EP1190118B1 - Bath system for galvanic deposition of metals - Google Patents

Bath system for galvanic deposition of metals Download PDF

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Publication number
EP1190118B1
EP1190118B1 EP00940346A EP00940346A EP1190118B1 EP 1190118 B1 EP1190118 B1 EP 1190118B1 EP 00940346 A EP00940346 A EP 00940346A EP 00940346 A EP00940346 A EP 00940346A EP 1190118 B1 EP1190118 B1 EP 1190118B1
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EP
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Prior art keywords
bath
water soluble
acid
bath system
metals
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German (de)
French (fr)
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EP1190118A1 (en
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Gerhard Hoffacker
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Rohm and Haas Electronic Materials LLC
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Hoffacker Gerhard
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/46Electroplating: Baths therefor from solutions of silver

Definitions

  • the invention relates to a bath system for the electrodeposition of metals.
  • Galvanic baths for the deposition of precious metals and precious metal alloys have long been known both for decorative and technical applications.
  • the soluble noble metal compounds which are used predominantly are based on cyanide (potassium cyanide, potassium silver cyanide), sulfite (gold sulfite complexes) or contain ammonium (palladium complexes).
  • cyanide potassium cyanide, potassium silver cyanide
  • sulfite gold sulfite complexes
  • ammonium palladium complexes
  • an aqueous bath system for the electrodeposition of metals which contains inter alia a metal (gold), glycine (fission product of a protein), a nitro-containing substance (trinitrobenzenesulfonic acid) and pyridine at a pH of 7.8.
  • a metal gold
  • glycine glycine
  • a nitro-containing substance trinitrobenzenesulfonic acid
  • pyridine a nitro-containing substance
  • aqueous bath system for the electrodeposition of metals comprising inter alia a metal salt with a nitrate-containing substance (Palladiumdiaminodinitrit), which is reduced under the influence of an acid in the presence of urea to metal compounds (palladium).
  • the known bath also has glycine (cleavage product of a protein) and succinimide.
  • Example 7 of the same document uses nicotinamide (vitamin B 3 ) instead of succinimide.
  • the present invention has the object, aqueous bath systems for electrodeposition of metals, in particular of precious metals and their alloys to develop, which are suitable for stable operation both for decorative and technical application and high quality layers of consistent quality in galvanostatic working processes, the bath system free of harmful substances such as cyanides, sulfites and hard complexing agents. Furthermore, the number of complexing of the individual metal-requiring salt formers should be kept as low as possible.
  • the bath system according to the current main claim also allows the addition of various alloying metals, so that a wide range of alloy compositions can be achieved.
  • the bath system is characterized by a high quality of the deposited layers with the simplest handling.
  • high current yields are possible, so that the energy input quantities can be reduced and therefore the costs.
  • the bath system according to the invention is little dependent on fluctuations in the bath components and can be easily supplemented by appropriate additives depending on the individual requirements.
  • the bath system has a long service life.
  • the mentioned protein amino acids can also have one or more mercapto groups in the molecule in addition to one or more amino groups.
  • Examples of such protein amino acids are glycine, alanine, cysteine and methionine.
  • the sulfonic acids mentioned may contain one or more alkyl groups and / or one or more amino groups in the molecule.
  • Examples of these sulfonic acids are in particular amidosulfonic acid, methanesulfonic acid and ⁇ thansulfonklare.
  • nitro compounds To stabilize and complex the bath system, particularly water-soluble nitro compounds have proved to be favorable as acids and / or their derivatives and / or their salts.
  • the mentioned nitro compounds may have at least one nitro group, a carboxylic acid residue and / or sulfonic acid residue. Examples of these nitro acids are 3-nitrophthalic acid, 4-nitrophthalic acid, m-nitrobenzenesulfonic acids.
  • water-soluble nitrogen compounds can be used as acids and / or their derivatives and / or their salts.
  • the nitrogen compounds used contain at least one amino group and / or a carboxylic acid radical and / or sulfonic acid radical.
  • these nitrogen compounds are nicotinic acid, its derivatives and / or salts and / or succinic acid, their derivatives and / or salts, preferably their amide or sulfo compounds.
  • nicotinamide is used, which is the vitamin B complex, in particular the vitamin B 3 , attributed.
  • Sulphon derivatives which have one or two aromatic radicals on the sulphone group at the core of which partial substitution of the carbon-bonded hydrogen by metal, nitro groups, amino groups and halogens can be present can be used as brighteners.
  • a gold bath designed to remove fine gold according to the invention contains the gold, for example, as a protein amino acid derivative of class a), preferably in the form of a gold cysteine complex, the gold concentration being between 0.5 and 30 g / l bath, preferably between 1 and 10 g / l bath, lies.
  • the pH of the bath can be adjusted between 7 and 14, preferably between 8 and 12, in particular between 9 and 10.
  • the adjustment and stabilization of the pH can be carried out with borate buffer, phosphate buffer, citrate buffer or other conventional buffer systems in electroplating.
  • the working temperature of a pertinent bath is set between 20 ° C and 80 ° C, preferably between 40 ° C and 60 ° C.
  • the applicable cathodic current density is between 0.1 A / dm 2 and 15 A / dm 2 , preferably between 0.5 Ndm 2 and 5 A / dm 2 .
  • the exemplary gold bath designed according to the bath system according to the invention contains an excess of the protein derivative used for depositing the fine gold and may contain, in addition to the mentioned sulfonic acids, one of the indicated nitro acids for stabilization and / or additionally a water-soluble nitrogen compound.
  • This water-soluble nitrogen compound may, in addition to the complexation of the gold in a wide pH range, preferably the complexation optionally take over existing alloy metals.
  • the added water-soluble nitrogen compound is preferably at least one heterocyclic organic compound.
  • This heterocyclic organic compound may preferably consist of aromatic heterocycles.
  • amides of nicotinic acid have proven to be particularly advantageous.
  • additional stabilizing agents it is also possible to add amides of succinic acid.
  • a silver bath for depositing fine silver prepared according to the invention contains the silver, for example, as sulfonate of compound class b), preferably in the form of silver methanesulfonate, the silver concentration being between 0.5 and 60 g / l bath, preferably between 2 and 40 g / l Bath, lies.
  • the bath may contain additional portions of the sulfonate used.
  • at least one water-soluble protein-amino acid compound of compound class a) is added to the bath according to the invention.
  • the water-soluble protein-amino acid compound is present in excess of the stoichiometric ratio to silver.
  • At least one water-soluble organic nitrogen compound may additionally be added to the bath system according to the invention.
  • this water-soluble nitrogen compound can preferably take over the complexing of any alloying metals present.
  • the added water-soluble nitrogen compound is preferably at least one heterocyclic organic compound.
  • This heterocyclic organic compound may preferably be aromatic heterocycles. Particularly advantageous have thereby amides of nicotinic acid proved. As additional stabilization also amides of succinic acid can be added.
  • the pH of the bath can be adjusted between 7 and 14, preferably between 8 and 12, in particular between 9 and 10.
  • the adjustment and stabilization of the pH value can be carried out with borate buffer, phosphate buffer, citrate buffer or other conventional buffer systems in electroplating.
  • the working temperature of a pertinent bath is between 10 ° C and 50 ° C, preferably between 20 ° C and 40 ° C.
  • the applicable cathodic current density can be set between 0.1 A / dm 2 and 15 A / dm 2 , preferably between 0.5 A / dm 2 and 5 A / dm 2 .
  • substrates of brass can be directly coated in the silver baths according to the invention.
  • the previously required pre-silvering of brass substrates in pre-silver baths can therefore be omitted and thus a complete operation can be saved.
  • the baths according to the invention for the deposition of fine coatings of noble metals can be added in a known manner alloying metals.
  • Suitable alloy metals are all known metals of the Periodic Table which can be deposited together with the respective noble metal from an aqueous solution.
  • these are the above-mentioned precious metals gold, silver, palladium and combinations of these precious metals with each other.
  • Other preferred alloy metals for gold are copper, zinc, tin, iron and bismuth.
  • alloying metals for silver, especially tin and bismuth have proved to be advantageous.
  • the individual alloying partners can be electrodeposited by enrichment or depletion in the baths in proportions of between 0 and 100%.
  • the specimens are coated over the entire surface.
  • the color of the metallic coating corresponds to the typical fine gold color.
  • the specimens are coated over the entire surface.
  • the color of the metallic coating corresponds to the typical fine silver color.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Description

Die Erfindung betrifft ein Badsystem zur galvanischen Abscheidung von Metallen.The invention relates to a bath system for the electrodeposition of metals.

Galvanische Bäder zur Abscheidung von Edelmetallen und Edelmetall-Legierungen sind sowohl für die Anwendung im dekorativen als auch technischen Bereich schon lange bekannt. Die löslichen Edelmetallverbindungen, die in überwiegendem Maße verwendet werden, sind auf Cyanidbasis (Kaliumgoldcyanid, Kaliumsilbercyanid), Sulfitbasis (Goldsulfitkomplexe) basierend oder enthalten Ammonium (Palladiumkomplexe). Zur Komplexierung und Stabilisierung der Systeme werden entweder ein Überschuß des Salzbildners (Cyanid, Sulfit), an Ammonium sowie sogenannte harte Komplexbildner (Derivate der Amino- oder Nitriloessigsäure etc.) oder Kombinationen hieraus gewählt.Galvanic baths for the deposition of precious metals and precious metal alloys have long been known both for decorative and technical applications. The soluble noble metal compounds which are used predominantly are based on cyanide (potassium cyanide, potassium silver cyanide), sulfite (gold sulfite complexes) or contain ammonium (palladium complexes). To complex and stabilize the systems either an excess of the salt former (cyanide, sulfite), ammonium and so-called hard complexing agents (derivatives of amino or nitriloacetic acid, etc.) or combinations thereof are selected.

Systeme, die Cyanide enthalten, sind in der Regel zwar wegen ihrer Stabilität auch bei erschwerten Einsatzbedingungen bekannt, sind aber aufgrund ihrer Toxizität erhebliche Gefahrenquellen. Da ein erhebliches Interesse daran besteht, die gefährlichen Cyanide zu ersetzen, wurden auf dem Gebiet der Edelmetallbäder dahingehend kontinuierlich weitere Anstrengungen unternommen.Although systems containing cyanides are generally known for their stability even under difficult conditions of use, they are significant sources of danger due to their toxicity. Since there is a significant interest in replacing the dangerous cyanides have been in the field the noble metal baths continue to make further efforts.

So wurde bereits die Verwendung von Sulfit bei Goldbädern oder Thiosulfat bei Silberbädern beschrieben. Diese Systeme bereiten jedoch bezüglich der Stabilität große Schwierigkeiten. Sulfit initiiert auch in komplexierten Lösungen die Selbstreduktion von Edelmetallen, wie beispielsweise Gold. Thiosulfat in Silberbädern kann wegen der geringeren Komplexierungsstärke photochemische Reaktionen freier Silberionen nicht verhindern. Eine zusätzliche Dosierung von Komplexbildnern, wie Ethylendiamintetraessigsäure oder Nitrilotriessigsäure oder deren Derivate verlangsamen den Reaktionsprozeß zwar, können ihn aber nicht verhindern. Zudem ist eine strenge Kontrolle des Arbeits-pH-Wertes erforderlich, so daß bei der Aufarbeitung von Spülwässern und aufgebrauchten Bädern ein deutlicher Mehraufwand notwendig wird. So wird bei der DE-OS-38 05 627 ein Goldsulfitkomplex eingesetzt, wobei für das Bad als weitere Bestandteile gesundheitsschädliche Pyridinverbindungen angegeben werden sowie das Nervengift Antimon.For example, the use of sulfite in gold baths or thiosulfate in silver baths has already been described. However, these systems pose great difficulties in terms of stability. Sulfite also initiates the self-reduction of precious metals, such as gold, in complexed solutions. Thiosulfate in silver baths can not prevent photochemical reactions of free silver ions due to the lower complexation strength. An additional dosage of complexing agents, such as ethylenediaminetetraacetic acid or nitrilotriacetic acid or its derivatives slow down the reaction process, but can not prevent it. In addition, a strict control of the working pH value is required, so that in the workup of rinsing water and spent bathrooms a significant overhead is necessary. So will the case of DE-OS-38 05 627 a gold sulfite complex is used, wherein for the bath as further ingredients harmful pyridine compounds are given as well as the nerve agent antimony.

Alle bisher bekannten, der Fachwelt zur Verfügung stehenden Badsysteme, die statt Cyanid mit Ersatzstoffen betrieben wurden und werden, haben sich wegen des schwierigen Handlings technisch nicht durchsetzen können. So wurde in der WO 92/07975 zwar bereits vorgeschlagen, als Komplexbildner für Palladium resp. Silber Aminoessigsäure und speziell Glycin zu verwenden; allein es handelt sich bei der dahingehenden Badlösung um einen aufwendigen Sonderfall bei der Metallabscheidung und als sog. potentiostatisches Abscheideverfahren ist es nicht mit den als galvanostatisch bezeichneten üblich eingesetzten Abscheideverfahren vergleichbar. Die potentiostatische Abscheidung verlangt unbedingt eine Trennung von Anolyt und Katolyt über eine Membran, so daß dieses bekannte Verfahren für den kontinuierlichen industriellen Einsatz nicht brauchbar ist. Im übrigen würde die alleinige Verwendung von Glycin bei einem galvanostatischen Badverfahren auch nicht zu den gewünschten Ergebnissen führen.All hitherto known bathroom systems which are available to experts and have been operated with substitutes instead of cyanide have not been able to assert themselves technically because of the difficult handling. So was in the WO 92/07975 Although already proposed as a complexing agent for palladium resp. To use silver aminoacetic acid and especially glycine; but it is in the pertinent bath solution to a complex special case in metal deposition and as a so-called potentiostatic deposition method, it is not comparable to the commonly used as galvanostatic deposition methods. The potentiostatic separation necessarily requires a separation of anolyte and Katolyt via a membrane, so that this known method for continuous industrial use is not useful. Moreover, the sole use of glycine in a galvanostatic bath process would not lead to the desired results.

Durch die DE 38 05 627 A ist gemäß Arbeitsbeispiel 6 ein wäßriges Badsystem zur galvanischen Abscheidung von Metallen bekannt, dass unter anderem ein Metall (Gold), Glycin (Spaltprodukt eines Eiweißstoffes), einen nitrohaltigen Stoff (Trinitrobenzolsulfonsäure) und Pyridin bei einem pH-Wert von 7,8 enthält. Durch das Arbeitsbeispiel 2 der US-A-4 406 755 ist ein wäßriges Badsystem zur galvanischen Abscheidung von Metallen bekannt, dass unter anderem ein Metall (Palladium), Succinimid und Nicotinamid (Vitamin B3) enthält.By the DE 38 05 627 A According to working example 6, an aqueous bath system for the electrodeposition of metals is known, which contains inter alia a metal (gold), glycine (fission product of a protein), a nitro-containing substance (trinitrobenzenesulfonic acid) and pyridine at a pH of 7.8. By working example 2 of U.S.-A-4,406,755 An aqueous bath system for the electrodeposition of metals is known, which contains inter alia a metal (palladium), succinimide and nicotinamide (vitamin B 3 ).

Im Arbeitsbeispiel 6 der US-A-4 673 472 ist ein wäßriges Badsystem zur galvanischen Abscheidung von Metallen offenbart, das unter anderem ein Metallsalz mit einem nitrathaltigen Stoff (Palladiumdiaminodinitrit) aufweist, der unter dem Einfluß einer Säure in Gegenwart von Harnstoff zu Metallverbindungen (Palladium) reduziert wird. Das bekannte Bad weist des weiteren Glycin (Spaltprodukt eines Eiweißstoffes) sowie Succinimid auf. In Beispiel 7 desselben Dokumentes wird Nicotinamid (Vitamin B3) anstatt von Succinimid eingesetzt.In working example 6 of the US-A-4,673,472 discloses an aqueous bath system for the electrodeposition of metals, comprising inter alia a metal salt with a nitrate-containing substance (Palladiumdiaminodinitrit), which is reduced under the influence of an acid in the presence of urea to metal compounds (palladium). The known bath also has glycine (cleavage product of a protein) and succinimide. Example 7 of the same document uses nicotinamide (vitamin B 3 ) instead of succinimide.

Die letztgenannten 3 bekannten Badsysteme setzen allesamt gemäß ihren Arbeitsbeispielen Pyridin oder Succinimid ein, die für ihre gesundheitsschädlichen Wirkungen bekannt sind.The latter 3 known bath systems all employ pyridine or succinimide according to their working examples, which are known for their harmful effects.

Ausgehend von diesem Stand der Technik liegt der vorliegenden Erfindung die Aufgabe zugrunde, wäßrige Badsysteme zur galvanischen Abscheidung von Metallen, insbesondere von Edelmetallen und deren Legierungen zu entwickeln, die bei stabiler Arbeitsweise sowohl für die dekorative als auch die technische Anwendung geeignet sind und hochwertige Schichten gleichbleibender Qualität bei galvanostatisch arbeitenden Prozessen ermöglichen, wobei das Badsystem frei von schädlichen Stoffen wie Cyaniden, Sulfiten und harten Komplexbildnern ist. Ferner soll die Anzahl der zur Komplexierung der einzelnen metallerforderlichen Salzbildner so gering wie möglich gehalten werden.Based on this prior art, the present invention has the object, aqueous bath systems for electrodeposition of metals, in particular of precious metals and their alloys to develop, which are suitable for stable operation both for decorative and technical application and high quality layers of consistent quality in galvanostatic working processes, the bath system free of harmful substances such as cyanides, sulfites and hard complexing agents. Furthermore, the number of complexing of the individual metal-requiring salt formers should be kept as low as possible.

Eine dahingehende Aufgabe wird durch ein Badsystem mit den Merkmalen des Anspruches 1 in seiner Gesamtheit gelöst.This object is achieved by a bath system with the features of claim 1 in its entirety.

Es ist für einen Fachmann auf dem Gebiet galvanischer Bäder überraschend, daß sofern das Badsystem nach dem Anspruch 1

  • mindestens ein Metall, insbesondere in Form eines Edelmetalles und/oder einer Edelmetall-Legierung in Form eines wasserlöslichen Salzes,
  • mindestens einen wasserlöslichen Eiweißstoff und/oder
  • mindestens eine wasserlösliche Sulfonsäure und
  • mindestens einen wasserlöslichen nitrohaltigen Stoff und
  • mindestens ein wasserlösliches Tensid und
  • mindestens ein Vitamin, nämlich Vitamin A, B oder H.
enthält, er ein hochwirksames, stabil arbeitendes Abscheidesystem erhält, das frei von Cyaniden, Sulfiten und harten Komplexbildnern gehalten werden kann. Insofern ist das erfindungsgemäße Badsystem ökologisch unbedenklich einsetzbar. Das erfindungsgemäße Badsystem wird auch höchsten Umwelt- und Entsorgungsansprüchen gerecht.It is surprising for a person skilled in the field of galvanic baths that if the bath system according to claim 1
  • at least one metal, in particular in the form of a noble metal and / or a precious metal alloy in the form of a water-soluble salt,
  • at least one water-soluble protein and / or
  • at least one water-soluble sulfonic acid and
  • at least one water-soluble nitro-containing substance and
  • at least one water-soluble surfactant and
  • at least one vitamin, namely vitamin A, B or H.
contains a highly effective, stable separation system that can be kept free of cyanides, sulfites and hard complexing agents. In this respect, the bath system according to the invention is ecologically safe to use. The bath system according to the invention also meets the highest environmental and disposal requirements.

Das Badsystem nach dem geltenden Hauptanspruch ermöglicht darüber hinaus den Zusatz verschiedener Legierungsmetalle, so daß ein breites Spektrum an Legierungszusammensetzungen erreichbar ist. Das Badsystem zeichnet sich darüber hinaus durch eine hohe Qualität der abgeschiedenen Schichten aus bei einfachster Handhabung. Ferner sind hohe Stromausbeuten möglich, so daß die Energieeinsatzmengen reduzierbar sind und mithin die Kosten. Das erfindungsgemäße Badsystem ist wenig von Schwankungen der Badbestandteile abhängig und läßt sich je nach den Einzelanforderungen leicht durch entsprechende Additive ergänzen. Ferner weist das Badsystem eine hohe Lebensdauer auf.The bath system according to the current main claim also allows the addition of various alloying metals, so that a wide range of alloy compositions can be achieved. In addition, the bath system is characterized by a high quality of the deposited layers with the simplest handling. Furthermore, high current yields are possible, so that the energy input quantities can be reduced and therefore the costs. The bath system according to the invention is little dependent on fluctuations in the bath components and can be easily supplemented by appropriate additives depending on the individual requirements. Furthermore, the bath system has a long service life.

Vorzugsweise werden als Lieferant für die Eiweißstoffe Eiweißaminosäuren mit ihren Derivaten (Abkömmlingen) und ihren Salzen eingesetzt sowie zusätzlich oder alternativ Sulfonsäuren mit ihren Derivaten (Abkömmlingen) und ihren Salzen.Preferably used as a supplier of proteins protein amino acids with their derivatives (derivatives) and their salts and additionally or alternatively sulfonic acids with their derivatives (derivatives) and their salts.

Die angesprochenen Eiweißaminosäuren können im Molekül neben einer oder mehrerer Aminogruppen auch eine oder mehrere Mercaptogruppen aufweisen. Beispiele für dahingehende Eiweißaminosäuren sind Glycin, Alanin, Cystein und Methionin.The mentioned protein amino acids can also have one or more mercapto groups in the molecule in addition to one or more amino groups. Examples of such protein amino acids are glycine, alanine, cysteine and methionine.

Die genannten Sulfonsäuren können im Molekül eine oder mehrere Alkylgruppierungen und/oder eine oder mehrere Aminogruppierungen enthalten. Beispiele für dahingehende Sulfonsäuren sind insbesondere Amidosulfonsäure, Methansulfonsäure sowie Äthansulfonsäure.The sulfonic acids mentioned may contain one or more alkyl groups and / or one or more amino groups in the molecule. Examples of these sulfonic acids are in particular amidosulfonic acid, methanesulfonic acid and Äthansulfonsäure.

Zur Stabilisierung und Komplexierung des Badsystems haben sich besonders wasserlösliche Nitroverbindungen als Säuren und/oder deren Derivate und/oder deren Salze als günstig erwiesen. Die angesprochene Nitroverbindungen können mindestens eine Nitrogruppe, einen Carbonsäurerest und/oder Sulfonsäurerest besitzen. Beispiele für dahingehende Nitrosäuren sind 3-Nitrophthalsäure, 4-Nitrophthalsäure, m-Nitrobenzolsulfonsäuren.To stabilize and complex the bath system, particularly water-soluble nitro compounds have proved to be favorable as acids and / or their derivatives and / or their salts. The mentioned nitro compounds may have at least one nitro group, a carboxylic acid residue and / or sulfonic acid residue. Examples of these nitro acids are 3-nitrophthalic acid, 4-nitrophthalic acid, m-nitrobenzenesulfonic acids.

Zur weiteren Stabilisierung der Systeme können wasserlösliche Stickstoffverbindungen als Säuren und/oder deren Derivate und/oder deren Salze eingesetzt werden. Die eingesetzten Stickstoffverbindungen enthalten mindestens eine Aminogruppe und/oder einen Carbonsäurerest und/oder Sulfonsäurerest. Beispiele für diese Stickstoffverbindungen sind Nicotinsäure, deren Derivate und/oder Salze und/oder Bernsteinsäure, deren Derivate und/oder Salze, vorzugsweise deren Amid- oder Sulfoverbindungen.To further stabilize the systems, water-soluble nitrogen compounds can be used as acids and / or their derivatives and / or their salts. The nitrogen compounds used contain at least one amino group and / or a carboxylic acid radical and / or sulfonic acid radical. Examples of these nitrogen compounds are nicotinic acid, its derivatives and / or salts and / or succinic acid, their derivatives and / or salts, preferably their amide or sulfo compounds.

Als besonders vorteilhaft haben sich als Tenside wasserlösliche Derivate der Bernsteinsäure, nämlich ihre Ester, erwiesen. Als Vitamingruppe wird insbesondere Nicotinsäureamid eingesetzt, das dem Vitamin-B-Komplex, insbesondere dem Vitamin-B3, zugerechnet wird.Water-soluble derivatives of succinic acid, namely their esters, have proved to be particularly advantageous as surfactants. As a vitamin group, in particular nicotinamide is used, which is the vitamin B complex, in particular the vitamin B 3 , attributed.

Als Glanzbildner können systemgerecht Sulphonderivate eingesetzt werden, die an der Sulfongruppe eine oder zwei Aromatreste aufweisen, an deren Kern Teilsubstitution des kohlenstoffgebundenen Wasserstoffs durch Metall, Nitrogruppen, Aminogruppen sowie Halogene vorliegen kann.Sulphon derivatives which have one or two aromatic radicals on the sulphone group at the core of which partial substitution of the carbon-bonded hydrogen by metal, nitro groups, amino groups and halogens can be present can be used as brighteners.

Es ist für einen Fachmann auf diesem Gebiet überraschend, daß er durch den Einsatz von Tensiden sowie von Vitaminen die bekannten Bäder schadstofffrei, insbesondere cyanidfrei halten kann und dennoch zu verbesserten Ergebnissen kommt, insbesondere zu erhöhten Abscheidungsraten bei vergleichbarem oder niedrigerem Stromeinsatz. Darüber hinaus werden gegenüber den bekannten Badsystemen verbesserte Oberflächen auch im Hinblick auf ihr Glanzbild erhalten.It is surprising for a person skilled in the art that he can keep the known baths free of pollutants, in particular cyanide-free by the use of surfactants and vitamins and yet leads to improved results, in particular to increased deposition rates at a comparable or lower power input. In addition, compared to the known bath systems improved surfaces are also obtained in terms of their gloss image.

Ein nach der Erfindung konzipiertes Goldbad zur Abscheidung von Feingold enthält das Gold beispielsweise als Eiweißaminosäurederivat der Verbindungsklasse a), vorzugsweise in der Form eines Goldcystein-Komplexes, wobei die Goldkonzentration zwischen 0,5 und 30 g/l Bad, vorzugsweise zwischen 1 und 10 g/l Bad, liegt. Der pH-Wert des Bades kann zwischen 7 und 14, vorzugsweise zwischen 8 und 12, insbesondere zwischen 9 und 10, eingestellt werden. Die Einstellung und Stablisierung des pH-Wertes kann mit Boratpuffer, Phosphatpuffer, Citratpuffer oder anderen in der Galvanotechnik üblichen Puffersystemen erfolgen. Die Arbeitstemperatur eines dahingehenden Bades wird zwischen 20°C und 80°C, vorzugsweise zwischen 40°C und 60°C, eingestellt. Die anwendbare kathodische Stromdichte liegt zwischen 0,1 A/dm2 und 15 A/dm2, vorzugsweise zwischen 0,5 Ndm2 und 5 A/dm2.A gold bath designed to remove fine gold according to the invention contains the gold, for example, as a protein amino acid derivative of class a), preferably in the form of a gold cysteine complex, the gold concentration being between 0.5 and 30 g / l bath, preferably between 1 and 10 g / l bath, lies. The pH of the bath can be adjusted between 7 and 14, preferably between 8 and 12, in particular between 9 and 10. The adjustment and stabilization of the pH can be carried out with borate buffer, phosphate buffer, citrate buffer or other conventional buffer systems in electroplating. The working temperature of a pertinent bath is set between 20 ° C and 80 ° C, preferably between 40 ° C and 60 ° C. The applicable cathodic current density is between 0.1 A / dm 2 and 15 A / dm 2 , preferably between 0.5 Ndm 2 and 5 A / dm 2 .

Das beispielshafte Goldbad nach dem erfindungsgemäßen Badsystem konzipiert enthält zur Abscheidung des Feingoldes einen Überschuß des verwendeten Eiweißaminosäurederivates und kann zur Stabilisierung neben den angesprochenen Sulfonsäuren eine der aufgezeigten Nitrosäuren enthalten und/oder zusätzlich eine wasserlösliche Stickstoffverbindung. Diese wasserlösliche Stickstoffverbindung kann neben der Komplexierung des Goldes in einem weiten pH-Bereich vorzugsweise die Komplexierung gegebenenfalls vorhandener Legierungsmetalle übernehmen. Bei der zugesetzten wasserlöslichen Stickstoffverbindung handelt es sich vorzugsweise um mindestens eine heterocyclische organische Verbindung. Diese heterocyclische organische Verbindung kann vorzugsweise aus aromatischem Hetrocyclen bestehen. Als besonders vorteilhaft haben sich jedoch dabei Amide der Nicotinsäure herausgestellt. Als zusätzliche Stabilisierungsmittel können auch Amide der Bernsteinsäure zugesetzt werden.The exemplary gold bath designed according to the bath system according to the invention contains an excess of the protein derivative used for depositing the fine gold and may contain, in addition to the mentioned sulfonic acids, one of the indicated nitro acids for stabilization and / or additionally a water-soluble nitrogen compound. This water-soluble nitrogen compound may, in addition to the complexation of the gold in a wide pH range, preferably the complexation optionally take over existing alloy metals. The added water-soluble nitrogen compound is preferably at least one heterocyclic organic compound. This heterocyclic organic compound may preferably consist of aromatic heterocycles. However, amides of nicotinic acid have proven to be particularly advantageous. As additional stabilizing agents it is also possible to add amides of succinic acid.

Ein nach der Erfindung hergestelltes Silberbad zur Abscheidung von Feinsilber enthält das Silber beispielsweise als Sulfonat der Verbindungsklasse b), vorzugsweise in der Form von Silbermethansulfonat, wobei die Silberkonzentration zwischen 0,5 und 60 g/l Bad, vorzugsweise zwischen 2 und 40 g/l Bad, liegt. Zur Stabilisierung kann das Bad zusätzliche Anteile an dem verwendeten Sulfonat enthalten. Zur Komplexierung des freien Silbers und zum Schutz gegen photometrische Reaktion wird dem erfindungsgemäßen Bad mindestens eine wasserlösliche Eiweißaminosäure-Verbindung der Verbindungsklasse a) zugesetzt. Die wasserlösliche Eiweißaminosäure-verbindung ist im Überschuß zum stöchiometrischen Verhältnis zum Silber vorhanden.A silver bath for depositing fine silver prepared according to the invention contains the silver, for example, as sulfonate of compound class b), preferably in the form of silver methanesulfonate, the silver concentration being between 0.5 and 60 g / l bath, preferably between 2 and 40 g / l Bath, lies. For stabilization, the bath may contain additional portions of the sulfonate used. For complexing the free silver and for protection against photometric reaction, at least one water-soluble protein-amino acid compound of compound class a) is added to the bath according to the invention. The water-soluble protein-amino acid compound is present in excess of the stoichiometric ratio to silver.

Zur weiteren Stabilisierung des Bades kann dem erfindungsgemäßen Badsystem zusätzlich mindestens eine wasserlösliche organische Stickstoffverbindung zugesetzt werden. Diese wasserlösliche Stickstoffverbindung kann neben der Komplexierung des Silbers in einem weiten pH-Bereich vorzugsweise die Komplexierung gegebenenfalls vorhandener Legierungsmetalle übernehmen. Bei der zugesetzten wasserlöslichen Stickstoffverbindung handelt es sich vorzugsweise um mindestens eine heterocyclische organische Verbindung. Diese heterocyclische organische Verbindung kann vorzugsweise aromatisches Hetrocyclen sein. Besonders vorteilhaft haben sich dabei Amide der Nicotinsäure erwiesen. Als zusätzliche Stabilisierung können auch Amide der Bernsteinsäure zugesetzt werden.To further stabilize the bath, at least one water-soluble organic nitrogen compound may additionally be added to the bath system according to the invention. In addition to the complexation of the silver in a wide pH range, this water-soluble nitrogen compound can preferably take over the complexing of any alloying metals present. The added water-soluble nitrogen compound is preferably at least one heterocyclic organic compound. This heterocyclic organic compound may preferably be aromatic heterocycles. Particularly advantageous have thereby amides of nicotinic acid proved. As additional stabilization also amides of succinic acid can be added.

Der pH-Wert des Bades kann zwischen 7 und 14, vorzugsweise zwischen 8 und 12, insbesondere zwischen 9 und 10 eingestellt werden. Die Einstellung und Stabilisierung des pH-Wertes kann mit Boratpuffer, Phosphatpuffer, Citratpuffer oder anderen in der Galvanotechnik üblichen Puffersystemen erfolgen. Die Arbeitstemperatur eines dahingehenden Bades liegt zwischen 10°C und 50°C, vorzugsweise zwischen 20°C und 40°C. Die anwendbare kathodische Stromdichte kann zwischen 0,1 A/dm2 und 15 A/dm2, vorzugsweise zwischen 0,5 A/dm2 und 5 A/dm2 eingestellt werden.The pH of the bath can be adjusted between 7 and 14, preferably between 8 and 12, in particular between 9 and 10. The adjustment and stabilization of the pH value can be carried out with borate buffer, phosphate buffer, citrate buffer or other conventional buffer systems in electroplating. The working temperature of a pertinent bath is between 10 ° C and 50 ° C, preferably between 20 ° C and 40 ° C. The applicable cathodic current density can be set between 0.1 A / dm 2 and 15 A / dm 2 , preferably between 0.5 A / dm 2 and 5 A / dm 2 .

Besonders vorteilhaft ist, daß in den erfindungsgemäßen Silberbädern Substrate aus Messing direkt beschichtet werden können. Die bisher erforderliche Vorversilberung von Messingsubstraten in Vorsilberbädern kann mithin entfallen und somit ein kompletter Arbeitsvorgang eingespart werden.It is particularly advantageous that substrates of brass can be directly coated in the silver baths according to the invention. The previously required pre-silvering of brass substrates in pre-silver baths can therefore be omitted and thus a complete operation can be saved.

Den erfindungsgemäßen Bädern zur Abscheidung von Feinüberzügen an Edelmetallen können in bekannter Weise Legierungsmetalle zugesetzt werden. Als Legierungsmetalle kommen alle bekannten Metalle des Periodensystems in Betracht, die mit dem jeweiligen Edelmetall zusammen aus einer wässrigen Lösung abscheidbar sind. Insbesondere sind dies die oben genannten Edelmetalle Gold, Silber, Palladium und Kombinationen dieser Edelmetalle untereinander. Als Legierungsmetalle für Gold kommen ferner vorzugsweise Kupfer, Zink, Zinn, Eisen und Wismut in Betracht. Als Legierungsmetalle für Silber haben sich besonders Zinn und Wismut als vorteilhaft erwiesen.The baths according to the invention for the deposition of fine coatings of noble metals can be added in a known manner alloying metals. Suitable alloy metals are all known metals of the Periodic Table which can be deposited together with the respective noble metal from an aqueous solution. In particular, these are the above-mentioned precious metals gold, silver, palladium and combinations of these precious metals with each other. Other preferred alloy metals for gold are copper, zinc, tin, iron and bismuth. As alloying metals for silver, especially tin and bismuth have proved to be advantageous.

Nach den erfindungsgemäßen Bädern können bei Legierungsabscheidungen die einzelnen Legierungspartner durch An- bzw. Abreicherung in den Bädern in Anteilen zwischen 0 und 100 % galvanisch abgeschieden werden.After the baths according to the invention, the individual alloying partners can be electrodeposited by enrichment or depletion in the baths in proportions of between 0 and 100%.

Im folgenden wird anhand zweier Ausführungsbeispiele das schadstoffarme bis schadschofffreie wässrige System zur galvanischen Abscheidung von Edelmetallen und Edelmetall-Legierungen näher vorgestellt.In the following, the low-pollutant to schadschofffree aqueous system for the electrodeposition of precious metals and precious metal alloys is presented in more detail with reference to two embodiments.

Die in den nachstehenden Beispielen aufgeführten Badbestandteile wurden dabei in den angegebenen Mengen gelöst und die Lösung mit entionisiertem Wasser auf 1 I aufgefüllt. Bei den in den einzelnen Beispielen angegebenen Badparametern wurden Prüflinge mit dem entsprechenden Metall bzw. der Metall-Legierung beschichtet.The bath components listed in the examples below were dissolved in the amounts indicated and the solution was made up to 1 l with deionized water. In the bath parameters given in the individual examples, specimens were coated with the appropriate metal or metal alloy.

Bad 1:Bath 1:

2 g/l2 g / l Gold als Gold-Cystein-KomplexGold as a gold cysteine complex 5 g/l5 g / l Methansulfonsäurelösung (70%ig, neutralisiert mit Kaliumhydroxidlösung)Methanesulfonic acid solution (70% neutralized with potassium hydroxide solution) 5 g/l5 g / l Cysteincysteine 20 g/l20 g / l Boraxborax 2 g/l2 g / l 3-Nitrophthalsäure3-nitrophthalic 20 g/l20 g / l BernsteinsäuresulfimidBernsteinsäuresulfimid 5 g/l5 g / l Nicotinsäureamid (Vitamin)Nicotinic acid amide (vitamin) 1 ml/l1 ml / l Tegotain 485 (handelsübliches Tensid, 1 %ige wässrige Lösung)Tegotain 485 (commercial surfactant, 1% aqueous solution) 0,1 ml/l0.1 ml / l Glanzbildner (handelsübliches Sulphonderivat, 1 %ige wässrige Lösung)Brightener (commercially available sulphonone derivative, 1% aqueous solution)

  • Temperatur: 50 - 60°C pH-Wert: 9,5 - 10,5Temperature: 50 - 60 ° C pH: 9.5 - 10.5
  • Stromdichte: ca. 0,5 A/dm2 Current density: approx. 0.5 A / dm 2
  • Anoden: Platiniertes TitanAnodes: Platinized titanium
  • Prüfling: Versilberte Messingblechabschnitte gewinkeltTest item: Silver plated brass sheet metal sections angled

Die Prüflinge sind über die gesamte Oberfläche beschichtet. Die Farbe der metallischen Beschichtung entspricht der typischen Feingoldfarbe.The specimens are coated over the entire surface. The color of the metallic coating corresponds to the typical fine gold color.

Bad 2:Bath 2:

10 g/l10 g / l Silber als SilbermethansulfonatSilver as silver methanesulfonate 5 g/l5 g / l Methansulfonsäurelösung (70 %ig, neutralisiert mit Kaliumhydroxidlösung)Methanesulfonic acid solution (70% neutralized with potassium hydroxide solution) 5 g/l5 g / l Cysteincysteine 20 g/l20 g / l Boraxborax 2 g/l2 g / l 2-Nitrophthalsäure2-nitrophthalic 25 g/l25 g / l Nicotinsäureamid (Vitamin)Nicotinic acid amide (vitamin) 3 ml/l3 ml / l Tegotain 485 (handelsüblihes Tensid, 1 %ige wässrige Lösung)Tegotain 485 (commercial surfactant, 1% aqueous solution) 0,1 ml/l0.1 ml / l Glanzbildner (handelsübliches Sulphondirivat, 1 %ige wässrige Lösung)Brightener (commercially available sulfone derivative, 1% aqueous solution)

  • Temperatur: 25 - 30°CTemperature: 25 - 30 ° C
  • pH-Wert: 9,5 - 10,5pH: 9.5 - 10.5
  • Stromdichte: ca. 1 A/dm2 Current density: approx. 1 A / dm 2
  • Anoden: FeinsilberAnodes: fine silver
  • Prüfling: Messingblechabschnitte gewinkeltTest item: Angled brass sheet sections

Die Prüflinge sind über die gesamte Oberfläche beschichtet. Die Farbe der metallischen Beschichtung entspricht der typischen Feinsilberfarbe.The specimens are coated over the entire surface. The color of the metallic coating corresponds to the typical fine silver color.

Claims (10)

  1. Bath system for galvanic separation of metals, comprising:
    - at least one metal, especially in the form of a precious metal and/or a precious metal alloy in the form of a water soluble salt,
    - at least one water soluble protein and/or
    - at least one water soluble sulphonic acid, and
    - at least one water soluble nitrous material, and
    - at least one water soluble surfactant, and
    - at least one vitamin, namely vitamin A, B, or H.
  2. Bath system according to Claim 1, characterised in that the relevant water soluble protein is present as a part of water soluble protein amino acids in form of an acid and/or its derivative and/or salts of the same in a quantity of 0.1 to 150 g/l of bath.
  3. Bath system according to Claim 1 or 2, characterised in that the relevant water soluble sulphonic acid is present in form of an acid and/or a derivative and/or a salt in a quantity of 0.1 to 200 g/l of bath.
  4. Bath system according to one of the Claims 1 to 3, characterised in that the relevant water soluble nitrous material is present in form of an acid and/or in form of a derivative and/or of salt form in a quantity of 0.1 to 200 g/l of bath, especially of 0.1 to 50 g/l of bath.
  5. Bath system according to one of the Claims 1 to 4, characterised in that the relevant water soluble surfactant is present in a quantity of 0.1 to 5 g/l of bath.
  6. Bath system according to one of the Claims 1 to 5, characterised in that nicotine acid is used as the vitamin.
  7. Bath system according to one of the Claims 3 to 6, characterised in that a water soluble sulphone derivative is present in a quantity of 0.001 to 5 g/l of bath.
  8. Bath system according to one of the Claims 1 to 7, characterised in that the pH value is adjusted to between 7 and 14, especially to between 8 and 12, by means of buffering.
  9. Bath system according to one of the Claims 1 to 8, characterised in that the gold concentration in a pure gold bath lies between 0.5 and 30 g/l of bath, preferably between 1 and 10 g/l of bath.
  10. Bath system according to one of the Claims 1 to 8, characterised in that the silver concentration in a pure silver bath lies between 0.5 and 60 g/l of bath, preferably between 2 and 40 g/l of bath.
EP00940346A 1999-06-19 2000-06-08 Bath system for galvanic deposition of metals Expired - Lifetime EP1190118B1 (en)

Applications Claiming Priority (3)

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DE19928047 1999-06-19
DE19928047A DE19928047A1 (en) 1999-06-19 1999-06-19 Use of pollutant-deficient to pollutant-rich aqueous systems for the galvanic deposition of precious metals and precious metal alloys
PCT/EP2000/005287 WO2000079030A1 (en) 1999-06-19 2000-06-08 Bath system for galvanic deposition of metals

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EP1190118B1 true EP1190118B1 (en) 2010-07-21

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Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1162289A1 (en) * 2000-06-08 2001-12-12 Lucent Technologies Inc. Palladium electroplating bath and process for electroplating
US20040043159A1 (en) * 2002-08-30 2004-03-04 Shipley Company, L.L.C. Plating method
DE10356449B3 (en) * 2003-12-03 2005-01-27 Atotech Deutschland Gmbh Bath for electroless deposition of silver, e.g. on circuit boards, comprises a soluble silver ion source, an acid and an aromatic dicarboxylic acid with electron-withdrawing substituents
US20080035489A1 (en) * 2006-06-05 2008-02-14 Rohm And Haas Electronic Materials Llc Plating process
WO2009061984A2 (en) * 2007-11-09 2009-05-14 Technic, Inc. Method of metallizing solar cell conductors by electroplating with minimal attack on underlying materials of construction
CN101724872B (en) * 2008-10-20 2013-05-08 长沙铂鲨环保设备有限公司 Non-cyanide gilding saline solution
US9274395B2 (en) 2011-11-15 2016-03-01 Ashwin-Ushas Corporation, Inc. Complimentary polymer electrochromic device
GB201200482D0 (en) * 2012-01-12 2012-02-22 Johnson Matthey Plc Improvements in coating technology
CN102691081B (en) * 2012-06-11 2016-01-20 东莞市闻誉实业有限公司 A kind of plating silver solution and electro-plating method
KR20150131346A (en) * 2013-03-15 2015-11-24 엔쏜 인코포레이티드 Electrodeposition of silver with fluoropolymer nanoparticles
US9207515B2 (en) 2013-03-15 2015-12-08 Ashwin-Ushas Corporation, Inc. Variable-emittance electrochromic devices and methods of preparing the same
US9632059B2 (en) 2015-09-03 2017-04-25 Ashwin-Ushas Corporation, Inc. Potentiostat/galvanostat with digital interface
US9482880B1 (en) 2015-09-15 2016-11-01 Ashwin-Ushas Corporation, Inc. Electrochromic eyewear
CN105420770A (en) * 2015-11-30 2016-03-23 苏州市金星工艺镀饰有限公司 Color-change-preventing cyanide-free silver plating electroplating liquid and electroplating method thereof
KR20200010340A (en) 2017-05-23 2020-01-30 삭소니아 에델메탈레 게엠베하 Precious metal salt materials, preparation method thereof and uses for electroplating
US11846036B2 (en) * 2018-08-21 2023-12-19 Umicore Galvanotechnik Gmbh Electrolyte for the cyanide-free deposition of silver
KR102476608B1 (en) 2021-11-19 2022-12-13 (주)피이솔브 Silver Plating Solution

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4406755A (en) * 1982-03-08 1983-09-27 Technic Inc. Bright palladium electrodeposition
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
DE3805627A1 (en) * 1988-02-24 1989-09-07 Wieland Edelmetalle GOLD BATH
CH681893A5 (en) * 1990-10-26 1993-06-15 Thomas Allmendinger
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process

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US6620304B1 (en) 2003-09-16
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DE50015960D1 (en) 2010-09-02
DE19928047A1 (en) 2000-12-21

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