[Cu] Chemical compound [Na].[Cu] ZIALXKMBHWELGF-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 abstract description 7
- 150000002500 ions Chemical class 0.000 abstract description 7
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000956 alloy Substances 0.000 abstract description 5
- 229910045601 alloy Inorganic materials 0.000 abstract description 5
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract 1
- PGMYKACGEOXYJE-UHFFFAOYSA-N pentyl acetate Chemical compound CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 abstract 1
- 229910052708 sodium Inorganic materials 0.000 abstract 1
- 239000011734 sodium Substances 0.000 abstract 1
- YZFKUFJKKKTKSB-UHFFFAOYSA-J trisodium;gold(1+);disulfite Chemical compound [Na+].[Na+].[Na+].[Au+].[O-]S([O-])=O.[O-]S([O-])=O YZFKUFJKKKTKSB-UHFFFAOYSA-J 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 26
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000005266 casting Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 3
- 238000004062 sedimentation Methods 0.000 description 3
- 229910003803 Gold(III) chloride Inorganic materials 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- RJHLTVSLYWWTEF-UHFFFAOYSA-K gold trichloride Chemical compound Cl[Au](Cl)Cl RJHLTVSLYWWTEF-UHFFFAOYSA-K 0.000 description 2
- 229940076131 gold trichloride Drugs 0.000 description 2
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical compound [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000003440 toxic substance Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 229960002594 arsenic trioxide Drugs 0.000 description 1
- GOLCXWYRSKYTSP-UHFFFAOYSA-N arsenic trioxide Inorganic materials O1[As]2O[As]1O2 GOLCXWYRSKYTSP-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- KTTMEOWBIWLMSE-UHFFFAOYSA-N diarsenic trioxide Chemical compound O1[As](O2)O[As]3O[As]1O[As]2O3 KTTMEOWBIWLMSE-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- NICDRCVJGXLKSF-UHFFFAOYSA-N nitric acid;trihydrochloride Chemical compound Cl.Cl.Cl.O[N+]([O-])=O NICDRCVJGXLKSF-UHFFFAOYSA-N 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical compound [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- 231100000167 toxic agent Toxicity 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- PICXIOQBANWBIZ-UHFFFAOYSA-N zinc;1-oxidopyridine-2-thione Chemical class [Zn+2].[O-]N1C=CC=CC1=S.[O-]N1C=CC=CC1=S PICXIOQBANWBIZ-UHFFFAOYSA-N 0.000 description 1
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- Adornments (AREA)
Abstract
The present invention relates to an electroplating solution of a non-cyanogen electroplating K gold product, which belongs to the electroplating field. The electroplating solution contains gold sodium sulphite, cupric sodium diethyl triamine pentacetate, diethylene triaminepentaacetic acid and water, a plurality of kinds of alloy ions are simultaneously contained in the electroplating solution, but cyanide ions are not contained, and the alloy ions are simultaneously deposited under the same normality condition so that the purpose that the K gold is electroplated can be achieved. When the electroplating solution is adopted, a situation that the K gold can be quickly electroplated without cyanogen can be achieved, and the gold content is easy to control, and the surface of the product is smooth.
Description
The present invention relates to the electroforming solution of a kind of production karat gold (KARAT GOLD) goods, belong to field of electroplating.
The history of jewellery industry is almost identical with human history, and jewellery market is lasting, and demand increases day by day.In some sense, the progress of jewellery industry indicates the wealth of human civilization society.In jewellery industry, gold jewelry occupies critical positions.The whole world is used for the hundreds of tons of gold of jewellery industry every year, and the output value reaches tens billion of dollars.Current, gold ornaments head and shoulders above the traditional concept of value preserving product, souvenir, become the part that modern's dress ornament is dressed up.It is art up that gold ornaments is moving towards, personalized and popular.Move towards the karat gold ornaments by the proof gold ornaments.
Adopt galvanoplastics to make the karat gold goods, then be over past ten years American-European countries in the manufacturing great development of karat gold goods.Because of the karat gold goods all are better than the proof gold goods at light weight, aspect such as inexpensive, attractive in appearance, durable, has powerful competitive power in the world market, particularly hollow, complex-shaped karat gold ornaments.Up to the present,, all contain cryanide ion in its electroforming solution, thereby aspects such as the operational safety of casting liquid and waste discharge have problems all in the karat gold galvanoplastics of industrial application comparative maturity.
The relevant electroforming solution that does not contain cryanide ion also had report, had several alloy ions simultaneously as No. 1603632, English Patent report in same solution.But there is following shortcoming in this patent: the one, and casting liquid is prepared complicated; The 2nd, still contain toxic substance resemble the white arsenic; Prior then is that its sedimentation rate is very low, when the karat gold of preparation gold content below 80%, and 1/3 when its cathode efficiency has only the electroforming proof gold.
The purpose of this invention is to provide toxic substances such as not containing cryanide ion in a kind of electroforming solution, casting liquid is prepared simple, and Gold Content is controlled in the karat gold, the electroforming solution that sedimentation rate is high.
Contain in the electroforming solution of the present invention: gold sodium sulfide, diethyl pentetic acid, diethyl pentetic acid copper sodium and water.Promptly cast and contain gold, cupric ion in the liquid simultaneously, and do not contain cryanide ion.Can be under same technological specification condition, deposited gold, cupric ion simultaneously reach the purpose of electromoulding K gold.Each component concentration is as follows in the casting liquid:
Gold (with the gold sodium sulfide form) 6～8 grams per liters;
Copper (with diethyl pentetic acid copper na form) 0.5～3.0 grams per liter;
Diethyl pentetic acid 40～60 grams per liters;
(comprise above-mentioned diethyl triamine
Diethyl in the pentaacetic acid copper sodium
Base pentaacetic acid content)
PH value 8.5～10.5;
It is as follows to be described in detail embodiments of the invention:
1, the preparation of sulfurous acid gold salt.
At first gold is dissolved in the chloroazotic acid, behind evaporate to dryness in the water-bath, obtain the solid gold trichloride, with the solid gold trichloride with the dilution of five times of water after, with concentration is that to transfer to pH value be 8.5-10.5 for 40% sodium hydroxide, pH value is preferably 9, it is in 25% the sulfite solution that this solution is slowly joined concentration 50-70 ℃ the time, and for well, gained solution is colourless sulfurous acid gold salts solution (solution 1) to sulphite with S-WAT among the present invention.Solution is brought the gold ion of electromoulding K gold into thus.
2, the preparation of diethyl pentetic acid copper sodium
To join (solution 2) in the 25% sulfite at concentration lower solution after five times of water dilutions of cupric chloride.Take by weighing diethyl pentetic acid and add five times of water post-heating to 60-70 ℃, this be a colourless solution, is 9 with sodium hydroxide conciliation pH value, adds solution 2 again, promptly gets diethyl pentetic acid copper sodium solution (solution 3) thus.This solution is blue look transparent liquid, and solution is brought the cupric ion of electromoulding K gold into thus.
3, according to the content of the gold in the karat gold, cupric ion, in proportion solution 1 is added in the solution 3, dilute with water makes the gold content in the solution reach every liter 6-8 gram, and copper content is 0.5-3 grams, is electromoulding K gold solution.Embodiment 1
Get φ 2 * 30mm low melting point alloy as the electroforming model, model is used ultrasonic cleaning again after oil removing, pickling, washing.Electroplate the thick copper of one deck 2 μ m earlier, begin electroforming then, the electroforming time is 9 hours, and deposit thickness is 180 μ m, and sedimentation velocity reaches 20 μ m/h.
Golden liquid composition of used casting and technological specification are as follows:
Gold (with the gold sodium sulfide form) 8 grams per liters;
Copper (with diethyl pentetic acid copper na form) 2 grams per liters;
Diethyl pentetic acid 50 grams per liters;
(comprise above-mentioned diethyl triamine
Diethyl in the pentaacetic acid copper sodium
Base pentaacetic acid content)
PH value 10;
45 ℃ of temperature;
Current density 1A/dm
2
Slough master mold after the electroforming, the sample surfaces externally and internally is through energy spectrum analysis, and composition sees Table 1.As shown in Table 1, the surfaces externally and internally composition is even.
Table 1: sample surfaces externally and internally composition (%)
| 1# | 2# | 3# | 4# | |||||
| Cu | Au | Cu | Au | Cu | Au | Cu | Au | |
| Before the annealing | 8.4 | 91.6 | 4.9 | 95.1 | 3.6 | 96.4 | 3.4 | 96.6 |
* 1#, 3# are internal surface, and 2#, 4# are outside surface.
As mentioned above, according to the inventive method, can reach the purpose of no cyanogen, quick electromoulding K gold, and alloy content is easy to control, product surface is bright and clean.
Claims (2)
1, a kind of electroforming solution of cyanogen-free electromoulding K gold product, it is characterized in that containing in this electroforming solution: gold sodium sulfide, diethyl pentetic acid, diethyl pentetic acid copper sodium and water, promptly cast and contain gold, cupric ion in the liquid simultaneously, can be under same technological specification condition, simultaneously deposited gold, cupric ion reach the purpose of electromoulding K gold.
2,, it is characterized in that the composition of said electroforming solution is according to the electroforming solution of the said cyanogen-free electromoulding K gold product of claim 1:
Gold (with the gold sodium sulfide form) 6～8 grams per liters;
Copper (with diethyl pentetic acid copper na form) 0.5～3.0 grams per liter;
Diethyl pentetic acid 40～60 grams per liters;
(comprise above-mentioned diethyl triamine
Diethyl in the pentaacetic acid copper sodium
Base pentaacetic acid content)
PH value 8.5～10.5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN95101575A CN1047808C (en) | 1995-02-24 | 1995-02-24 | Electromoulding liquid for cyanogen-free electromoulding K gold product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN95101575A CN1047808C (en) | 1995-02-24 | 1995-02-24 | Electromoulding liquid for cyanogen-free electromoulding K gold product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1109517A CN1109517A (en) | 1995-10-04 |
| CN1047808C true CN1047808C (en) | 1999-12-29 |
Family
ID=5073989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN95101575A Expired - Fee Related CN1047808C (en) | 1995-02-24 | 1995-02-24 | Electromoulding liquid for cyanogen-free electromoulding K gold product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1047808C (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102987664B (en) * | 2011-09-19 | 2014-09-24 | 翟飞恒 | Process for taking K gold jewelry from bottom water |
| CN103938231B (en) * | 2014-03-04 | 2015-04-01 | 深圳市联合蓝海科技开发有限公司 | Gold electroplating method and hard gold preparation method |
| CN103938232B (en) * | 2014-03-04 | 2015-04-01 | 深圳市联合蓝海新技术有限公司 | Cyanide-free electroplating solution and application thereof |
| CN104047037B (en) * | 2014-06-16 | 2015-06-03 | 深圳市联合蓝海科技开发有限公司 | Hardener |
| CN106400060B (en) * | 2016-12-07 | 2019-06-28 | 山东恒银珠宝有限公司 | A kind of no golden liquid of cyanogen sulphite casting |
| CN109504991B (en) * | 2019-01-21 | 2020-08-07 | 南京市产品质量监督检验院 | Cyanide-free 18k gold electroforming solution, and preparation method and application thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4343684A (en) * | 1980-12-19 | 1982-08-10 | Stanley Lechtzin | Method of electroforming and product |
-
1995
- 1995-02-24 CN CN95101575A patent/CN1047808C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4343684A (en) * | 1980-12-19 | 1982-08-10 | Stanley Lechtzin | Method of electroforming and product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1109517A (en) | 1995-10-04 |
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| C14 | Grant of patent or utility model | ||
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