EP0878561A3 - Process and apparatus for the regeneration of tin plating solutions - Google Patents

Process and apparatus for the regeneration of tin plating solutions Download PDF

Info

Publication number
EP0878561A3
EP0878561A3 EP98107584A EP98107584A EP0878561A3 EP 0878561 A3 EP0878561 A3 EP 0878561A3 EP 98107584 A EP98107584 A EP 98107584A EP 98107584 A EP98107584 A EP 98107584A EP 0878561 A3 EP0878561 A3 EP 0878561A3
Authority
EP
European Patent Office
Prior art keywords
chamber
tin
exchange membrane
copper
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP98107584A
Other languages
German (de)
French (fr)
Other versions
EP0878561B1 (en
EP0878561A2 (en
Inventor
Klaus Prof. Rer. Nat. Fischwasser
Hans-Wilhelm Prof. Dr.-Ing. Lieber
Ralph Dr. Rer. Nat. Blittersdorf
Annette Dipl.-Ing. Heuss (Fh)
Ulrich Dr.-Ing. Reiter
Werner Dr. Rer. Nat. Harnischmacher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KM Europa Metal AG
Original Assignee
KM Europa Metal AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KM Europa Metal AG filed Critical KM Europa Metal AG
Publication of EP0878561A2 publication Critical patent/EP0878561A2/en
Publication of EP0878561A3 publication Critical patent/EP0878561A3/en
Application granted granted Critical
Publication of EP0878561B1 publication Critical patent/EP0878561B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/22—Regeneration of process solutions by ion-exchange
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/13—Purification and treatment of electroplating baths and plating wastes

Abstract

Die Erfindung betrifft ein Verfahren und eine Vorrichtung zum Regenerieren von verbrauchten Verzinnungslösungen, welche Zinn und Kupferionen, freien und an die Kupferionen gebundenen Komplexbildner sowie verbrauchtes und unverbrauchtes Reduktionsmittel enthalten. Durch eine entsprechende Spültechnik wird das Spülwasser des Verzinnungsprozesses auf eine 10 bis 15 %ige Verdünnung der Prozeßlösung konzentriert. Diese so hergestellte Regenerationslösung wird einer Elektrolysezelle (2) zugeleitet. Diese umfaßt eine Kathodenkammer (3), eine Mittelkammer (4) und eine Anodenkammer (5). Die Kathodenkammer (3) ist durch eine Anionenaustauschermembran (8) und die Anodenkammer (5) ist durch eine Kationenaustauschermembran (9) von der Mittelkammer (4) getrennt. Die Regenerationslösung wird zunächst in die Kathodenkammer (3) geleitet. Hier wird die Störkomponente Kupfer kathodisch abgeschieden. Nach einer entsprechenden Verweilzeit wird die an Kupfer abgereicherte Regenerationslösung in die Mittelkammer (4) umgepumpt, wo eine Zinnanreicherung von aus der Anodenkammer (5) durch die Kationenaustauschermembran (9) diffundierten Zinnionen erfolgt. Die regenerierte Lösung wird anschließend in den Verzinnungsprozeß zurückgeführt.The invention relates to a method and an apparatus for regenerating used tinning solutions, which tin and copper ions, free and to the Complexing agent bound to copper ions as well as used and unused Contain reducing agents. Appropriate flushing technology turns the flushing water the tinning process to a 10 to 15% dilution of the process solution concentrated. This regeneration solution is an electrolysis cell (2) forwarded. This comprises a cathode chamber (3), a middle chamber (4) and an anode chamber (5). The cathode chamber (3) is through an anion exchange membrane (8) and the anode chamber (5) is through a cation exchange membrane (9) separated from the middle chamber (4). The regeneration solution is first passed into the cathode chamber (3). Here is the interference component Copper cathodically deposited. After a corresponding dwell time, the pumped copper-depleted regeneration solution into the middle chamber (4), where there is an enrichment of tin from the anode chamber (5) through the cation exchange membrane (9) diffused tin ions. The regenerated solution will then returned to the tinning process.

EP98107584A 1997-05-07 1998-04-25 Process and apparatus for the regeneration of tin plating solutions Expired - Lifetime EP0878561B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19719020 1997-05-07
DE19719020A DE19719020A1 (en) 1997-05-07 1997-05-07 Method and device for regenerating tinning solutions

Publications (3)

Publication Number Publication Date
EP0878561A2 EP0878561A2 (en) 1998-11-18
EP0878561A3 true EP0878561A3 (en) 1999-04-28
EP0878561B1 EP0878561B1 (en) 2003-09-03

Family

ID=7828719

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98107584A Expired - Lifetime EP0878561B1 (en) 1997-05-07 1998-04-25 Process and apparatus for the regeneration of tin plating solutions

Country Status (12)

Country Link
US (1) US6120673A (en)
EP (1) EP0878561B1 (en)
JP (1) JPH10317154A (en)
AR (1) AR010155A1 (en)
AT (1) ATE248935T1 (en)
AU (1) AU724854B2 (en)
BR (1) BR9801580A (en)
CA (1) CA2236393C (en)
DE (2) DE19719020A1 (en)
DK (1) DK0878561T3 (en)
ES (1) ES2202686T3 (en)
PT (1) PT878561E (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9901586D0 (en) * 1999-01-25 1999-03-17 Alpha Fry Ltd Process for the recovery of lead and/or tin or alloys thereof from substrate surfaces
JP3455709B2 (en) * 1999-04-06 2003-10-14 株式会社大和化成研究所 Plating method and plating solution precursor used for it
FR2801062B1 (en) * 1999-11-12 2001-12-28 Lorraine Laminage INSTALLATION AND METHOD FOR ELECTROLYTIC DISSOLUTION BY OXIDATION OF A METAL
JP2002317275A (en) * 2001-04-17 2002-10-31 Toto Ltd Method for elongating service life of electroless tinning solution
DE10132478C1 (en) * 2001-07-03 2003-04-30 Atotech Deutschland Gmbh Process for depositing a metal layer and process for regenerating a solution containing metal ions in a high oxidation state
US7195702B2 (en) * 2003-06-06 2007-03-27 Taskem, Inc. Tin alloy electroplating system
US6942810B2 (en) * 2003-12-31 2005-09-13 The Boc Group, Inc. Method for treating metal-containing solutions
US20060096867A1 (en) * 2004-11-10 2006-05-11 George Bokisa Tin alloy electroplating system
ES2303973T3 (en) * 2005-05-25 2008-09-01 Enthone Inc. PROCEDURE AND DEVICE TO ADJUST THE CONCENTRATION OF IONS IN ELECTROLYTES.
JP2006341213A (en) * 2005-06-10 2006-12-21 Es Adviser:Kk Apparatus and method for electrolyzing waste electroless copper plating liquid
DE102006045157B4 (en) 2006-09-25 2020-06-18 Robert Bosch Gmbh Hand tool
KR100934729B1 (en) * 2007-10-29 2009-12-30 (주)화백엔지니어링 Electroless Tin Plating Solution Impurity Removal Apparatus and Method
US20110226613A1 (en) 2010-03-19 2011-09-22 Robert Rash Electrolyte loop with pressure regulation for separated anode chamber of electroplating system
US9404194B2 (en) 2010-12-01 2016-08-02 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
JP5830242B2 (en) 2010-12-28 2015-12-09 ローム・アンド・ハース電子材料株式会社 Method for removing impurities from plating solution
JP5715411B2 (en) 2010-12-28 2015-05-07 ローム・アンド・ハース電子材料株式会社 Method for removing impurities from plating solution
JP5937320B2 (en) 2011-09-14 2016-06-22 ローム・アンド・ハース電子材料株式会社 Method for removing impurities from plating solution
WO2013080326A1 (en) * 2011-11-30 2013-06-06 不二商事株式会社 Method of regenerating plating solution
EP2671968B1 (en) * 2012-06-05 2014-11-26 ATOTECH Deutschland GmbH Method and regeneration apparatus for regenerating a plating composition
US9534308B2 (en) 2012-06-05 2017-01-03 Novellus Systems, Inc. Protecting anodes from passivation in alloy plating systems
JP6706095B2 (en) * 2016-03-01 2020-06-03 株式会社荏原製作所 Electroless plating apparatus and electroless plating method
KR102568350B1 (en) 2017-11-01 2023-08-21 램 리써치 코포레이션 Plating electrolyte concentration control on electrochemical plating equipment
US20190345624A1 (en) * 2018-05-09 2019-11-14 Applied Materials, Inc. Systems and methods for removing contaminants in electroplating systems
CN109467167B (en) * 2018-10-30 2021-12-03 上海大学 Method for removing heavy metals in stainless steel pickling wastewater
EP3875641A1 (en) * 2020-03-04 2021-09-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Method for preparing a medium containing metal salt from an etching process in printed circuit board and / or substrate production
CN111676470A (en) * 2020-05-29 2020-09-18 广东天承科技有限公司 Simple and soluble high-valence tin reduction method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0347016A2 (en) * 1985-01-14 1989-12-20 Macdermid Incorporated Electrodialysis apparatus for the chemical maintenance of electroless copper plating baths
EP0545216A2 (en) * 1991-11-27 1993-06-09 Mcgean-Rohco, Inc. Process for extending the life of a displacement plating bath
DE4310366C1 (en) * 1993-03-30 1994-10-13 Fraunhofer Ges Forschung Method for regenerating aqueous coating baths operating in an electroless manner

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3764503A (en) * 1972-01-19 1973-10-09 Dart Ind Inc Electrodialysis regeneration of metal containing acid solutions
DE2742718C2 (en) * 1977-09-22 1984-04-19 ESTEL HOOGOVENS B.V., 1970 Ijmuiden Method and device for regenerating a tin-plating electrolyte
US4330377A (en) * 1980-07-10 1982-05-18 Vulcan Materials Company Electrolytic process for the production of tin and tin products

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0347016A2 (en) * 1985-01-14 1989-12-20 Macdermid Incorporated Electrodialysis apparatus for the chemical maintenance of electroless copper plating baths
EP0545216A2 (en) * 1991-11-27 1993-06-09 Mcgean-Rohco, Inc. Process for extending the life of a displacement plating bath
DE4310366C1 (en) * 1993-03-30 1994-10-13 Fraunhofer Ges Forschung Method for regenerating aqueous coating baths operating in an electroless manner

Also Published As

Publication number Publication date
BR9801580A (en) 1999-07-06
EP0878561B1 (en) 2003-09-03
AR010155A1 (en) 2000-05-17
DK0878561T3 (en) 2004-01-12
AU724854B2 (en) 2000-10-05
JPH10317154A (en) 1998-12-02
EP0878561A2 (en) 1998-11-18
ES2202686T3 (en) 2004-04-01
CA2236393A1 (en) 1998-11-07
US6120673A (en) 2000-09-19
DE59809451D1 (en) 2003-10-09
ATE248935T1 (en) 2003-09-15
PT878561E (en) 2004-02-27
DE19719020A1 (en) 1998-11-12
CA2236393C (en) 2004-01-20
AU6475798A (en) 1998-11-12

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