EP3159435B1 - Additive for silver palladium alloy electrolytes - Google Patents

Additive for silver palladium alloy electrolytes Download PDF

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Publication number
EP3159435B1
EP3159435B1 EP15190885.2A EP15190885A EP3159435B1 EP 3159435 B1 EP3159435 B1 EP 3159435B1 EP 15190885 A EP15190885 A EP 15190885A EP 3159435 B1 EP3159435 B1 EP 3159435B1
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EP
European Patent Office
Prior art keywords
silver
palladium
electrolyte
acid
concentration
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EP15190885.2A
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German (de)
French (fr)
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EP3159435A1 (en
Inventor
Bernd Weyhmueller
Alexander Peters
Uwe Manz
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Umicore Galvanotechnik GmbH
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Umicore Galvanotechnik GmbH
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Priority to PL15190885T priority Critical patent/PL3159435T3/en
Priority to EP15190885.2A priority patent/EP3159435B1/en
Priority to TW105132420A priority patent/TW201728787A/en
Priority to PCT/EP2016/075096 priority patent/WO2017067985A1/en
Priority to CN201680061439.2A priority patent/CN108350592A/en
Priority to JP2018520151A priority patent/JP2018535318A/en
Priority to KR1020187014301A priority patent/KR20180072774A/en
Priority to EP16784879.5A priority patent/EP3365478A1/en
Priority to US15/767,234 priority patent/US20190071789A1/en
Publication of EP3159435A1 publication Critical patent/EP3159435A1/en
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/64Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/06Alloys based on silver
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/02Contacts characterised by the material thereof
    • H01H1/021Composite material
    • H01H1/023Composite material having a noble metal as the basic material

Definitions

  • the present invention relates to an electrolyte containing suitable reducing agents for adjusting the composition of silver-palladium layers. Furthermore, these reducing agents contribute to the improvement of the layered appearance and the increase in the brightness (L value, CIE-Lab) of the deposited layers.
  • the present invention also discloses a process for the electrodeposition of silver-rich silver-palladium alloys.
  • Electrical contacts are installed today in virtually all electrical devices. Their application ranges from simple plug-in connectors to safety-relevant, sophisticated switch contacts in the communications sector, for the automotive industry or the aerospace industry. Here are required by the contact surfaces good electrical conductivities, low and long-term stable contact resistance, and good corrosion and wear resistance with the lowest possible insertion forces.
  • plug contacts are often coated with a hard gold alloy layer consisting of gold-cobalt, gold-nickel or gold-iron. These layers have good wear resistance, good solderability, low and long-term stable contact resistance and good corrosion resistance. Due to the rising gold price is looking for cheaper alternatives.
  • silver-rich silver alloys As a replacement for the hard gold coating, the coating with silver-rich silver alloys (hard silver) has proven to be advantageous. Also due to their high electrical conductivity and good oxidation resistance, silver and silver alloys are among the most important contact materials in electrical engineering. These silver alloy layers have, depending on the metal to be alloyed, similar layer properties as the previously used hard gold layers or layer combinations such. Palladium-nickel with gold flash. In addition, the price of silver is relatively low compared to other precious metals, especially hard gold alloys.
  • a limitation for the use of silver is, for example, the lower corrosion resistance of silver in sulfur and chlorine atmospheres compared to hard gold.
  • tarnish made of silver sulfide are in addition to the visible surface change usually no great danger, since silver sulfide is semiconducting, soft and easily displaced by the wiping mating process with sufficient contact forces.
  • start-up layers of silver chloride are non-conductive, hard and not easily displaceable.
  • a higher proportion of silver chloride in the tarnish layer leads to problems with the contact properties ( Literature: Marjorie Myers: Overview of the Use of Silver in Connector Applications; Interconnect & Process Technology, Tyco Electronics Harrisburg, Feb. 2009 ).
  • the US 3,980,531 discloses a cyanide-free electrolyte for the electrodeposition of alloys containing gold, silver and / or palladium.
  • the baths contain a thiosulphate, a sulphite and a borate or phosphate.
  • the deposition of the alloys takes place in the slightly acidic to strongly alkaline pH range.
  • the electrolyte may contain salts of base metals such as arsenic or cadmium.
  • the deposition takes place at current densities of 0.1 to 5 A / dm 2 .
  • the composition of the deposited alloy depends on the concentrations of the metal salts used and the current density used. The appearance of the alloys varies from matt to high gloss. Due to the use of arsenic or cadmium, this electrolyte is no longer up-to-date due to applicable regulations (REACH).
  • the US 6,251,249 B1 discloses electrolytes for the deposition of precious metals on solids. These electrolytes are free of iodides and contain the noble metal to be deposited in the form of alkanesulfonates, alkanesulfonamides and / or alkanesulfonimides. Furthermore, the electrolytes contain an organosulfur compound and / or a carboxylic acid.
  • the deposition of the noble metals is preferably carried out in a temperature range of 20 ° C to 60 ° C.
  • the pH can be between 0 and 12.
  • the electrolytes are suitable for electroless and electrolytic depositions of noble metal layers as well as for dip plating.
  • the examples in the US 6,251,249 B1 refer exclusively to dip plating and deposit either silver or palladium but no silver-palladium alloy. There is no information on the electrolytic deposition of silver-palladium alloys and their nature.
  • EP 0 065 100 A1 is a galvanic, palladium sulfite and an acid-containing palladium electrolyte described.
  • the electrolyte contains sulfuric and / or phosphoric acid and can be used at 20 ° C to 40 ° C. 80 to 95% of the palladium content is added as palladium sulfate, the remainder as palladium sulfite.
  • EP 0 065 100 A21 no statements on the deposition of palladium alloys.
  • the DE 10 2013 215 476 B3 discloses a cyanide-free, acidic and aqueous electrolyte for deposition of silver-palladium alloys.
  • the electrolyte contains a selenium or tellurium compound, urea and / or at least one amino acid and a sulfonic acid.
  • This electrolyte allows the deposition of predominantly silver-containing silver-palladium alloys over a large current density range.
  • semi-matt alloy coatings can be made with this electrolyte.
  • the generated layers show a distinct brownish color.
  • the electrolyte shows a significant dependence of the alloy composition on the applied current density.
  • the alloy can only be influenced by concentration shift of the alloy metals or by variation of the electrolyte temperature during the deposition.
  • electrolytes which are superior in practical use to prior art electrolytes.
  • electrolytes should have sufficiently high stability and allow stable and light alloy compositions to be deposited over as wide a current density range as possible can. It is also important to be able to easily adjust the alloy composition.
  • the electrolytes should remain fully functional even after high current density loading, and the deposits made with these electrolytes should be homogeneous and advantageous for use in contact materials.
  • the composition of the deposited alloy 90 ⁇ 3 wt .-% silver, 10 ⁇ 3 wt .-% palladium and 0 - 3 wt .-% tellurium and / or selenium.
  • Claim 9 relates to a preferred method for the deposition of silver-palladium alloys, in which the electrolyte according to the invention is used.
  • Claims 10 to 12 relate to preferred embodiments of the subject method.
  • the electrolytes according to the invention are suitable as replacement material for hard gold alloys in contact materials.
  • the palladium content in the layer can be easily adjusted by the added reducing agents (brightener additives), depending on the amount of reducing agent added. As the concentration of the reducing agents increases, the palladium content in the deposited layer increases.
  • the electrolyte of the invention exhibits a comparatively high stability, which makes it appear particularly advantageous in industrial applications. With the present electrolyte, high-quality electrical contact materials can advantageously also be produced in frame and high-speed coating systems.
  • the electrolyte preferably contains only the constituents specified above.
  • the electrolyte according to the invention can be used in a current density range of 0.1 to 100 A / dm 2 .
  • a current density range of 0.5 to 20 A / dm 2 is preferred.
  • homogeneous silver-palladium alloy layers in the present invention are meant those layers whose appearance is uniform in color and layer properties. Layer properties are gloss, brightness, hardness and corrosion resistance.
  • the silver-palladium alloy layers are homogeneous in two respects. On the one hand, the silver-palladium alloy layer deposited on a specific electrically conductive substrate is homogeneous according to the above definition.
  • the appearance of the deposited silver-palladium alloys is homogeneous when depositing layers of the same electrolyte, without change of electrolyte composition, temperature and motion, on a plurality of the same electrically conductive substrates at different current densities, which have the same alloy composition and optical appearance have, regardless of the current density, the deposited layers are homogeneous in this case.
  • L * a * b * measurement according to CIEL * a * b (www.cielab.de), where the L * value is the brightness indicates.
  • the brightness values (L * values) of the silver-palladium alloy layers according to the invention are between 80 and 90 L * a * b * (measuring device X-Rite SP62, type of light D65 / 10).
  • the reflectivity is increased by 5 to 40% from the starting value as a function of the applied current density and the concentration of the reducing agent due to the addition of the reducing agents.
  • the reflectivity was measured with the BYK Gardner - mirror TRI-gloss meter. The measurement was carried out at 20 ° incidence and 20 ° angle of incidence of the light beam) in accordance with EN ISO 7668.
  • the gloss measurement of surfaces is known to the person skilled in the art and can be described, for example, in US Pat. Series Electroplating and Surface Treatment. Testing of Functional Metallic Layers, Chap. 4.3: Gloss and Reflection Measurement on Surfaces ", Eugen G. Leuze-Verlag, Saulgau, 1, 1997 Edition, pp. 117-125 "be looked up.
  • Galvanic baths are solutions containing metal salts from which electrochemical metallic precipitates (coatings) can be deposited on substrates (objects). Frequently, such galvanic baths are also referred to as “electrolytes”. Accordingly, the cyanide-free and aqueous electroplating baths of the present invention will hereinafter be referred to as "electrolytes”.
  • the electrolyte according to the invention for the electrolytic deposition of light, homogeneous and predominantly silver-containing silver-palladium alloys and the process for depositing such silver-palladium alloys are explained below, the invention encompassing all embodiments listed below individually and in combination with one another.
  • the metal compounds that can be added to the electrolyte are generally known to those skilled in the art.
  • the silver compound contained in the electrolyte according to the invention is advantageously a silver salt which is soluble in this electrolyte.
  • the silver salts are preferably selected from the group consisting of silver methanesulfonate, silver carbonate, silver sulfate, silver phosphate, silver pyrophosphate, silver nitrate, silver oxide, silver lactate, silver fluoride, silver bromide, silver chloride, silver iodide, silver azide, silver sulfide and silver sulfate.
  • Silver nitrate, silver carbonate, silver methanesulfonate, silver chloride and silver oxide are particularly preferably used in the electrolyte according to the invention.
  • the expert should be guided by the sentence that as few additional substances as possible should be added to the electrolyte. Therefore, the skilled person will most preferably choose as the silver salt to be added the silver methanesulfonate, the silver carbonate or the silver oxide. In the concentration of the silver compound used, the skilled person will have to orientate to the limits given above.
  • the silver compound is preferably present in the electrolyte in a concentration of 1 to 300 g / l of silver, more preferably 2 to 100 g / l of silver, and most preferably between 4 to 15 g / l of silver.
  • the palladium compound to be used is preferably used as the electrolyte-soluble salt or soluble complex.
  • the palladium compound used here is selected from the group consisting of palladium hydroxide, Palladium chloride, palladium sulfate, palladium pyrophosphate, palladium nitrate, palladium phosphate, palladium bromide, palladium P salt (diamminedinitritopalladium (II), palladium glycinates, palladium acetates, tetramminepalladium (II) chloride, tetramminepalladium (II) bromide, palladium methanesulfonate, diamminedinitropalladium (II) chloride, diamminedinitropalladium (II) bromide, diamminedinitropalladium (II) sulfate, potassium di-oxalatopalladate, palladium iodide
  • the palladium compound is added to the electrolyte in a concentration as indicated above.
  • the palladium compound is preferably used in a concentration of 0.1-100 g / l of palladium, and the concentration is very preferably 2-20 g / l of palladium in the electrolyte.
  • the electrolyte according to the invention is aqueous.
  • the silver and palladium compounds to be used are preferably salts soluble in the electrolyte or soluble complexes.
  • the terms "soluble salt” and “soluble complex” therefore refer to those salts and complexes which dissolve in the electrolyte at the working temperature.
  • the working temperature is the temperature at which deposition of the silver-palladium alloy takes place.
  • a substance is considered to be soluble if at least 0.002 g / l of this substance dissolves in the electrolyte at the working temperature.
  • the deposited alloys which contain silver, palladium and selenium and / or tellurium, have a composition which comprises 70-99% by weight of silver, 1-30% by weight of palladium and 0.1-5% by weight of selenium and / or tellurium. The sum of the proportions of silver, palladium and selenium and / or tellurium is 100 wt .-%. According to the invention, the concentrations of the metals to be deposited in the electrolyte in the above-mentioned frame so that a silver-rich alloy results.
  • an alloy is desired in which the silver has a concentration of 70-99% by weight, more preferably 80-95% by weight and most preferably 87-94% by weight.
  • the palladium content of the alloys according to the invention is 1 to 30% by weight, preferably 5 to 20% by weight and more preferably 6 to 13% by weight.
  • the selenium or tellurium content of the alloy according to the invention is 0.1-5 wt .-%, preferably 0.5 to 4 wt .-% and particularly advantageously 1-3 wt .-%.
  • alloys according to the invention which contain silver, palladium and selenium and / or tellurium are referred to as "silver-palladium alloys”.
  • the selenium or tellurium compound which is used in the electrolyte can be selected appropriately by the person skilled in the art within the scope of the above-indicated concentration. As a preferred concentration range, a concentration of between 0.002 and 10 g / l of tellurium and / or selenium and most preferably between 0.1 and 5 g / l of tellurium and / or selenium can be selected.
  • the concentration data relate to the total amount of tellurium and selenium in the electrolyte. Suitable selenium and tellurium compounds are those in which selenium or tellurium are present in the oxidation states +4 or +6.
  • Selenium and tellurium compounds in the electrolyte are advantageously used in which selenium or tellurium in the oxidation state +4 are present.
  • the selenium and tellurium compounds are particularly preferably selected from tellurites, selenites, telluric acid, selenious acid, telluric acid, selenic acid, selenocyanates, tellurocyanates and selenate, and also tellurate.
  • tellurium compound over selenium compounds is generally preferred.
  • Very particular preference is given to adding the tellurium to the electrolyte in the form of a salt of the telluric acid, for example in the form of potassium tellurite.
  • the electrolyte according to the invention contains a compound selected from the group of urea, urea derivatives, thiourea, thiourea derivatives and mixtures thereof and / or one or more ⁇ -amino acids which serve as a complexing agent for the palladium and contribute to increasing the stability of the present electrolyte.
  • Urea derivatives are selected from dimethylurea, ethyleneurea, N, N'-dimethylpropyleneurea and N- (2-hydroxyethyl) ethyleneurea.
  • Thiourea derivatives are, for example, 3-S-isothioroniumpropanesulfonate and N-ethylthiourea.
  • component d) of the electrolyte according to the invention i. the complexing agent for the palladium to urea.
  • the one or more ⁇ -amino acids are selected from the group consisting of alanine, aspartic acid, cysteine, glutamine, glutamic acid, glycine, lysine, leucine, methionine, phenylalanine, phenylglycine, proline, serine, tyrosine and valine.
  • those amino acids are used which have only alkyl groups in the variable radical.
  • the ⁇ -amino acid is selected from alanine, glycine and valine. Very particularly preferred is the use of glycine and / or alanine.
  • Urea, urea derivatives, thiourea, thiourea derivatives and mixtures thereof are used in a concentration of 0.05 to 2 mol / l, preferably 0.2 to 1.5 mol / l, based on the total amount of urea and urea derivatives in the electrolyte.
  • the concentration of the one or more ⁇ -amino acids in the electrolyte according to the invention is 0.005 to 0.5 mol / l, preferably 0.01 to 0.2 mol / l. In the case of ⁇ -amino acids, these concentrations refer to the total amount of ⁇ -amino acid or ⁇ -amino acids, regardless of whether the electrolyte contains one or more ⁇ -amino acids.
  • the electrolyte according to the invention is used in an acidic pH range. Optimal results can be achieved at pH values in the electrolyte of ⁇ 2.
  • the person skilled in the art knows how to adjust the pH of the electrolyte. He will be guided by the idea of introducing as few additional substances into the electrolyte as possible, which may have a negative effect on the deposition of the corresponding alloy.
  • the pH is determined solely by the addition of the sulfonic acid. Strongly acidic deposition conditions then preferably result in which the pH is less than 1 and, where appropriate, even up to 0.1 in borderline cases can also reach up to 0.01. In the optimal case, the pH is around 0.3-0.6.
  • At least one sulfonic acid in a concentration of 0.25-4.75 mol / l is used in the electrolyte according to the invention, the concentration being based on the total amount of the sulfonic acids used.
  • the concentration is preferably 0.5-3 mol / l and most preferably 0.8-2.0 mol / l.
  • the at least one sulfonic acid serves on the one hand to establish a corresponding pH in the electrolyte. On the other hand, their use leads to a further stabilization of the electrolyte according to the invention.
  • the upper limit of the sulfonic acid concentration is due to the fact that at too high a concentration only silver is deposited.
  • sulfonic acid As sulfonic acid, sulfonic acids known in principle to those skilled in the art for use in electroplating can be used.
  • sulfonic acids are selected from the group consisting of ethanesulfonic acid, propanesulfonic acid, benzenesulfonic acid, methanesulfonic acid used. They can be used individually or as mixtures. Very particular preference is given to mentioning propanesulfonic acid and methanesulfonic acid in this context. Most preferably, methanesulfonic acid is used.
  • the at least one reducing agent is selected from formic acid, oxalic acid, ascorbic acid, hydrazine, urotropin, salts and / or esters of sulfurous acid, gaseous sulfites, sulfinic acids and their salts and / or esters, formaldehyde, sodium formaldehyde sulfoxylate, benzaldehyde, benzaldehyde derivatives, hydroxybenzenes and their esters , Polyphenols and their esters, phenolsulfonic acids and their salts and / or esters and glutathione and its salts and / or esters.
  • the reducing agent is selected from hydroxybenzenes, Na-formaldehydsulfoxylat and ascorbic acid.
  • the reducing agent is selected from salts and / or the esters of sulfurous acid.
  • the sulphurous acid salts can be sulphites or hydrogen sulphites.
  • the sulfites and hydrogen sulfites are lithium, sodium, potassium or ammonium salts.
  • the linear or branched acyclic alkyl groups having 1 to 10 carbon atoms are selected from methyl, ethyl, n-propyl, isopropyl, 1-butyl, 2-butyl, tert-butyl, 1-pentyl, 2-pentyl, 3-pentyl, 3-methylbutyl, 2,2-dimethylpropyl and all isomers of hexyl, heptyl, octyl, nonyl and decyl. It is known to the person skilled in the art that cyclic alkyl groups must contain at least three carbon atoms.
  • Cyclic alkyl groups in the context of the present invention advantageously include propyl, butyl, pentyl, hexyl, heptyl, and octyl rings.
  • a cyclic alkyl group in the context of the present invention is selected from the said ring-shaped alkyl groups which carry no further substituents, and from the said ring-shaped alkyl groups, which in turn are bonded to one or more acyclic alkyl groups.
  • the bonding of the cyclic alkyl group to the oxygen atom according to the above formula may be via a cyclic or an acyclic carbon atom of the cyclic alkyl group.
  • Cyclic alkyl groups according to the above definition of the term "alkyl group” also contain a maximum of 10 carbon atoms. If one of the radicals R 1 and R 2 is an aryl group, this is selected from among phenyl, naphthyl and anthracenyl.
  • Gaseous sulfites are SO 2 gas which is introduced into the electrolyte.
  • Benzaldehyde derivatives are selected from benzaldehydesulfonic acid, their salts and esters, e.g. Benzaldehyde-2-sulfonic acid sodium salt, dimethylaminobenzaldehyde, 3-chlorobenzaldehyde, 4-chlorobenzaldehyde, 2-methoxybenzaldehyde, 2-methylbenzaldehyde, 2-nitrobenzaldehyde, 3,5-dibromobenzaldehyde, 3-nitrobenzaldehyde and 3,5-dimethoxybenzaldehyde.
  • Benzaldehyde derivatives are selected from benzaldehydesulfonic acid, their salts and esters, e.g. Benzaldehyde-2-sulfonic acid sodium salt, dimethylaminobenzaldehyde, 3-chlorobenzaldehyde, 4-chlorobenzaldehyde, 2-methoxybenzaldehyde, 2-methyl
  • Hydroxybenzenes are selected from phenol, catechol, resorcinol, hydroquinone, pyrogallol, hydroxyquinone and phloroglucin.
  • the at least one reducing agent is a salt of an organic compound
  • a single acidic hydrogen atom or several or all may be replaced by sodium, potassium, lithium or ammonium ions. If more than one acidic hydrogen atom is replaced by sodium, potassium, lithium or ammonium ions, these cations may be identical or different.
  • the at least one reducing agent may further be an ester of an organic compound.
  • esters are the condensation products of an alcohol and a carboxylic acid. Accordingly, esters of alcohols according to the above list of suitable reducing agents are condensation product of one of the abovementioned alcohols and a carboxylic acid R4-COOH, and esters of carboxylic acids according to the above list are condensation products of one of the abovementioned carboxylic acids with an alcohol R5-OH.
  • R 4 and R 5 are here selected from linear or branched acyclic alkyl groups having 1 to 10 carbon atoms, cyclic alkyl groups having 3 to 10 carbon atoms, aryl or benzyl groups, these groups being defined as described above for R 1 and R 2.
  • At least one reducing agent selected from salts and / or esters of sulfurous acid and gaseous sulfites.
  • the at least one reducing agent is contained in the electrolyte in a concentration of 1 to 100 mmol / l, advantageously in a concentration of 5-30 mmol / l, this concentration refers to the total amount of the above-mentioned reducing agent in the electrolyte.
  • the electrolyte of the invention further contains at least one sulfonic acid in a concentration of 0.25 to 4.75 mol / l.
  • the concentration is preferably 0.5 to 3 mol / l and most preferably 0.8 to 2.0 mol / l.
  • the at least one sulfonic acid serves on the one hand to establish a corresponding pH in the electrolyte. On the other hand, their use leads to a further stabilization of the electrolyte according to the invention.
  • the upper limit of the sulfonic acid concentration is due to the fact that at too high a concentration only silver is deposited.
  • sulfonic acids are selected from the group consisting of methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid and benzenesulfonic acid. Very particular preference is given to mentioning methanesulfonic acid and propanesulfonic acid in this context. Most preferably, methanesulfonic acid is used.
  • the electrolyte according to the invention further contains a surfactant.
  • This surfactant is selected from anionic and nonionic surfactants. Examples thereof are polyethylene glycol adducts, fatty alcohol sulfates, alkyl sulfates, alkyl sulfonates, aryl sulfonates, alkylaryl sulfonates and heteroaryl sulfonates, betaines, fluorosurfactants and their salts and derivatives.
  • Suitable surfactants are known to the person skilled in the art, for example from N. Kanani: Galvanotechik, Hanser-Verlag, Kunststoff-Vienna, 2000, p.
  • the electrolyte according to the invention has a surface tension of greater than or equal to 70 mN / m. If a surfactant is added, its concentration is advantageously chosen so that the surface tension of the electrolyte drops to a value less than or equal to 50 mN / m. The surface tension can be measured with a bubble pressure tensiometer.
  • the present invention relates to a process for the electrolytic deposition of predominantly silver-containing silver-palladium layers of an electrolyte according to the invention, wherein an electrically conductive substrate is immersed in the electrolyte and between an anode in contact with the electrolyte and the substrate as a cathode established a current flow.
  • an electrically conductive substrate is immersed in the electrolyte and between an anode in contact with the electrolyte and the substrate as a cathode established a current flow.
  • the temperature which prevails during the deposition of the silver-palladium alloy can be chosen at will by the person skilled in the art. It will orientate itself on a sufficient deposition rate and applicable current density range on the one hand and on the other hand on economic aspects or the stability of the electrolyte. It is advantageous to set a temperature of 25 ° C to 75 ° C in the electrolyte, preferably between 30 ° C and 65 ° C. Most preferably, the use of the electrolyte at temperatures of 45 ° C to 55 ° C.
  • the current density established during the deposition process in the electrolyte between the cathode and the anode can be selected by one skilled in the art in accordance with the efficiency and the quality of the deposition.
  • the current density in the electrolyte is set to 0.1 to 100 A / dm 2 , depending on the application and coating system type.
  • the current densities can be increased or decreased by adjusting the system parameters such as the structure of the coating cell, flow rates, anode, cathode ratios, etc.
  • the electrolyte according to the invention is an acidic type.
  • the pH should preferably be ⁇ 2, more preferably ⁇ 1. It may be that with respect to the pH of the electrolyte during the electrolysis fluctuations occur. In a preferred embodiment of the subject method, the person skilled in the art therefore proceeds in such a way that he controls the pH during the electrolysis and, if necessary, sets it to the desired value.
  • anodes When using the electrolyte, various anodes can be used. Soluble or insoluble anodes are also suitable, as is the combination of soluble and insoluble anodes. If a soluble anode is used, it is particularly preferred if a silver anode is used.
  • Preferred insoluble anodes are those made of a material selected from the group consisting of platinized titanium, graphite, iridium-transition metal mixed oxide and special carbon material ("Diamond Like Carbon" DLC) or combinations of these anodes.
  • Mixed oxide anodes of iridium-ruthenium mixed oxide, iridium-ruthenium-titanium mixed oxide or iridium-tantalum mixed oxide are particularly preferably used for carrying out the invention. Very particular preference is given to using platinum-titanium anodes. Others can be added Cobley, AJ et al. (The use of insoluble anodes in Acid Sulphate Copper Electrodeposition Solutions, Trans. IMF, 2001, 79 (3), pp. 113 and 114 ) being found.
  • the present invention provides a silver-palladium alloy electrolyte with an added reducing agent for alloying and brightening, and for the electrodeposition of silver-palladium layers, and a corresponding method.
  • the electrolyte contains at least one reducing agent for alloy adjustment and lightening: By adding the at least one reducing agent, the palladium content of the deposited silver-palladium alloy can be adjusted.
  • the deposited alloys according to the invention have a composition which contains 70-99% by weight of silver, 1-30% by weight of palladium and 0.1-5% by weight of selenium and / or tellurium. wherein the sum of the proportions of silver, palladium and selenium and / or tellurium is 100 wt .-%.
  • the electrolyte according to the invention leads to a more homogeneous deposition compared to conventional silver-palladium alloy electrolytes.
  • Layers deposited from conventional silver palladium electrolytes have L * values of 67-78, depending on the applied current density. With the new electrolyte system according to the invention, significantly higher L * values of the deposited layers, uniform over the applied current density range, are achieved. These are between 80 and 90, depending on the reducing agent used.
  • the palladium content of the deposited layers was determined by means of an X-ray fluorescence analysis method (RFA, XRF) (Fischerscope XDV-SDD, software WIN-FTM version 6.28-S-PDM). Measurement results of palladium content: Content of Na formaldehyde sulfoxylate [g / l] Current density [A / dm2] Pd content [% by weight] 0 1 4.2 0 2 3.2 0 3 3.0 0.95 1 5,7 0.95 2 3.5 0.95 3 3.4 4.7 1 9.1 4.7 2 6.8 4.7 3 5.4
  • the brightness of the deposited layers was measured in terms of the L * value according to CIEL * a * b. Measurement results: Content of Na formaldehyde sulfoxylate [g / l] Current density [A / dm2] Brightness [L *] 0 1 78.3 0 2 73.4 0 3 73.0 0.95 1 73.6 0.95 2 83.0 0.95 3 80.5 4.7 1 75.6 4.7 2 77.2 4.7 3 78.8
  • the palladium content of the deposited layers was determined by an X-ray fluorescence analysis method (RFA). Measurement results of palladium content: Ascorbic acid content [g / l] Current density [A / dm2] Pd content [% by weight] 0 1 3.8 0 2 2.9 0 3 2.7 0.14 1 4.2 0.14 2 3.1 0.14 3 2.7 0.42 1 5.3 0.42 2 3.6 0.42 3 3.3
  • the brightness of the deposited layers was measured in terms of the L * value according to CIEL * a * b. Measurement results
  • the palladium content of the deposited layers was determined by an X-ray fluorescence analysis method (RFA). Measurement results of palladium content: Hydroquinone content [g / l] Current density [A / dm2] Pd content [% by weight] 0 1 1.4 0 2 2.9 0 3 2.8 0.5 1 6.8 0.5 2 5.5 0.5 3 6.0 1.0 1 16.8 1.0 2 15.0 1.0 3 14.4
  • the brightness of the deposited layers was measured in terms of the L * value according to CIEL * a * b. Measurement results
  • the palladium content of the deposited layers was determined by an X-ray fluorescence analysis method (RFA). Measurement results of palladium content: Sodium sulphite content [g / l] Current density [A / dm2] Pd content [% by weight] 0 1 6.2 0 2 4.9 0 3 3.5 1.0 1 10.0 1.0 2 8.1 1.0 3 8.1 2.0 1 15.6 2.0 2 12.3 2.0 3 11.7
  • the brightness of the deposited layers was measured in terms of the L * value according to CIEL * a * b. Measurement results

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Description

Die vorliegende Erfindung bezieht sich auf einen Elektrolyten, der geeignete Reduktionsmittel zur Einstellung der Zusammensetzung von Silber-Palladium-Schichten enthält. Des Weiteren tragen diese Reduktionsmittel zur Verbesserung der Schichtoptik und Erhöhung der Helligkeit (L-Wert, CIE-Lab) der abgeschiedenen Schichten bei. Die vorliegende Erfindung offenbart außerdem ein Verfahren zur elektrolytischen Abscheidung von silberreichen Silber-Palladium-Legierungen.The present invention relates to an electrolyte containing suitable reducing agents for adjusting the composition of silver-palladium layers. Furthermore, these reducing agents contribute to the improvement of the layered appearance and the increase in the brightness (L value, CIE-Lab) of the deposited layers. The present invention also discloses a process for the electrodeposition of silver-rich silver-palladium alloys.

Elektrische Kontakte werden heute in praktisch allen elektrischen Geräten verbaut. Ihre Anwendung reicht von einfachen Steckverbindern bis hin zu sicherheitsrelevanten, anspruchsvollen Schaltkontakten im Kommunikationssektor, für die Automobilindustrie oder die Luft- und Raumfahrttechnik. Dabei werden von den Kontaktoberflächen gute elektrische Leitfähigkeiten, geringe und langzeitstabile Übergangswiderstände, sowie gute Korrosions- und Verschleißbeständigkeiten mit möglichst niedrigen Steckkräften gefordert. In der Elektrotechnik werden Steckkontakte oft mit einer Hartgold-Legierungsschicht, bestehend aus Gold-Kobalt, Gold-Nickel oder Gold-Eisen, beschichtet. Diese Schichten besitzen eine gute Verschleißbeständigkeit, eine gute Lötbarkeit, einen geringen, sowie langzeitstabilen Kontaktübergangswiderstand und eine gute Korrosionsbeständigkeit. Aufgrund des steigenden Goldpreises wird nach preisgünstigeren Alternativen gesucht.Electrical contacts are installed today in virtually all electrical devices. Their application ranges from simple plug-in connectors to safety-relevant, sophisticated switch contacts in the communications sector, for the automotive industry or the aerospace industry. Here are required by the contact surfaces good electrical conductivities, low and long-term stable contact resistance, and good corrosion and wear resistance with the lowest possible insertion forces. In electrical engineering, plug contacts are often coated with a hard gold alloy layer consisting of gold-cobalt, gold-nickel or gold-iron. These layers have good wear resistance, good solderability, low and long-term stable contact resistance and good corrosion resistance. Due to the rising gold price is looking for cheaper alternatives.

Als Ersatz für die Hartgoldbeschichtung hat sich die Beschichtung mit silberreichen Silber-Legierungen (Hartsilber) als vorteilhaft erwiesen. Auch wegen der hohen elektrischen Leitfähigkeit und guten Oxidationsbeständigkeit gehören Silber und Silberlegierungen zu den bedeutendsten Kontaktwerkstoffen in der Elektrotechnik. Diese Silberlegierungsschichten besitzen, je nach Metall das zulegiert wird, ähnliche Schichteigenschaften wie die bisher verwendeten Hartgoldschichten bzw. Schichtkombinationen wie z.B. Palladium-Nickel mit Gold-Flash. Hinzu kommt, dass der Preis für Silber im Vergleich zu anderen Edelmetallen, insbesondere Hartgoldlegierungen, relativ niedrig liegt.As a replacement for the hard gold coating, the coating with silver-rich silver alloys (hard silver) has proven to be advantageous. Also due to their high electrical conductivity and good oxidation resistance, silver and silver alloys are among the most important contact materials in electrical engineering. These silver alloy layers have, depending on the metal to be alloyed, similar layer properties as the previously used hard gold layers or layer combinations such. Palladium-nickel with gold flash. In addition, the price of silver is relatively low compared to other precious metals, especially hard gold alloys.

Eine Einschränkung für die Verwendung des Silbers ist z.B. die gegenüber Hartgold geringere Korrosionsresistenz des Silbers in schwefel- und chlorhaltigen Atmosphären. Anlaufschichten aus Silbersulfid stellen dabei außer der sichtbaren Oberflächenveränderung meist keine große Gefahr dar, da Silbersulfid halbleitend, weich und in der Regel durch den wischenden Steckvorgang bei ausreichenden Kontaktkräften leicht zu verdrängen ist. Dagegen sind Anlaufschichten aus Silberchlorid nichtleitend, hart und nicht leicht verdrängbar. Damit führt ein höherer Anteil an Silberchlorid in den Anlaufschicht zu Problemen mit den Kontakteigenschaften ( Literatur: Marjorie Myers: Overview of the Use of Silver in Connector Applications; Interconnect & Process Technology, Tyco Electronics Harrisburg, Feb. 2009 ).A limitation for the use of silver is, for example, the lower corrosion resistance of silver in sulfur and chlorine atmospheres compared to hard gold. tarnish made of silver sulfide are in addition to the visible surface change usually no great danger, since silver sulfide is semiconducting, soft and easily displaced by the wiping mating process with sufficient contact forces. In contrast, start-up layers of silver chloride are non-conductive, hard and not easily displaceable. Thus, a higher proportion of silver chloride in the tarnish layer leads to problems with the contact properties ( Literature: Marjorie Myers: Overview of the Use of Silver in Connector Applications; Interconnect & Process Technology, Tyco Electronics Harrisburg, Feb. 2009 ).

Die US 3,980,531 offenbart einen cyanidfreien Elektrolyten für die galvanische Abscheidung von Legierungen, die Gold, Silber und/oder Palladium enthalten. Die Bäder enthalten ein Thiosulfat, ein Sulfit und ein Borat oder Phosphat. Die Abscheidung der Legierungen erfolgt im schwach sauren bis stark alkalischen pH-Bereich. Optional kann der Elektrolyt Salze unedler Metalle wie Arsen oder Cadmium enthalten. Die Abscheidung erfolgt bei Stromdichten von 0,1 bis 5 A/dm2. Bei den Bädern gemäß US 3,980,531 h ängt die Zusammensetzung der abgeschiedenen Legierung von den Konzentrationen der eingesetzten Metallsalze und der verwendeten Stromdichte ab. Das Aussehen der Legierungen variiert von matt bis hochglänzend. Durch die Verwendung von Arsen bzw. Cadmium ist dieser Elektrolyt aufgrund von geltenden Verordnungen (REACH) nicht mehr zeitgemäß.The US 3,980,531 discloses a cyanide-free electrolyte for the electrodeposition of alloys containing gold, silver and / or palladium. The baths contain a thiosulphate, a sulphite and a borate or phosphate. The deposition of the alloys takes place in the slightly acidic to strongly alkaline pH range. Optionally, the electrolyte may contain salts of base metals such as arsenic or cadmium. The deposition takes place at current densities of 0.1 to 5 A / dm 2 . According to the baths US 3,980,531 h The composition of the deposited alloy depends on the concentrations of the metal salts used and the current density used. The appearance of the alloys varies from matt to high gloss. Due to the use of arsenic or cadmium, this electrolyte is no longer up-to-date due to applicable regulations (REACH).

Die US 6,251,249 B1 offenbart Elektrolyte für die Abscheidung von Edelmetallen auf Festkörpern. Diese Elektrolyte sind frei von Iodiden und enthalten das abzuscheidende Edelmetall in Form von Alkansulfonaten, Alkansulfonamiden und/oder Alkansulfonimiden. Des Weiteren enthalten die Elektrolyte eine Organoschwefelverbindung und/oder eine Carbonsäure. Die Abscheidung der Edelmetalle erfolgt bevorzugt in einem Temperaturbereich von 20°C bis 60°C. Der pH-Wert kann zwischen 0 und 12 liegen. Die Elektrolyte eignen sich für stromlose und elektrolytische Abscheidungen von Edelmetallschichten sowie für das Tauchplattieren. Die Beispiele in der US 6,251,249 B1 beziehen sich ausschließlich auf das Tauchplattieren, und es wird entweder Silber oder Palladium abgeschieden, aber keine Silber-Palladium-Legierung. Es gibt keine Informationen zur elektrolytischen Abscheidung von Silber-Palladium-Legierungen und deren Beschaffenheit.The US 6,251,249 B1 discloses electrolytes for the deposition of precious metals on solids. These electrolytes are free of iodides and contain the noble metal to be deposited in the form of alkanesulfonates, alkanesulfonamides and / or alkanesulfonimides. Furthermore, the electrolytes contain an organosulfur compound and / or a carboxylic acid. The deposition of the noble metals is preferably carried out in a temperature range of 20 ° C to 60 ° C. The pH can be between 0 and 12. The electrolytes are suitable for electroless and electrolytic depositions of noble metal layers as well as for dip plating. The examples in the US 6,251,249 B1 refer exclusively to dip plating and deposit either silver or palladium but no silver-palladium alloy. There is no information on the electrolytic deposition of silver-palladium alloys and their nature.

In der EP 0 065 100 A1 ist ein galvanisches, Palladiumsulfit und eine Säure enthaltender Palladiumelektrolyt beschrieben. Der Elektrolyt enthält Schwefel- und/oder Phosphorsäure und kann bei 20°C bis 40 °C benutzt werden. 80 bis 95 % des Palladiumgehalts werden als Palladiumsulfat, der Rest als Palladiumsulfit zugesetzt. Allerdings macht die EP 0 065 100 A21 keinerlei Aussagen zur Abscheidung von Palladiumlegierungen.In the EP 0 065 100 A1 is a galvanic, palladium sulfite and an acid-containing palladium electrolyte described. The electrolyte contains sulfuric and / or phosphoric acid and can be used at 20 ° C to 40 ° C. 80 to 95% of the palladium content is added as palladium sulfate, the remainder as palladium sulfite. However, that does EP 0 065 100 A21 no statements on the deposition of palladium alloys.

Die DE 10 2013 215 476 B3 offenbart einen cyanidfreien, sauren und wässrigen Elektrolyten zu Abscheidung von Silber-Palladium-Legierungen. Neben Silber- und Palladiumsalzen enthält der Elektrolyt eine Selen- oder Tellurverbindung, Harnstoff und/oder mindestens eine Aminosäure sowie eine Sulfonsäure. Dieser Elektrolyt erlaubt die Abscheidung von überwiegend Silber enthaltenden Silber-Palladium-Legierungen über einen großen Stromdichtebereich. Allerdings können mit diesem Elektrolyten nur seidenmatte Legierungsüberzüge hergestellt werden. Mit steigender Stromdichte zeigen die erzeugten Schichten einen deutlichen Braunstich. Gleichzeitig zeigt der Elektrolyte eine deutliche Abhängigkeit der Legierungszusammensetzung von der angelegten Stromdichte. Die Legierung kann nur durch Konzentrationsverschiebung der Legierungsmetalle oder durch Variation der Elektrolyttemperatur bei der Abscheidung beeinflusst werden.The DE 10 2013 215 476 B3 discloses a cyanide-free, acidic and aqueous electrolyte for deposition of silver-palladium alloys. In addition to silver and palladium salts, the electrolyte contains a selenium or tellurium compound, urea and / or at least one amino acid and a sulfonic acid. This electrolyte allows the deposition of predominantly silver-containing silver-palladium alloys over a large current density range. However, only semi-matt alloy coatings can be made with this electrolyte. With increasing current density, the generated layers show a distinct brownish color. At the same time, the electrolyte shows a significant dependence of the alloy composition on the applied current density. The alloy can only be influenced by concentration shift of the alloy metals or by variation of the electrolyte temperature during the deposition.

Die im Stand der Technik bekannten Elektrolyte zur elektrolytischen Abscheidung von Silber-Palladium-Legierungen gestatten es nicht, Silber-Palladium-Legierungen abzuscheiden, die über einen großen Stromdichtebereich sowohl hochglänzend sind als auch ein konstantes Verhältnis von Silber zu Palladium aufweisen. Ebenso kann die Legierungszusammensetzung durch Verschieben der Badparameter nur sehr begrenzt eingestellt werden. Bei den bisher bekannten Bädern sinkt der Palladium-Anteil in den abgeschiedenen Schichten mit steigender Stromdichte. Gleichzeitig ändert sich die Optik der abgeschiedenen Schichten: Mit zunehmender Stromdichte weisen die Schichten einen immer stärker werdenden Braunstich auf. Gleichzeitig nehmen Inhomogenitäten, wie Schleier und Flecken, in der Schicht zu.Known in the art electrolytes for the electrodeposition of silver-palladium alloys do not allow to deposit silver-palladium alloys, which are both high gloss over a large current density range and also have a constant ratio of silver to palladium. Likewise, the alloy composition can be adjusted only very limited by shifting the bath parameters. In the previously known baths, the proportion of palladium in the deposited layers decreases with increasing current density. At the same time, the appearance of the deposited layers changes: As the current density increases, the layers show an increasingly strong browning. At the same time, inhomogeneities, such as veils and stains, increase in the layer.

Trotz der zahlreichen, schon bekannten Elektrolyte für die elektrolytische Abscheidung von Silber-Palladium-Legierungen besteht daher weiterhin ein Bedürfnis danach, Elektrolyte anzubieten, die im praktischen Einsatz den Elektrolyten des Standes der Technik überlegen sind. Für die industrielle Anwendung sollten derartige Elektrolyte eine ausreichend große Stabilität aufweisen und es erlauben, stabile und helle Legierungszusammensetzungen über einen möglichst großen Stromdichtebereich hinweg abscheiden zu können. Ebenso ist es wichtig, die Legierungszusammensetzung einfach einstellen zu können. Die Elektrolyte sollten auch nach hoher Stromdichtebelastung voll funktionsfähig bleiben, und die mit diesen Elektrolyten hergestellten Abscheidungen sollten homogen und im Hinblick auf den Einsatz in Kontaktwerkstoffen vorteilhaft sein. Besonders vorteilhaft beträgt die Zusammensetzung der abgeschiedenen Legierung 90 ± 3 Gew.-% Silber, 10 ± 3 Gew.-% Palladium und 0 - 3 Gew.-% Tellur und/oder Selen.Thus, despite the numerous electrolytes already known for the electrolytic deposition of silver-palladium alloys, there continues to be a need to offer electrolytes which are superior in practical use to prior art electrolytes. For industrial use, such electrolytes should have sufficiently high stability and allow stable and light alloy compositions to be deposited over as wide a current density range as possible can. It is also important to be able to easily adjust the alloy composition. The electrolytes should remain fully functional even after high current density loading, and the deposits made with these electrolytes should be homogeneous and advantageous for use in contact materials. Particularly advantageously, the composition of the deposited alloy 90 ± 3 wt .-% silver, 10 ± 3 wt .-% palladium and 0 - 3 wt .-% tellurium and / or selenium.

Diese und weitere sich aus dem nächstliegenden Stand der Technik dem Fachmann in nahe liegender Weise erschließenden Aufgaben werden durch einen Elektrolyten gemäß vorliegendem Anspruch 1 gelöst. Weitere bevorzugte Ausgestaltungen werden in den von Anspruch 1 abhängigen Unteransprüchen zu schützen gesucht. Anspruch 9 bezieht sich auf ein bevorzugtes Verfahren zur Abscheidung von Silber-Palladium-Legierungen, bei dem der erfindungsgemäße Elektrolyt zum Einsatz kommt. Die Ansprüche 10 bis 12 betreffen bevorzugte Ausführungsformen des gegenständlichen Verfahrens.These and other objects to be deduced from the closest prior art by those skilled in the art are solved by an electrolyte according to the present invention. Further preferred embodiments are sought in the dependent of claim 1 dependent claims. Claim 9 relates to a preferred method for the deposition of silver-palladium alloys, in which the electrolyte according to the invention is used. Claims 10 to 12 relate to preferred embodiments of the subject method.

Die Aufgabe, einen cyanidfreien, sauren und wässrigen Elektrolyten zur elektrolytischen Abscheidung von hellen, überwiegend Silber enthaltenden Silber-Palladium-Legierungen bereitzustellen, wird erfindungsgemäß gelöst durch einen wässrigen Elektrolyten, der in gelöster Form folgende Bestandteile aufweist:

  1. a) eine Silberverbindung in einer Konzentration von 1 - 300 g/l Silber;
  2. b) eine Palladiumverbindung in einer Konzentration von 0,1 - 100 g/l Palladium;
  3. c) eine Tellur- und/oder Selenverbindung in einer Konzentration von 0,002 - 10 g/l Tellur und/oder Selen, bezogen auf die Gesamtmenge von Tellur und Selen im Elektrolyten;
  4. d) eine Verbindung ausgewählt aus der Gruppe Harnstoff, Harnstoffderivate, Thioharnstoff und Thioharnstoffderivate und Gemischen davon in einer Konzentration von 0,05 - 2 mol/l, bezogen auf die Gesamtmenge von Harnstoff, Harnstoffderivaten, Thioharnstoff und Thioharnstoffderivaten im Elektrolyten und/oder eine oder mehrere Aminosäuren, ausgewählt aus der Gruppe bestehend aus Alanin, Asparaginsäure, Cystein, Glutamin, Glutaminsäure, Glycin, Lysin, Leucin, Methionin, Phenylalanin, Phenylglycin, Prolin, Serin, Tyrosin und Valin in einer Konzentration von 0,005 - 0,5 mmol/l, bezogen auf die Gesamtmenge von Aminosäuren im Elektrolyten;
  5. e) mindestens eine Sulfonsäure in einer Konzentration von 0,25 - 4,75 mol/l, bezogen auf die Gesamtmenge der Sulfonsäuren,
  6. f) mindestens ein Reduktionsmittel, ausgewählt aus der Gruppe Ameisensäure, Oxalsäure, Ascorbinsäure, Hydrazin, Urotropin, Salzen und/oder Estern der schwefligen Säure, gasförmigen Sulfiten, Sulfinsäuren und deren Salzen und/oder Estern, Formaldehyd, Natriumformaldehydsulfoxylat, Benzaldehyd, Benzaldehydderivaten, Hydroxybenzolen und deren Estern, Polyphenolen und deren Estern, Phenolsulfonsäuren und deren Salzen und/oder Estern und Glutathion sowie dessen Salzen und/oder Estern
in einer Konzentration von 0,1 mmol/l - 1 mol/l, bezogen auf die Gesamtmenge dieser Reduktionsmittel.The object of providing a cyanide-free, acidic and aqueous electrolyte for the electrolytic deposition of bright, predominantly silver-containing silver-palladium alloys is achieved according to the invention by an aqueous electrolyte which has the following constituents in dissolved form:
  1. a) a silver compound in a concentration of 1 - 300 g / l silver;
  2. b) a palladium compound in a concentration of 0.1-100 g / l palladium;
  3. c) a tellurium and / or selenium compound in a concentration of 0.002 to 10 g / l tellurium and / or selenium, based on the total amount of tellurium and selenium in the electrolyte;
  4. d) a compound selected from the group of urea, urea derivatives, thiourea and thiourea derivatives and mixtures thereof in a concentration of 0.05 to 2 mol / l, based on the total amount of urea, urea derivatives, thiourea and thiourea derivatives in the electrolyte and / or one or more amino acids selected from the group consisting of alanine, aspartic acid, cysteine, glutamine, glutamic acid, glycine, lysine, leucine, methionine, phenylalanine, phenylglycine, proline, serine, tyrosine and valine in a concentration of 0.005-0 , 5 mmol / l, based on the total amount of amino acids in the electrolyte;
  5. e) at least one sulfonic acid in a concentration of 0.25-4.75 mol / l, based on the total amount of sulfonic acids,
  6. f) at least one reducing agent selected from the group consisting of formic acid, oxalic acid, ascorbic acid, hydrazine, urotropin, salts and / or esters of sulfurous acid, gaseous sulfites, sulfinic acids and their salts and / or esters, formaldehyde, sodium formaldehyde sulfoxylate, benzaldehyde, benzaldehyde derivatives, hydroxybenzenes and their esters, polyphenols and their esters, phenolsulfonic acids and their salts and / or esters and glutathione and its salts and / or esters
in a concentration of 0.1 mmol / l - 1 mol / l, based on the total amount of these reducing agents.

Überraschend wurde gefunden, dass sich mit dem hier beschriebenen Elektrolyten über einen weiten Stromdichtebereich homogene und helle Silber-Palladium-Legierungsschichten auf elektrisch leitfähigen Substraten abscheiden lassen, die sich exzellent für den Einsatz in Kontaktwerkstoffen eignen. Dadurch eignen sich die erfindungsgemäßen Elektrolyte als Ersatzmaterial für Hartgoldlegierungen in Kontaktwerkstoffen. Gleichzeitig lässt sich durch die zugegebenen Reduktionsmittel (Glanzzusätze) der Palladiumgehalt in der Schicht in Abhängigkeit von der Menge des zugegebenen Reduktionsmittels einfach einstellen: Mit zunehmender Konzentration der Reduktionsmittel steigt der Palladiumgehalt in der abgeschiedenen Schicht an. Dabei zeigt der erfindungsgemäße Elektrolyt eine vergleichsweise große Stabilität, was ihn in der industriellen Anwendung besonders vorteilhaft erscheinen lässt. Mit dem vorliegenden Elektrolyten können in vorteilhafter Weise auch in Gestell- und Hochgeschwindigkeits-Beschichtungsanlagen qualitativ hochwertige elektrische Kontaktwerkstoffe hergestellt werden. Bevorzugt enthält der Elektrolyt nur die oben angegebenen Bestandteile.Surprisingly, it has been found that homogeneous and bright silver-palladium alloy layers can be deposited on electrically conductive substrates with the electrolyte described here over a wide current density range, which are excellent for use in contact materials. As a result, the electrolytes according to the invention are suitable as replacement material for hard gold alloys in contact materials. At the same time, the palladium content in the layer can be easily adjusted by the added reducing agents (brightener additives), depending on the amount of reducing agent added. As the concentration of the reducing agents increases, the palladium content in the deposited layer increases. In this case, the electrolyte of the invention exhibits a comparatively high stability, which makes it appear particularly advantageous in industrial applications. With the present electrolyte, high-quality electrical contact materials can advantageously also be produced in frame and high-speed coating systems. The electrolyte preferably contains only the constituents specified above.

Der erfindungsgemäße Elektrolyt kann in einem Stromdichtebereich von 0,1 bis 100 A/dm2 eingesetzt werden. Bevorzugt ist ein Stromdichtebereich von 0,5 bis 20 A/dm2.The electrolyte according to the invention can be used in a current density range of 0.1 to 100 A / dm 2 . A current density range of 0.5 to 20 A / dm 2 is preferred.

Unter "homogenen" Silber-Palladium-Legierungsschichten werden in der vorliegenden Erfindung solche Schichten verstanden, deren Erscheinungsbild hinsichtlich Farbe und Schichteigenschaften einheitlich sind. Schichteigenschaften sind dabei Glanz, Helligkeit, Härte und Korrosionsbeständigkeit. Homogen sind die Silber-Palladium-Legierungsschichten dabei in zweierlei Hinsicht: Zum einen ist die auf einem bestimmten elektrisch leitfähigen Substrat abgeschiedene Silber-Palladium-Legierungsschicht homogen gemäß obiger Definition. Zum anderen ist das Erscheinungsbild der abgeschiedenen Silber-Palladium-Legierungen homogen, wenn aus demselben Elektrolyten, ohne Änderung von Elektrolytzusammensetzung, Temperatur und Bewegung, auf mehreren gleichen elektrisch leitfähigen Substraten bei unterschiedlichen Stromdichten Schichten abgeschieden werden, die eine gleiche Legierungszusammensetzung und ein gleiches optisches Erscheinungsbild aufweisen, .d.h. unabhängig von der Stromdichte sind die abgeschiedenen Schichten in diesem Falle homogen.By "homogeneous" silver-palladium alloy layers in the present invention are meant those layers whose appearance is uniform in color and layer properties. Layer properties are gloss, brightness, hardness and corrosion resistance. The silver-palladium alloy layers are homogeneous in two respects. On the one hand, the silver-palladium alloy layer deposited on a specific electrically conductive substrate is homogeneous according to the above definition. On the other hand, the appearance of the deposited silver-palladium alloys is homogeneous when depositing layers of the same electrolyte, without change of electrolyte composition, temperature and motion, on a plurality of the same electrically conductive substrates at different current densities, which have the same alloy composition and optical appearance have, regardless of the current density, the deposited layers are homogeneous in this case.

Dem Fachmann ist bekannt, dass Farbe und Helligkeit von metallischen Überzügen mit Hilfe der sog. L*a*b*-Messung nach CIEL*a*b (www.cielab.de) bestimmt werden können, wobei der L*-Wert die Helligkeit angibt. Die Helligkeitswerte (L*-Werte) der erfindungsgemäßen Silber-Palladium-Legierungsschichten liegen zwischen 80 und 90 L*a*b* (Messgerät X-Rite SP62, Lichtart D65/10).It is known to the person skilled in the art that color and brightness of metallic coatings can be determined with the aid of the so-called L * a * b * measurement according to CIEL * a * b (www.cielab.de), where the L * value is the brightness indicates. The brightness values (L * values) of the silver-palladium alloy layers according to the invention are between 80 and 90 L * a * b * (measuring device X-Rite SP62, type of light D65 / 10).

Zur Beurteilung des Glanzes kann eine Messung der Reflektivität herangezogen werden. Bei den erfindungsgemäßen Silber-Palladium-Legierungsschichten wird durch den Zusatz der Reduktionsmittel die Reflektivität in Abhängigkeit von angelegter Stromdichte und Konzentration des Reduktionsmittels um 5 - 40% vom Ausgangswert erhöht. Die Messung der Reflektivität wurde mit dem BYK Gardner - mirror TRI-gloss Messgerät durchgeführt. Die Messung erfolgte unter 20° Einfalls- und 20° Ausfallswinkel des Lichtstrahls) gemäß EN ISO 7668.. Die Glanzmessung von Oberflächen ist dem Fachmann bekannt und kann z.B. in " Schriftenreihe Galvanotechnik und Oberflächenbehandlung. Prüfung von funktionellen metallischen Schichten, Kap. 4.3: Glanz- und Reflexionsmessung an Oberflächen", Eugen G. Leuze-Verlag, Saulgau, 1, Auflage 1997, S. 117-125 " nachgeschlagen werden.To assess the gloss, a measurement of the reflectivity can be used. In the case of the silver-palladium alloy layers according to the invention, the reflectivity is increased by 5 to 40% from the starting value as a function of the applied current density and the concentration of the reducing agent due to the addition of the reducing agents. The reflectivity was measured with the BYK Gardner - mirror TRI-gloss meter. The measurement was carried out at 20 ° incidence and 20 ° angle of incidence of the light beam) in accordance with EN ISO 7668. The gloss measurement of surfaces is known to the person skilled in the art and can be described, for example, in US Pat. Series Electroplating and Surface Treatment. Testing of Functional Metallic Layers, Chap. 4.3: Gloss and Reflection Measurement on Surfaces ", Eugen G. Leuze-Verlag, Saulgau, 1, 1997 Edition, pp. 117-125 "be looked up.

Galvanische Bäder sind Lösungen, die Metallsalze enthalten, aus denen elektrochemisch metallische Niederschläge (Überzüge) auf Substrate (Gegenstände) abgeschieden werden können. Häufig werden solche galvanischen Bäder auch als "Elektrolyte" bezeichnet. Demgemäß werden die erfindungsgemäßen cyanidfreien und wässrigen galvanischen Bäder nachfolgend als "Elektrolyte" bezeichnet.Galvanic baths are solutions containing metal salts from which electrochemical metallic precipitates (coatings) can be deposited on substrates (objects). Frequently, such galvanic baths are also referred to as "electrolytes". Accordingly, the cyanide-free and aqueous electroplating baths of the present invention will hereinafter be referred to as "electrolytes".

Der erfindungsgemäße Elektrolyt zur elektrolytischen Abscheidung von hellen, homogenen und überwiegend Silber enthaltenden Silber-Palladium-Legierungen sowie das Verfahren zur Abscheidung solcher Silber-Palladium-Legierungen sind nachfolgend erläutert, wobei die Erfindung alle nachfolgend aufgeführten Ausführungsformen einzeln und in Kombination miteinander umfasst.The electrolyte according to the invention for the electrolytic deposition of light, homogeneous and predominantly silver-containing silver-palladium alloys and the process for depositing such silver-palladium alloys are explained below, the invention encompassing all embodiments listed below individually and in combination with one another.

Die Metallverbindungen, welche dem Elektrolyten zugegeben werden können, sind dem Fachmann im Allgemeinen geläufig.The metal compounds that can be added to the electrolyte are generally known to those skilled in the art.

Die im erfindungsgemäßen Elektrolyten enthaltene Silberverbindung ist vorteilhaft ein Silbersalz, das in diesem Elektrolyten löslich ist. Die Silbersalze werden dabei bevorzugt ausgewählt aus der Gruppe bestehend aus Silbermethansulfonat, Silbercarbonat, Silbersulfat, Silberphosphat, Silberpyrophosphat, Silbernitrat, Silberoxid, Silberlactat, Silberfluorid, Silberbromid, Silberchlorid, Silberiodid, Silberazid, Silbersulfid und Silbersulfat. Besonders bevorzugt wird in dem erfindungsgemäßen Elektrolyten Silbernitrat, Silbercarbonat, Silbermethansulfonat, Silberchlorid und Silberoxid verwendet. Hier sollte der Fachmann sich an dem Satz orientieren, dass möglichst wenig zusätzliche Stoffe in den Elektrolyten zugegeben werden sollen. Daherwird der Fachmann äußerst bevorzugt als zuzugebendes Silbersalz das Silbermethansulfonat, dass Silbercarbonat oder das Silberoxid wählen. Bei der Konzentration der eingesetzten Silberverbindung wird sich der Fachmann an dem oben angegebenen Grenzwerten zu orientieren haben. Bevorzugt wird die Silberverbindung in einer Konzentration von 1 - 300 g/l Silber, weiter bevorzugt 2 - 100 g/l Silber und ganz besonders bevorzugt zwischen 4 - 15 g/l Silber im Elektrolyten vorliegen.The silver compound contained in the electrolyte according to the invention is advantageously a silver salt which is soluble in this electrolyte. The silver salts are preferably selected from the group consisting of silver methanesulfonate, silver carbonate, silver sulfate, silver phosphate, silver pyrophosphate, silver nitrate, silver oxide, silver lactate, silver fluoride, silver bromide, silver chloride, silver iodide, silver azide, silver sulfide and silver sulfate. Silver nitrate, silver carbonate, silver methanesulfonate, silver chloride and silver oxide are particularly preferably used in the electrolyte according to the invention. Here, the expert should be guided by the sentence that as few additional substances as possible should be added to the electrolyte. Therefore, the skilled person will most preferably choose as the silver salt to be added the silver methanesulfonate, the silver carbonate or the silver oxide. In the concentration of the silver compound used, the skilled person will have to orientate to the limits given above. The silver compound is preferably present in the electrolyte in a concentration of 1 to 300 g / l of silver, more preferably 2 to 100 g / l of silver, and most preferably between 4 to 15 g / l of silver.

Auch die einzusetzende Palladiumverbindung wird vorzugsweise als im Elektrolyten lösliches Salz oder löslicher Komplex eingesetzt. Vorzugsweise wird die hier verwendete Palladiumverbindung ausgewählt aus der Gruppe bestehend aus Palladiumhydroxid, Palladiumchlorid, Palladiumsulfat, Palladiumpyrophosphat, Palladiumnitrat, Palladiumphosphat, Palladiumbromid, Palladium P Salz (Diammindinitritopalladium(II); ammoniakalische Lösung), Palladiumglycinaten, Palladiumacetaten, Tetramminpalladium(II)-chlorid, Tetramminpalladium(II)-bromid, Palladiummethansulfonat, Diammindinitropalladium(II)-chlorid, Diammindinitropalladium(II)-bromid, Diammindinitropalladium(II)-sulfat, Kalium-di-oxalatopalladat, Palladiumiodid, Tetramminpalladium(II)-sulfat, Bis(ethylendiamino)palladium(II)-bromid, Bis(acetylacetonato)-Palladium(II), Diammindichloro-palladium(II), Palladiumoxidhydrat, Tetramminpalladium(II)-hydrogencarbonat, Bis(ethylendiamin)-palladium(II)-chlorid, Bis(ethylendiamin)-palladium(II)-sulfat und Bis(ethylendiamin)-palladium(II)-carbonat . Vorteilhaft wird die Palladiumverbindung ausgewählt aus Palladiumhydroxid, Palladiumchlorid, Palladiumglycinat, Palladiummethansulfonat und Palladiumsulfat.Also, the palladium compound to be used is preferably used as the electrolyte-soluble salt or soluble complex. Preferably, the palladium compound used here is selected from the group consisting of palladium hydroxide, Palladium chloride, palladium sulfate, palladium pyrophosphate, palladium nitrate, palladium phosphate, palladium bromide, palladium P salt (diamminedinitritopalladium (II), palladium glycinates, palladium acetates, tetramminepalladium (II) chloride, tetramminepalladium (II) bromide, palladium methanesulfonate, diamminedinitropalladium (II) chloride, diamminedinitropalladium (II) bromide, diamminedinitropalladium (II) sulfate, potassium di-oxalatopalladate, palladium iodide, tetramminepalladium (II) sulfate, bis (ethylenediamino) palladium (II) bromide, bis (acetylacetonato) palladium (II ), Diamminedichloro-palladium (II), palladium oxide hydrate, tetramminepalladium (II) bicarbonate, bis (ethylenediamine) palladium (II) chloride, bis (ethylenediamine) palladium (II) sulfate and bis (ethylenediamine) palladium (II ) carbonate. Advantageously, the palladium compound is selected from palladium hydroxide, palladium chloride, palladium glycinate, palladium methanesulfonate and palladium sulfate.

Die Palladiumverbindung wird dabei in einer wie oben angegebenen Konzentration dem Elektrolyten beigegeben. Bevorzugt kommt die Palladiumverbindung in einer Konzentration von 0,1 - 100 g/l Palladium zum Einsatz, äußerst bevorzugt beträgt die Konzentration 2-20 g/l Palladium im Elektrolyten.The palladium compound is added to the electrolyte in a concentration as indicated above. The palladium compound is preferably used in a concentration of 0.1-100 g / l of palladium, and the concentration is very preferably 2-20 g / l of palladium in the electrolyte.

Der erfindungsgemäße Elektrolyt ist wässrig. Die einzusetzenden Silber- und Palladiumverbindungen sind vorzugsweise im Elektrolyten lösliche Salze oder lösliche Komplexe. Die Begriffe "lösliches Salz" und "löslicher Komplex" bezeichnen daher solche Salze und Komplexe, die sich im Elektrolyten bei Arbeitstemperatur lösen. Die Arbeitstermperatur ist dabei diejenige Temperatur, bei der die Abscheidung der Silber-Palladium-Legierung stattfindet. Im Rahmen der vorliegenden Erfindung gilt eine Substanz als löslich, wenn sich bei Arbeitstemperatur mindestens 0,002 g/l dieser Substanz im Elektrolyten löst.The electrolyte according to the invention is aqueous. The silver and palladium compounds to be used are preferably salts soluble in the electrolyte or soluble complexes. The terms "soluble salt" and "soluble complex" therefore refer to those salts and complexes which dissolve in the electrolyte at the working temperature. The working temperature is the temperature at which deposition of the silver-palladium alloy takes place. In the context of the present invention, a substance is considered to be soluble if at least 0.002 g / l of this substance dissolves in the electrolyte at the working temperature.

Die abgeschiedenen Legierungen, die Silber, Palladium sowie Selen und/oder Tellur enthalten, haben dabei eine Zusammensetzung, welche 70 - 99 Gew.-% Silber, 1 - 30 Gew.-% Palladium und 0,1 - 5 Gew.-% Selen und/oder Tellur enthält. Die Summe der Anteile von Silber, Palladium sowie Selen und/oder Tellur beträgt dabei 100 Gew.-%. Erfindungsgemäß stellt man die Konzentrationen der abzuscheidenden Metalle im Elektrolyten im oben angegebenen Rahmen so ein, dass eine silberreiche Legierung resultiert. Es sei angemerkt, dass neben der Konzentration der abzuscheidenden Metalle auch die eingesetzte Stromdichte, der Anteil an eingesetzter Sulfonsäure, die Menge an zugesetzter Tellurverbindungund/oder Selenverbindung und die Zugabe der Reduktionsmittel einen Einfluss auf die Silberkonzentration und die Helligkeit der abgeschiedenen Legierung haben. Der Fachmann weiß, wie er die entsprechenden Parameter einstellen muss, um die gewünschte Ziellegierung zu erhalten bzw. kann dies durch Routineexperimente ermitteln. Bevorzugt wird eine Legierung angestrebt, in der das Silber eine Konzentration von 70 - 99 Gew.-%, mehr bevorzugt 80 - 95 Gew.-% und ganz besonders bevorzugt 87 - 94 Gew.-%, aufweist. Der Palladiumanteil der erfindungsgemäßen Legierungen beträgt 1 - 30 Gew.-%, bevorzugt 5-20 Gew.-% und besonders bevorzugt 6 - 13 Gew.-%. Der Selen- oder Telluranteil der erfindungsgemäßen Legierung beträgt 0,1 - 5 Gew.-%, bevorzugt 0,5 - 4 Gew.-% und besonders vorteilhaft 1-3 Gew.-%.The deposited alloys, which contain silver, palladium and selenium and / or tellurium, have a composition which comprises 70-99% by weight of silver, 1-30% by weight of palladium and 0.1-5% by weight of selenium and / or tellurium. The sum of the proportions of silver, palladium and selenium and / or tellurium is 100 wt .-%. According to the invention, the concentrations of the metals to be deposited in the electrolyte in the above-mentioned frame so that a silver-rich alloy results. It should be noted that in addition to the concentration of the metals to be deposited, the current density used, the amount of sulfonic acid used, the amount of added tellurium compound and / or selenium compound and the addition of the reducing agents have an influence on the silver concentration and the brightness of the deposited alloy. The person skilled in the art knows how to set the corresponding parameters in order to obtain the desired target alloy or can determine this by routine experiments. Preferably, an alloy is desired in which the silver has a concentration of 70-99% by weight, more preferably 80-95% by weight and most preferably 87-94% by weight. The palladium content of the alloys according to the invention is 1 to 30% by weight, preferably 5 to 20% by weight and more preferably 6 to 13% by weight. The selenium or tellurium content of the alloy according to the invention is 0.1-5 wt .-%, preferably 0.5 to 4 wt .-% and particularly advantageously 1-3 wt .-%.

Nachfolgend werden die erfindungsgemäßen Legierungen, die Silber, Palladium sowie Selen und/oder Tellur enthalten, als "Silber-Palladium-Legierungen" bezeichnet.Hereinafter, the alloys according to the invention which contain silver, palladium and selenium and / or tellurium are referred to as "silver-palladium alloys".

Die Selen- bzw. Tellurverbindung, welche im Elektrolyten eingesetzt wird, kann vom Fachmann im Rahmen der oben angegebenen Konzentration entsprechend gewählt werden. Als bevorzugter Konzentrationsbereich kann eine Konzentration zwischen 0,002 - 10 g/l Tellur und/oder Selen und ganz besonders bevorzugt zwischen 0,1 - 5 g/l Tellur und/oder Selen gewählt werden. Die Konzentrationsangaben beziehen sich dabei auf die Gesamtmenge von Tellur und Selen im Elektrolyten. Geeignete Selen- und Tellurverbindungen sind solche, bei denen Selen bzw. Tellur in den Oxidationsstufen +4 oder +6 vorliegen. Vorteilhaft werden Selen- und Tellurverbindungen im Elektrolyten eingesetzt, bei denen Selen bzw. Tellur in der Oxidationsstufe +4 vorliegen. Besonders bevorzugt werden die Selen- und Tellurverbindungen ausgewählt aus Telluriten, Seleniten, telluriger Säure, seleniger Säure, Tellursäure, Selensäure, Selenocyanate, Tellurocyanate und Selenat sowie Tellurat. Dabei ist die Verwendung von Tellurverbindung gegenüber Selenverbindungen generell bevorzugt. Ganz besonders bevorzugt ist die Zugabe des Tellurs zum Elektrolyten in Form eines Salzes der tellurigen Säure, z.B. in Form von Kaliumtellurit.The selenium or tellurium compound which is used in the electrolyte can be selected appropriately by the person skilled in the art within the scope of the above-indicated concentration. As a preferred concentration range, a concentration of between 0.002 and 10 g / l of tellurium and / or selenium and most preferably between 0.1 and 5 g / l of tellurium and / or selenium can be selected. The concentration data relate to the total amount of tellurium and selenium in the electrolyte. Suitable selenium and tellurium compounds are those in which selenium or tellurium are present in the oxidation states +4 or +6. Selenium and tellurium compounds in the electrolyte are advantageously used in which selenium or tellurium in the oxidation state +4 are present. The selenium and tellurium compounds are particularly preferably selected from tellurites, selenites, telluric acid, selenious acid, telluric acid, selenic acid, selenocyanates, tellurocyanates and selenate, and also tellurate. The use of tellurium compound over selenium compounds is generally preferred. Very particular preference is given to adding the tellurium to the electrolyte in the form of a salt of the telluric acid, for example in the form of potassium tellurite.

Der erfindungsgemäße Elektrolyt enthält eine Verbindung ausgewählt aus der Gruppe Harnstoff, Harnstoffderivate, Thioharnstoff, Thioharnstoffderivate und Gemische davon und/oder eine oder mehrere α-Aminosäuren, welche als Komplexbildner für das Palladium dienen und dazu beitragen, die Stabilität des vorliegenden Elektrolyten zu erhöhen.The electrolyte according to the invention contains a compound selected from the group of urea, urea derivatives, thiourea, thiourea derivatives and mixtures thereof and / or one or more α-amino acids which serve as a complexing agent for the palladium and contribute to increasing the stability of the present electrolyte.

Harnstoffderivate sind ausgewählt aus Dimethylharnstoff, Ethylenharnstoff, N,N'-Dimethylpropylenharnstoff und N-(2-Hydroxyethyl)ethylenharnstoff. Bei Thioharnstoffderivaten handelt es sich beispielsweise um3-S-Isothioroniumpropansulfonat und N-Ethylthioharnstoff.Urea derivatives are selected from dimethylurea, ethyleneurea, N, N'-dimethylpropyleneurea and N- (2-hydroxyethyl) ethyleneurea. Thiourea derivatives are, for example, 3-S-isothioroniumpropanesulfonate and N-ethylthiourea.

In einer vorteilhaften Ausführungsform handelt es sich bei der Komponente d) des erfindungsgemäßen Elektrolyten, d.h. beim Komplexbildner für das Palladium, um Harnstoff.In an advantageous embodiment, component d) of the electrolyte according to the invention, i. the complexing agent for the palladium to urea.

Die eine oder mehrere α-Aminosäuren sind dabei ausgewählt aus der Gruppe bestehend aus Alanin, Asparaginsäure, Cystein, Glutamin, Glutaminsäure, Glycin, Lysin, Leucin, Methionin, Phenylalanin, Phenylglycin, Prolin, Serin, Tyrosin und Valin. Vorzugsweise werden vorliegend solche Aminosäuren eingesetzt, die im variablen Rest lediglich Alkylgruppen aufweisen. In einer vorteilhaften Ausführungsform ist die α-Aminosäure ausgewählt aus Alanin, Glycin und Valin. Ganz besonders bevorzugt ist der Einsatz von Glycin und / oder Alanin.The one or more α-amino acids are selected from the group consisting of alanine, aspartic acid, cysteine, glutamine, glutamic acid, glycine, lysine, leucine, methionine, phenylalanine, phenylglycine, proline, serine, tyrosine and valine. Preferably, in the present case, those amino acids are used which have only alkyl groups in the variable radical. In an advantageous embodiment, the α-amino acid is selected from alanine, glycine and valine. Very particularly preferred is the use of glycine and / or alanine.

Harnstoff, Harnstoffderivate, Thioharnstoff, Thioharnstoffderivate und Gemische davon werden in einer Konzentration von 0,05 bis 2 mol/l eingesetzt, bevorzugt 0,2 - 1,5 mol/l, bezogen auf die Gesamtmenge von Harnstoff und Harnstoffderivaten im Elektrolyten. Die Konzentration der einen oder mehreren α-Aminosäuren im erfindungsgemäßen Elektrolyten beträgt dabei 0,005 bis 0,5 mol/l, bevorzugt 0,01 - 0,2 mol/l. Im Falle der α-Aminosäuren beziehen sich diese Konzentrationsangaben auf die Gesamtmenge an α-Aminosäure oder α-Aminosäuren, unabhängig davon, ob der Elektrolyt eine einzige oder mehrere α-Aminosäuren enthält.Urea, urea derivatives, thiourea, thiourea derivatives and mixtures thereof are used in a concentration of 0.05 to 2 mol / l, preferably 0.2 to 1.5 mol / l, based on the total amount of urea and urea derivatives in the electrolyte. The concentration of the one or more α-amino acids in the electrolyte according to the invention is 0.005 to 0.5 mol / l, preferably 0.01 to 0.2 mol / l. In the case of α-amino acids, these concentrations refer to the total amount of α-amino acid or α-amino acids, regardless of whether the electrolyte contains one or more α-amino acids.

Im oben angegebenen Konzentrationsrahmen kann der Fachmann das Optimum der Konzentration für die eingesetzte Aminosäure frei wählen. Er wird sich dabei daran orientieren, dass eine zu geringe Menge an Aminosäure nicht zu dem gewünschten stabilisierenden Effekt führt, während deren Einsatz in einer zu hohen Konzentrationen die Abscheidung von Palladium inhibieren kann.In the concentration range given above, the skilled person can freely choose the optimum concentration for the amino acid used. He will be guided by the fact that a too small amount of amino acid does not lead to the desired stabilizing effect, while their use in too high a concentration can inhibit the deposition of palladium.

Der erfindungsgemäße Elektrolyt wird in einem sauren pH-Bereich eingesetzt. Optimale Ergebnisse lassen sich bei pH-Werten im Elektrolyten von <2 erreichen. Der Fachmann weiß, wie er den pH-Wert des Elektrolyten einstellen kann. Er wird sich dabei von dem Gedanken lenken lassen, möglichst wenig zusätzliche Stoffe in den Elektrolyten einzuführen, die die Abscheidung der entsprechenden Legierung negativ beeinflussen können. In einer ganz besonders bevorzugten Ausführungsform wird der pH-Wert allein durch die Zugabe der Sulfonsäure bedingt. Bevorzugt ergeben sich dann stark saure Abscheidungsbedingungen, bei denen der pH-Wert unter 1 liegen und gegebenenfalls sogar bis 0,1 in Grenzfällen auch bis 0,01 reichen kann. Im optimalen Fall liegt der pH-Wert um 0,3 - 0,6.The electrolyte according to the invention is used in an acidic pH range. Optimal results can be achieved at pH values in the electrolyte of <2. The person skilled in the art knows how to adjust the pH of the electrolyte. He will be guided by the idea of introducing as few additional substances into the electrolyte as possible, which may have a negative effect on the deposition of the corresponding alloy. In a very particularly preferred embodiment, the pH is determined solely by the addition of the sulfonic acid. Strongly acidic deposition conditions then preferably result in which the pH is less than 1 and, where appropriate, even up to 0.1 in borderline cases can also reach up to 0.01. In the optimal case, the pH is around 0.3-0.6.

Im erfindungsgemäßen Elektrolyten wird zudem mindestens eine Sulfonsäure in einer Konzentration von 0,25 - 4,75 mol/l eingesetzt, wobei die Konzentration sich auf die Gesamtmenge der eingesetzten Sulfonsäuren bezieht. Vorzugsweise beträgt die Konzentration 0,5 - 3 mol/l und ganz besonders bevorzugt 0,8 - 2,0 mol/l. Die mindestens eine Sulfonsäure dient zum einen dazu, im Elektrolyten einen entsprechenden pH-Wert zu etablieren. Zum anderen führt ihr Einsatz zu einer weiteren Stabilisierung des erfindungsgemäßen Elektrolyten. Die Obergrenze der Sulfonsäurekonzentration wird dadurch bedingt, dass bei einer zu hohen Konzentration nur noch Silber abgeschieden wird. Als Sulfonsäure können im Prinzip dem Fachmann für den Einsatz in der Galvanotechnik bekannte Sulfonsäuren herangezogen werden. Vorzugsweise werden Sulfonsäuren ausgewählt aus der Gruppe bestehend aus Ethansulfonsäure, Propansulfonsäure, Benzolsulfonsäure, Methansulfonsäure eingesetzt. Sie können dabei einzeln oder als Gemische eingesetzt werden. Ganz besonders bevorzugt sind Propansulfonsäure und Methansulfonsäure in diesem Zusammenhang zu nennen. Äußerst bevorzugt wird Methansulfonsäure eingesetzt.In addition, at least one sulfonic acid in a concentration of 0.25-4.75 mol / l is used in the electrolyte according to the invention, the concentration being based on the total amount of the sulfonic acids used. The concentration is preferably 0.5-3 mol / l and most preferably 0.8-2.0 mol / l. The at least one sulfonic acid serves on the one hand to establish a corresponding pH in the electrolyte. On the other hand, their use leads to a further stabilization of the electrolyte according to the invention. The upper limit of the sulfonic acid concentration is due to the fact that at too high a concentration only silver is deposited. As sulfonic acid, sulfonic acids known in principle to those skilled in the art for use in electroplating can be used. Preferably, sulfonic acids are selected from the group consisting of ethanesulfonic acid, propanesulfonic acid, benzenesulfonic acid, methanesulfonic acid used. They can be used individually or as mixtures. Very particular preference is given to mentioning propanesulfonic acid and methanesulfonic acid in this context. Most preferably, methanesulfonic acid is used.

Das mindestens eine Reduktionsmittel ist ausgewählt aus Ameisensäure, Oxalsäure, Ascorbinsäure, Hydrazin, Urotropin, Salzen und/oder Estern der schwefligen Säure, gasförmigen Sulfiten, Sulfinsäuren und deren Salzen und/oder Estern, Formaldehyd, Natriumformaldehydsulfoxylat, Benzaldehyd, Benzaldehydderivaten, Hydroxybenzolen und deren Estern, Polyphenolen und deren Estern, Phenolsulfonsäuren und deren Salzen und/oder Estern und Glutathion sowie dessen Salzen und/oder Estern.The at least one reducing agent is selected from formic acid, oxalic acid, ascorbic acid, hydrazine, urotropin, salts and / or esters of sulfurous acid, gaseous sulfites, sulfinic acids and their salts and / or esters, formaldehyde, sodium formaldehyde sulfoxylate, benzaldehyde, benzaldehyde derivatives, hydroxybenzenes and their esters , Polyphenols and their esters, phenolsulfonic acids and their salts and / or esters and glutathione and its salts and / or esters.

In einer vorteilhaften Ausführungsform ist das Reduktionsmittel ausgewählt aus Hydroxybenzolen,Na-formaldehydsulfoxylat und Ascorbinsäure.In an advantageous embodiment, the reducing agent is selected from hydroxybenzenes, Na-formaldehydsulfoxylat and ascorbic acid.

In einer weiteren vorteilhaften Ausführungsform ist das Reduktionsmittel ausgewählt aus Salzen und/der Estern der schwefligen Säure.In a further advantageous embodiment, the reducing agent is selected from salts and / or the esters of sulfurous acid.

Bei den Salzen der schwefligen Säure kann es sich um Sulfite oder um Hydrogensulfite handeln. Vorteilhaft handelt es sich bei den Sulfiten und Hydrogensulfiten um Lithium-, Natrium-, Kalium- oder Ammoniumsalze.The sulphurous acid salts can be sulphites or hydrogen sulphites. Advantageously, the sulfites and hydrogen sulfites are lithium, sodium, potassium or ammonium salts.

Bei den Estern der schwefligen Säure handelt es sich um Verbindungen der allgemeinen Formel R1-O-S(=O)-O-R2, worin R1 und R2 unabhängig voneinander ausgewählt sind aus linearen oder verzweigten acyclischen Alkylgruppen mit 1 bis 10 Kohlenstoffatomen, cyclischen Alkylgruppen mit 3 bis 10 Kohlenstoffatomen, Arylgruppen und Benzylgruppen.The esters of sulfurous acid are compounds of the general formula R1-OS (= O) -O-R2, wherein R1 and R2 are independently selected from linear or branched acyclic alkyl groups having 1 to 10 carbon atoms, cyclic alkyl groups having 3 to 10 carbon atoms, aryl groups and benzyl groups.

Im Rahmen der vorliegenden Erfindung werden die linearen oder verzweigten acyclischen Alkylgruppen mit 1 bis 10 Kohlenstoffatomen ausgewählt aus Methyl, Ethyl, n-Propyl, Isopropyl, 1-Butyl, 2-Butyl, tert.-Butyl, 1-Pentyl, 2-Pentyl, 3-Pentyl, 3-Methylbutyl, 2,2-Dimethylpropyl sowie allen Isomeren von Hexyl, Heptyl, Octyl, Nonyl und Decyl. Dem Fachmann ist bekannt, dass cyclische Alkylgruppen mindestens drei Kohlenstoffatome enthalten müssen. Vorteilhaft umfassen cyclische Alkylgruppen im Rahmen der vorliegenden Erfindung Propyl-, Butyl-, Pentyl-, Hexyl-, Heptyl-, und Octyl-Ringe. Eine cyclische Alkylgruppe im Sinne der vorliegenden Erfindung wird ausgewählt aus den genannten ringförmigen Alkylgruppen, die keine weiteren Substituenten tragen, und aus den genannten ringförmigen Alkylgruppen, welche ihrerseits an eine oder mehrere acyclische Alkylgruppen gebunden sind. Im letztgenannten Fall kann die Bindung der cyclischen Alkylgruppe an das Sauerstoffatom gemäß obiger Formel über ein cyclisches oder ein acyclisches Kohlenstoffatom der cyclischen Alkylgruppe erfolgen. Cyclische Alkylgruppen enthalten gemäß obiger Definition des Begriffes "Alkylgruppe" ebenfalls insgesamt maximal 10 Kohlenstoffatome. Handelt es sich bei einem der Reste R1 und R2, um eine Arylgruppe, so ist diese ausgewählt aus Phenyl, Naphthyl und Anthracenyl.In the context of the present invention, the linear or branched acyclic alkyl groups having 1 to 10 carbon atoms are selected from methyl, ethyl, n-propyl, isopropyl, 1-butyl, 2-butyl, tert-butyl, 1-pentyl, 2-pentyl, 3-pentyl, 3-methylbutyl, 2,2-dimethylpropyl and all isomers of hexyl, heptyl, octyl, nonyl and decyl. It is known to the person skilled in the art that cyclic alkyl groups must contain at least three carbon atoms. Cyclic alkyl groups in the context of the present invention advantageously include propyl, butyl, pentyl, hexyl, heptyl, and octyl rings. A cyclic alkyl group in the context of the present invention is selected from the said ring-shaped alkyl groups which carry no further substituents, and from the said ring-shaped alkyl groups, which in turn are bonded to one or more acyclic alkyl groups. In the latter case, the bonding of the cyclic alkyl group to the oxygen atom according to the above formula may be via a cyclic or an acyclic carbon atom of the cyclic alkyl group. Cyclic alkyl groups according to the above definition of the term "alkyl group" also contain a maximum of 10 carbon atoms. If one of the radicals R 1 and R 2 is an aryl group, this is selected from among phenyl, naphthyl and anthracenyl.

Bei gasförmigen Sulfiten handelt es sich um SO2-Gas, das in den Elektrolyten eingeleitet wird.Gaseous sulfites are SO 2 gas which is introduced into the electrolyte.

Bei den Sulfinsäuren handelt es sich um Verbindungen der allgemeinen Formel R3-S(=O)-OH, wobei R3 eine lineare oder verzweigte acyclische Alkylgruppe mit 1 bis 10 Kohlenstoffatomen, eine cyclische Alkylgruppe mit 3 bis 10 Kohlenstoffatomen, eine Aryl- oder Benzylgruppe ist und wobei diese Gruppen wie oben für R1 und R2 beschrieben definiert sind.The sulfinic acids are compounds of the general formula R3-S (= O) -OH, where R3 is a linear or branched acyclic alkyl group having 1 to 10 Carbon atoms, a cyclic alkyl group of 3 to 10 carbon atoms, an aryl or benzyl group, and wherein these groups are defined as described above for R1 and R2.

Benzaldehydderivate sind ausgewählt aus Benzaldehydsulfonsäure, deren Salzen und Estern, z.B. Benzaldehyd-2-sulfonsäure Natriumsalz, Dimethylaminobenzaldehyd, 3-Chlor-Benzaldehyd, 4-Chlor-benzaldehyd, 2-Methoxybenzaldehyd, 2- Methylbenzaldehyd, 2-Nitrobenzaldehyd, 3,5-Dibrombenzaldehyd, 3-Nitrobenzaldehyd und 3,5-Dimethoxybenzaldehyd.Benzaldehyde derivatives are selected from benzaldehydesulfonic acid, their salts and esters, e.g. Benzaldehyde-2-sulfonic acid sodium salt, dimethylaminobenzaldehyde, 3-chlorobenzaldehyde, 4-chlorobenzaldehyde, 2-methoxybenzaldehyde, 2-methylbenzaldehyde, 2-nitrobenzaldehyde, 3,5-dibromobenzaldehyde, 3-nitrobenzaldehyde and 3,5-dimethoxybenzaldehyde.

Hydroxybenzole sind ausgewählt aus Phenol, Brenzcatechin, Resorcin, Hydrochinon, Pyrogallol, Hydroxychinon und Phloroglucin.Hydroxybenzenes are selected from phenol, catechol, resorcinol, hydroquinone, pyrogallol, hydroxyquinone and phloroglucin.

Handelt es sich bei dem mindestens einen Reduktionsmittel um ein Salz einer organischen Verbindung, so wird vorteilhaft ein Natrium-, Kalium-, Lithium- oder Ammoniumsalz gewählt. Im Falle von mehrprotonigen organischen Säuren kann ein einziges acides Wasserstoffatom oder mehrere oder alle durch Natrium-, Kalium-, Lithium- oder Ammoniumionen ersetzt sein. Ist mehr als ein acides Wasserstoffatom durch Natrium-, Kalium-, Lithium- oder Ammoniumionen ersetzt, so können diese Kationen identisch oder verschieden sein.If the at least one reducing agent is a salt of an organic compound, it is advantageous to choose a sodium, potassium, lithium or ammonium salt. In the case of polybasic organic acids, a single acidic hydrogen atom or several or all may be replaced by sodium, potassium, lithium or ammonium ions. If more than one acidic hydrogen atom is replaced by sodium, potassium, lithium or ammonium ions, these cations may be identical or different.

Bei dem mindestens einen Reduktionsmittel kann es sich ferner um einen Ester einer organischen Verbindung handeln. Dem Fachmann ist bekannt, dass Ester die Kondensationsprodukte eines Alkohols und einer Carbonsäure sind. Ester von Alkoholen gemäß obiger Liste der geeigneten Reduktionsmittel sind dementsprechend Kondensationsprodukt eines der oben genannten Alkohole und einer Carbonsäure R4-COOH, und Ester von Carbonsäuren gemäß obiger Liste sind Kondensationsprodukte einer der oben genannten Carbonsäuren mit einem Alkohol R5-OH.The at least one reducing agent may further be an ester of an organic compound. It is known to those skilled in the art that esters are the condensation products of an alcohol and a carboxylic acid. Accordingly, esters of alcohols according to the above list of suitable reducing agents are condensation product of one of the abovementioned alcohols and a carboxylic acid R4-COOH, and esters of carboxylic acids according to the above list are condensation products of one of the abovementioned carboxylic acids with an alcohol R5-OH.

R4 und R5 sind dabei ausgewählt aus linearen oder verzweigten acyclischen Alkylgruppen mit 1 bis 10 Kohlenstoffatomen, cyclischen Alkylgruppen mit 3 bis 10 Kohlenstoffatomen, Aryl- oder Benzylgruppen, wobei diese Gruppen wie oben für R1 und R2 beschrieben definiert sind.R 4 and R 5 are here selected from linear or branched acyclic alkyl groups having 1 to 10 carbon atoms, cyclic alkyl groups having 3 to 10 carbon atoms, aryl or benzyl groups, these groups being defined as described above for R 1 and R 2.

Besonders vorteilhaft ist das mindestens eine Reduktionsmittel ausgewählt aus Salzen und/oder Estern der schwefligen Säure und gasförmigen Sulfiten.Particularly advantageous is the at least one reducing agent selected from salts and / or esters of sulfurous acid and gaseous sulfites.

Das mindestens eine Reduktionsmittel ist im Elektrolyten in einer Konzentration von 1 bis 100 mmol/l enthalten, vorteilhaft in einer Konzentration von 5-30 mmol/l, wobei sich diese Konzentrationsangabe auf die Gesamtmenge der oben genannten Reduktionsmittel im Elektrolyten bezieht.The at least one reducing agent is contained in the electrolyte in a concentration of 1 to 100 mmol / l, advantageously in a concentration of 5-30 mmol / l, this concentration refers to the total amount of the above-mentioned reducing agent in the electrolyte.

Der erfindungsgemäße Elektrolyt enthält des Weiteren mindestens eine Sulfonsäure in einer Konzentration von 0,25 bis 4,75 mol/l. Vorzugsweise beträgt die Konzentration 0,5 bis 3 mol/l und ganz besonders bevorzugt 0,8 bis 2,0 mol/l. Die mindestens eine Sulfonsäure dient zum einen dazu, im Elektrolyten einen entsprechenden pH-Wert zu etablieren. Zum anderen führt ihr Einsatz zu einer weiteren Stabilisierung des erfindungsgemäßen Elektrolyten. Die Obergrenze der Sulfonsäurekonzentration wird dadurch bedingt, dass bei einer zu hohen Konzentration nur noch Silber abgeschieden wird. Die Sulfonsäuren haben die allgemeine Summenformel R6-S(=O)2-OH, worin R6 für eine lineare oder verzweigte acyclische Alkylgruppe mit 1 bis 10 Kohlenstoffatomen, eine cyclische Alkylgruppe mit 3 bis 10 Kohlenstoffatomen oder für eine Aryl- oder Benzylgruppe steht, wobei diese Gruppen wie oben für R1 und R2 beschrieben definiert sind. Vorzugsweise werden Sulfonsäuren ausgewählt aus der Gruppe bestehend aus Methansulfonsäure, Ethansulfonsäure, Propansulfonsäure und Benzolsulfonsäure. Ganz besonders bevorzugt sind Methansulfonsäure und Propansulfonsäure in diesem Zusammenhang zu nennen. Äußerst bevorzugt wird Methansulfonsäure eingesetzt.The electrolyte of the invention further contains at least one sulfonic acid in a concentration of 0.25 to 4.75 mol / l. The concentration is preferably 0.5 to 3 mol / l and most preferably 0.8 to 2.0 mol / l. The at least one sulfonic acid serves on the one hand to establish a corresponding pH in the electrolyte. On the other hand, their use leads to a further stabilization of the electrolyte according to the invention. The upper limit of the sulfonic acid concentration is due to the fact that at too high a concentration only silver is deposited. The sulfonic acids have the general empirical formula R6-S (= O) 2-OH, wherein R6 represents a linear or branched acyclic alkyl group of 1 to 10 carbon atoms, a cyclic alkyl group of 3 to 10 carbon atoms, or an aryl or benzyl group these groups are defined as described above for R1 and R2. Preferably, sulfonic acids are selected from the group consisting of methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid and benzenesulfonic acid. Very particular preference is given to mentioning methanesulfonic acid and propanesulfonic acid in this context. Most preferably, methanesulfonic acid is used.

Optional enthält der erfindungsgemäße Elektrolyt des Weiteren noch ein Tensid. Dieses Tensid wird ausgewählt aus anionischen und nichtionischen Tensiden. Beispiele hierfür sind Polyethylenglykol-Addukte, Fettalkoholsulfate, Alkylsulfate, Alkylsulfonate, Arylsulfonate, Alkylarylsulfonate und Heteroarylsulfonate, Betaine, Fluortenside und deren Salze und Derivate. Geeignete Tenside sind dem Fachmann bekannt, beispielsweise aus N. Kanani: Galvanotechik, Hanser-Verlag, München-Wien, 2000, S. 84 ff . Vor Zugabe eines Tensids weist der erfindungsgemäße Elektrolyt eine Oberflächenspannung von größer oder gleich 70 mN/m auf. Wird ein Tensid zugegeben, so wird dessen Konzentration vorteilhaft so gewählt, dass die Oberflächenspannung des Elektrolyten auf einen Wert kleiner oder gleich 50 mN/m absinkt. Die Oberflächenspannung kann dabei mit einem Blasendrucktensiometer gemessen werden.Optionally, the electrolyte according to the invention further contains a surfactant. This surfactant is selected from anionic and nonionic surfactants. Examples thereof are polyethylene glycol adducts, fatty alcohol sulfates, alkyl sulfates, alkyl sulfonates, aryl sulfonates, alkylaryl sulfonates and heteroaryl sulfonates, betaines, fluorosurfactants and their salts and derivatives. Suitable surfactants are known to the person skilled in the art, for example from N. Kanani: Galvanotechik, Hanser-Verlag, Munich-Vienna, 2000, p. 84 ff , Before addition of a surfactant, the electrolyte according to the invention has a surface tension of greater than or equal to 70 mN / m. If a surfactant is added, its concentration is advantageously chosen so that the surface tension of the electrolyte drops to a value less than or equal to 50 mN / m. The surface tension can be measured with a bubble pressure tensiometer.

In einer weiteren Ausgestaltung bezieht sich die vorliegende Erfindung auf ein Verfahren zur elektrolytischen Abscheidung von überwiegend Silber enthaltenden Silber-Palladium-Schichten aus einem erfindungsgemäßen Elektrolyten, wobei man ein elektrisch leitfähiges Substrat in den Elektrolyten taucht und zwischen einer mit dem Elektrolyten in Kontakt stehenden Anode und dem Substrat als Kathode einen Stromfluss etabliert. Es sei erwähnt, dass die für den Elektrolyten als bevorzugt genannten Ausführungsformen mutatis mutandis auch für das hier angesprochene Verfahren gelten.In a further embodiment, the present invention relates to a process for the electrolytic deposition of predominantly silver-containing silver-palladium layers of an electrolyte according to the invention, wherein an electrically conductive substrate is immersed in the electrolyte and between an anode in contact with the electrolyte and the substrate as a cathode established a current flow. It should be mentioned that the embodiments mentioned as preferred for the electrolyte also apply mutatis mutandis to the method mentioned here.

Die Temperatur, die während der Abscheidung der Silber-Palladium-Legierung vorherrscht, kann vom Fachmann nach Belieben gewählt werden. Er wird sich dabei an einer ausreichenden Abscheidungsrate und anwendbaren Stromdichtebereich einerseits und auf der anderen Seite an ökonomischen Gesichtspunkten bzw. der Stabilität des Elektrolyten orientieren. Vorteilhaft ist das Einstellen einer Temperatur von 25 °C bis 75 °C im Elektrolyten, bevorzugt zwischen 30 °C und 65°C. Ganz besonders bevorzugt scheint der Einsatz des Elektrolyten bei Temperaturen von 45 °C bis 55°CThe temperature which prevails during the deposition of the silver-palladium alloy can be chosen at will by the person skilled in the art. It will orientate itself on a sufficient deposition rate and applicable current density range on the one hand and on the other hand on economic aspects or the stability of the electrolyte. It is advantageous to set a temperature of 25 ° C to 75 ° C in the electrolyte, preferably between 30 ° C and 65 ° C. Most preferably, the use of the electrolyte at temperatures of 45 ° C to 55 ° C.

Die Stromdichte, die während des Abscheidungsverfahrens im Elektrolyten zwischen der Kathode und der Anode etabliert wird, kann vom Fachmann nach Maßgabe der Effizienz und Güte der Abscheidung gewählt werden. Vorteilhafterweise wird im Elektrolyten die Stromdichte je nach Anwendung und Beschichtungsanlagentyp auf 0,1 bis 100 A/dm2 eingestellt. Gegebenenfalls können die Stromdichten durch Anpassung der Anlagenparameter wie Aufbau der Beschichtungszelle, Strömungsgeschwindigkeiten, Anoden-, Kathodenverhältnisse, usw. erhöht bzw. verringert werden. Vorteilhaft ist eine Stromdichte von 0,5 - 20 A/dm2, bevorzugt 1 - 20 A/dm2 und ganz besonders bevorzugt 1,5 - 15 A/dm2.The current density established during the deposition process in the electrolyte between the cathode and the anode can be selected by one skilled in the art in accordance with the efficiency and the quality of the deposition. Advantageously, the current density in the electrolyte is set to 0.1 to 100 A / dm 2 , depending on the application and coating system type. Optionally, the current densities can be increased or decreased by adjusting the system parameters such as the structure of the coating cell, flow rates, anode, cathode ratios, etc. Is advantageously a current density 0.5 to 20 A / dm 2, preferably 1 - 20 A / dm 2 and very particularly preferably from 1.5 to 15 A / dm 2.

Wie oben schon angedeutet, handelt es sich bei dem erfindungsgemäßen Elektrolyten um einen sauren Typ. Der pH-Wert sollte vorzugsweise bei <2 liegen, besonders bevorzugt <1 sein. Es kann sein, dass bzgl. des pH-Wertes des Elektrolyten während der Elektrolyse Schwankungen auftreten. In einer bevorzugten Ausführungsform des gegenständlichen Verfahrens geht der Fachmann daher so vor, dass er den pH-Wert während der Elektrolyse kontrolliert und ggf. auf den Sollwert einstellt.As already indicated above, the electrolyte according to the invention is an acidic type. The pH should preferably be <2, more preferably <1. It may be that with respect to the pH of the electrolyte during the electrolysis fluctuations occur. In a preferred embodiment of the subject method, the person skilled in the art therefore proceeds in such a way that he controls the pH during the electrolysis and, if necessary, sets it to the desired value.

Bei der Verwendung des Elektrolyten können verschiedene Anoden eingesetzt werden. Es sind lösliche oder unlösliche Anoden ebenso geeignet, wie die Kombination von löslichen und unlöslichen Anoden. Wird eine lösliche Anode eingesetzt, so ist es besonders bevorzugt, wenn eine Silberanode zum Einsatz kommt.When using the electrolyte, various anodes can be used. Soluble or insoluble anodes are also suitable, as is the combination of soluble and insoluble anodes. If a soluble anode is used, it is particularly preferred if a silver anode is used.

Als unlösliche Anoden werden bevorzugt solche aus einem Material ausgewählt aus der Gruppe bestehend aus platiniertem Titan, Graphit, Iridium-Übergangsmetall-Mischoxid und speziellem Kohlenstoffmaterial ("Diamond Like Carbon" DLC) oder Kombinationen dieser Anoden eingesetzt. Besonders bevorzugt werden Mischoxid-Anoden aus Iridium-Ruthenium-Mischoxid, Iridium-Ruthenium-Titan-Mischoxid oder Iridium-Tantal-Mischoxid zur Ausführung der Erfindung herangezogen. Ganz besonders bevorzugt werden Platin-Titan-Anoden verwendet. Weitere können bei Cobley, A.J. et al. (The use of insoluble Anodes in Acid Sulphate Copper Electrodeposition Solutions, Trans IMF, 2001,79(3), S. 113 und 114 ) gefunden werden.Preferred insoluble anodes are those made of a material selected from the group consisting of platinized titanium, graphite, iridium-transition metal mixed oxide and special carbon material ("Diamond Like Carbon" DLC) or combinations of these anodes. Mixed oxide anodes of iridium-ruthenium mixed oxide, iridium-ruthenium-titanium mixed oxide or iridium-tantalum mixed oxide are particularly preferably used for carrying out the invention. Very particular preference is given to using platinum-titanium anodes. Others can be added Cobley, AJ et al. (The use of insoluble anodes in Acid Sulphate Copper Electrodeposition Solutions, Trans. IMF, 2001, 79 (3), pp. 113 and 114 ) being found.

Die vorliegende Erfindung stellt einen Silber-Palladium-Legierungselektrolyten mit einem zugesetzten Reduktionsmittel zur Legierungseinstellung und Aufheller sowie zur elektrolytischen Abscheidung von Silber-Palladium-Schichten und ein entsprechendes Verfahren vor. Der Elektrolyt enthält mindestens ein Reduktionsmittel zur Legierungseinstellung und Aufhellung: Durch die Zugabe des mindestens einen Reduktionsmittels kann der Palladiumgehalt der abgeschiedenen Silber-Palladium-Legierung eingestellt werden. Wie bereits weiter oben im Text ausgeführt, haben die erfindungsgemäßen abgeschiedenen Legierungen eine Zusammensetzung, welche 70 - 99 Gew.-Silber, 1 - 30 Gew.-% Palladium und 0,1 - 5 Gew.-% Selen und/oder Tellur enthält, wobei die Summe der Anteile von Silber, Palladium sowie Selen und/oder Tellur 100 Gew.-% beträgt. Außerdem führt der erfindungsgemäße Elektrolyt zu einer homogeneren Abscheidung im Vergleich zu herkömmlichen Silber-Palladium-Legierungselektrolyten.The present invention provides a silver-palladium alloy electrolyte with an added reducing agent for alloying and brightening, and for the electrodeposition of silver-palladium layers, and a corresponding method. The electrolyte contains at least one reducing agent for alloy adjustment and lightening: By adding the at least one reducing agent, the palladium content of the deposited silver-palladium alloy can be adjusted. As already stated above, the deposited alloys according to the invention have a composition which contains 70-99% by weight of silver, 1-30% by weight of palladium and 0.1-5% by weight of selenium and / or tellurium. wherein the sum of the proportions of silver, palladium and selenium and / or tellurium is 100 wt .-%. In addition, the electrolyte according to the invention leads to a more homogeneous deposition compared to conventional silver-palladium alloy electrolytes.

Aus herkömmlichen Silber Palladium-Elektrolyten abgeschiedene Schichten weisen, je nach angelegter Stromdichte, L*-Werte von 67 - 78 auf. Mit dem neuen, erfindungsgemäßen Elektrolytsystem werden deutlich höhere, über den angewandten Stromdichtebereich einheitliche, L*-Werte der abgeschiedenen Schichten erzielt. Diese liegen zwischen 80 und 90, je nach verwendetem Reduktionsmittel.Layers deposited from conventional silver palladium electrolytes have L * values of 67-78, depending on the applied current density. With the new electrolyte system according to the invention, significantly higher L * values of the deposited layers, uniform over the applied current density range, are achieved. These are between 80 and 90, depending on the reducing agent used.

Dies war vor dem Hintergrund des bekannten Standes der Technik nicht zu erwarten.This was not to be expected against the background of the known state of the art.

Ausführungsbeispieleembodiments

Es wurden verschiedene Grundelektrolyte hergestellt und je ein Reduktionsmittel in zwei verschiedenen Konzentrationen zugegeben. Aus diesen Elektrolyten, ohne und mit Reduktionsmittel, wurden dann Silber-Palladium-Schichten abgeschieden, charakterisiert und miteinander verglichen.Various basic electrolytes were prepared and one reducing agent each was added in two different concentrations. From these electrolytes, with and without reducing agent, silver-palladium layers were then deposited, characterized and compared with each other.

Ausführungsbeispiel 1Embodiment 1

  • Grundelektrolyt:
    • 100 ml/l Methansulfonsäure 70%
    • 3 g/l Glycin
    • 10 g/l Palladium (als Palladiumhydroxid)
    • 5 g/l Silber (als Silbernitrat)
    • 0,5 g/l Tellur (als Tellurige Säure)
    Supporting electrolyte:
    • 100 ml / l methanesulfonic acid 70%
    • 3 g / l glycine
    • 10 g / l palladium (as palladium hydroxide)
    • 5 g / l silver (as silver nitrate)
    • 0.5 g / l tellurium (as telluric acid)
  • Reduktionsmittel:
    • 0 g/l Na-Formaldehydsulfoxylat
    • 0,95 g/l Na-Formaldehydsulfoxylat (8 mmol)
    • 7,1 g/l Na-Formaldehydsulfoxylat (40 mmol)
    Reducing agent:
    • 0 g / l Na formaldehyde sulfoxylate
    • 0.95 g / l Na formaldehyde sulfoxylate (8 mmol)
    • 7.1 g / l Na formaldehyde sulfoxylate (40 mmol)
  • Temperatur: 30°CTemperature: 30 ° C
  • Anoden: PtTiAnodes: PtTi

Der Palladiumgehalt der abgeschiedenen Schichten wurde mittels eines Röntgenfluoreszenz-Analysenverfahrens (RFA, XRF) (Fischerscope XDV-SDD, Software WIN-FTM Version 6.28-S-PDM) bestimmt. Messergebnisse Palladiumgehalt: Gehalt an Na-Formaldehydsulfoxylat [g/l] Stromdichte [A/dm2] Pd-Gehalt [Gew.-%] 0 1 4,2 0 2 3,2 0 3 3,0 0,95 1 5,7 0,95 2 3,5 0,95 3 3,4 4,7 1 9,1 4,7 2 6,8 4,7 3 5,4 The palladium content of the deposited layers was determined by means of an X-ray fluorescence analysis method (RFA, XRF) (Fischerscope XDV-SDD, software WIN-FTM version 6.28-S-PDM). Measurement results of palladium content: Content of Na formaldehyde sulfoxylate [g / l] Current density [A / dm2] Pd content [% by weight] 0 1 4.2 0 2 3.2 0 3 3.0 0.95 1 5,7 0.95 2 3.5 0.95 3 3.4 4.7 1 9.1 4.7 2 6.8 4.7 3 5.4

Die Ergebnisse der Bestimmung des Palladiumgehalts sind in Fig. 1 abgebildet.The results of the determination of the palladium content are in Fig. 1 displayed.

Die Helligkeit der abgeschiedenen Schichten wurde in Form des L*-Werts gemäß CIEL*a*b gemessen. Messergebnisse: Gehalt an Na-Formaldehydsulfoxylat [g/l] Stromdichte [A/dm2] Helligkeit [L*] 0 1 78,3 0 2 73,4 0 3 73,0 0,95 1 73,6 0,95 2 83,0 0,95 3 80,5 4,7 1 75,6 4,7 2 77,2 4,7 3 78,8 The brightness of the deposited layers was measured in terms of the L * value according to CIEL * a * b. Measurement results: Content of Na formaldehyde sulfoxylate [g / l] Current density [A / dm2] Brightness [L *] 0 1 78.3 0 2 73.4 0 3 73.0 0.95 1 73.6 0.95 2 83.0 0.95 3 80.5 4.7 1 75.6 4.7 2 77.2 4.7 3 78.8

Ausführungsbeispiel 2Embodiment 2

  • Grundelektrolyt:
    • 80 ml/l Methansulfonsäure 70%
    • 5 g/l Harnstoff
    • 10 g/l Palladium (als Palladiumchlorid)
    • 6 g/l Silber (als Silbermethansulfonat)
    • 1,0 g/l Tellur (als Kaliumtellurit)
    Supporting electrolyte:
    • 80 ml / l methanesulfonic acid 70%
    • 5 g / l urea
    • 10 g / l palladium (as palladium chloride)
    • 6 g / l silver (as silver methanesulfonate)
    • 1.0 g / l tellurium (as potassium tellurite)
  • Reduktionsmittel:
    • 0 g/l Ascorbinsäure
    • 0,14 g/l Ascorbinsäure
    • 0,42 g/l Ascorbinsäure
    Reducing agent:
    • 0 g / l ascorbic acid
    • 0.14 g / l ascorbic acid
    • 0.42 g / l ascorbic acid
  • Temperatur: 60°CTemperature: 60 ° C
  • Anoden: PtTiAnodes: PtTi

Der Palladiumgehalt der abgeschiedenen Schichten wurde mittels eines Röntgenfluoreszenz-Analysenverfahrens (RFA) bestimmt. Messergebnisse Palladiumgehalt: Ascorbinsäuregehalt [g/l] Stromdichte [A/dm2] Pd-Gehalt [Gew.-%] 0 1 3,8 0 2 2,9 0 3 2,7 0,14 1 4,2 0,14 2 3,1 0,14 3 2,7 0,42 1 5,3 0,42 2 3,6 0,42 3 3,3 The palladium content of the deposited layers was determined by an X-ray fluorescence analysis method (RFA). Measurement results of palladium content: Ascorbic acid content [g / l] Current density [A / dm2] Pd content [% by weight] 0 1 3.8 0 2 2.9 0 3 2.7 0.14 1 4.2 0.14 2 3.1 0.14 3 2.7 0.42 1 5.3 0.42 2 3.6 0.42 3 3.3

Die Ergebnisse der Bestimmung des Palladiumgehalts sind in Fig. 2 abgebildet.The results of the determination of the palladium content are in Fig. 2 displayed.

Die Helligkeit der abgeschiedenen Schichten wurde in Form des L*-Werts gemäß CIEL*a*b gemessen. Messergebnisse Helligkeit: Ascorbinsäuregehalt [g/l] Stromdichte [A/dm2] Helligkeit [L*] 0 1 81,8 0 2 67,9 0 3 64,5 0,14 1 83,6 0,14 2 76,6 0,14 3 71,0 0,42 1 83,0 0,42 2 79,0 0,42 3 73,6 The brightness of the deposited layers was measured in terms of the L * value according to CIEL * a * b. Measurement results Brightness: Ascorbic acid content [g / l] Current density [A / dm2] Brightness [L *] 0 1 81.8 0 2 67.9 0 3 64.5 0.14 1 83.6 0.14 2 76.6 0.14 3 71.0 0.42 1 83.0 0.42 2 79.0 0.42 3 73.6

Ausführungsbeispiel 3Embodiment 3

  • Grundelektrolyt:
    • 100 ml/l Methansulfonsäure 70%
    • 5 g/l Valin
    • 12 g/l Palladium (als Palladiumhydroxid)
    • 25 g/l Silber (als Silbernitrat)
    • 1,5 g/l Tellur (als Tellurige Säure)
    Supporting electrolyte:
    • 100 ml / l methanesulfonic acid 70%
    • 5 g / l valine
    • 12 g / l palladium (as palladium hydroxide)
    • 25 g / l silver (as silver nitrate)
    • 1.5 g / l tellurium (as telluric acid)
  • Reduktionsmittel:
    • 0 g/l Hydrochinon
    • 0,5 g/l Hydrochinon
    • 1 g/l Hydrochinon
    Reducing agent:
    • 0 g / l hydroquinone
    • 0.5 g / l hydroquinone
    • 1 g / l hydroquinone
  • Temperatur: 60°CTemperature: 60 ° C
  • Anoden: GraphitAnodes: graphite

Der Palladiumgehalt der abgeschiedenen Schichten wurde mittels eines Röntgenfluoreszenz-Analysenverfahrens (RFA) bestimmt. Messergebnisse Palladiumgehalt: Hydrochinongehalt [g/l] Stromdichte [A/dm2] Pd-Gehalt [Gew.-%] 0 1 1,4 0 2 2,9 0 3 2,8 0,5 1 6,8 0,5 2 5,5 0,5 3 6,0 1,0 1 16,8 1,0 2 15,0 1,0 3 14,4 The palladium content of the deposited layers was determined by an X-ray fluorescence analysis method (RFA). Measurement results of palladium content: Hydroquinone content [g / l] Current density [A / dm2] Pd content [% by weight] 0 1 1.4 0 2 2.9 0 3 2.8 0.5 1 6.8 0.5 2 5.5 0.5 3 6.0 1.0 1 16.8 1.0 2 15.0 1.0 3 14.4

Die Ergebnisse der Bestimmung des Palladiumgehalts sind in Fig. 3 abgebildet.The results of the determination of the palladium content are in Fig. 3 displayed.

Die Helligkeit der abgeschiedenen Schichten wurde in Form des L*-Werts gemäß CIEL*a*b gemessen. Messergebnisse Helligkeit: Hydrochinongehalt [g/l] Stromdichte [A/dm2] Helligkeit [L*] 0 1 81,7 0 2 77,8 0 3 72,5 0,5 1 83,1 0,5 2 81,6 0,5 3 77,1 1,0 1 76,5 1,0 2 77,7 1,0 3 73,8 The brightness of the deposited layers was measured in terms of the L * value according to CIEL * a * b. Measurement results Brightness: Hydroquinone content [g / l] Current density [A / dm2] Brightness [L *] 0 1 81.7 0 2 77.8 0 3 72.5 0.5 1 83.1 0.5 2 81.6 0.5 3 77.1 1.0 1 76.5 1.0 2 77.7 1.0 3 73.8

Ausführungsbeispiel 4Embodiment 4

  • Grundelektrolyt:
    • 200 ml/l Methansulfonsäure 70%
    • 2 g/l Glycin
    • 15 g/l Palladium (als Palladiumsulfat)
    • 8 g/l Silber (als Silbercarbonat)
    • 0,5 g/l Tellur (als Tellurige Säure)
    Supporting electrolyte:
    • 200 ml / l methanesulfonic acid 70%
    • 2 g / l glycine
    • 15 g / l palladium (as palladium sulfate)
    • 8 g / l silver (as silver carbonate)
    • 0.5 g / l tellurium (as telluric acid)
  • Reduktionsmittel:
    • 0 g/l Natriumsulfit
    • 1 g/l Natriumsulfit
    • 2 g/l Natriumsulfit
    Reducing agent:
    • 0 g / l sodium sulfite
    • 1 g / l sodium sulfite
    • 2 g / l sodium sulfite
  • Temperatur: 40°CTemperature: 40 ° C
  • Anoden: PtTiAnodes: PtTi

Der Palladiumgehalt der abgeschiedenen Schichten wurde mittels eines Röntgenfluoreszenz-Analysenverfahrens (RFA) bestimmt. Messergebnisse Palladiumgehalt: Natriumsulfitgehalt [g/l] Stromdichte [A/dm2] Pd-Gehalt [Gew.-%] 0 1 6,2 0 2 4,9 0 3 3,5 1,0 1 10,0 1,0 2 8,1 1,0 3 8,1 2,0 1 15,6 2,0 2 12,3 2,0 3 11,7 The palladium content of the deposited layers was determined by an X-ray fluorescence analysis method (RFA). Measurement results of palladium content: Sodium sulphite content [g / l] Current density [A / dm2] Pd content [% by weight] 0 1 6.2 0 2 4.9 0 3 3.5 1.0 1 10.0 1.0 2 8.1 1.0 3 8.1 2.0 1 15.6 2.0 2 12.3 2.0 3 11.7

Die Ergebnisse der Bestimmung des Palladiumgehalts sind in Fig. 3 abgebildet.The results of the determination of the palladium content are in Fig. 3 displayed.

Die Helligkeit der abgeschiedenen Schichten wurde in Form des L*-Werts gemäß CIEL*a*b gemessen. Messergebnisse Helligkeit: Natriumsulfitgehalt [g/l] Stromdichte [A/dm2] Helligkeit [L*] 0 1 80,0 0 2 76,3 0 3 71,1 1,0 1 81,8 1,0 2 82,2 1,0 3 81,2 2,0 1 78,4 2,0 2 77,8 2,0 3 78,3 The brightness of the deposited layers was measured in terms of the L * value according to CIEL * a * b. Measurement results Brightness: Sodium sulphite content [g / l] Current density [A / dm2] Brightness [L *] 0 1 80.0 0 2 76.3 0 3 71.1 1.0 1 81.8 1.0 2 82.2 1.0 3 81.2 2.0 1 78.4 2.0 2 77.8 2.0 3 78.3

Claims (12)

  1. Cyanide-free, acidic, and aqueous electrolyte for the electrolytic deposition of bright, predominantly silver-containing, silver-palladium alloys which, in their dissolved form, contains the following components:
    a) a silver compound in a concentration of 1 - 300 g/L silver;
    b) a palladium compound in a concentration of 0.1 - 100 g/L palladium;
    c) a tellurium and/or selenium compound in a concentration of 0.002 - 10 g/L tellurium and/or selenium, based on the total amount of tellurium and selenium in the electrolyte;
    d) urea and/or urea derivatives in a concentration of 0.05 - 1.5 mol/L, based upon the total amount of urea and urea derivatives in the electrolyte and/or one or more α-amino acids, selected from the group consisting of alanine, aspartic acid, cysteine, glutamine, glutamic acid, glycine, lysine, leucine, methionine, phenylalanine, phenylglycine, proline, serine, tyrosine, and valine in a concentration of 0.005 - 0.5 mol/L, based on the total amount of amino acids in the electrolyte;
    e) at least one sulfonic acid in a concentration of 0.25 - 4.75 mol/L, based upon the total amount of sulfonic acids,
    characterized in that the electrolyte additionally has
    f) at least one reducing agent selected from the group of formic acid, oxalic acid, ascorbic acid, hydrazine, hexamethylenetetramine, salts and/or esters of sulfurous acid, gaseous sulfites, sulfinic acids and their salts and/or esters, formaldehyde, sodium formaldehyde sulfoxylate, benzaldehyde, benzaldehyde derivatives, hydroxybenzenes and their esters, polyphenols and their esters, phenolsulfonic acids and their salts and/or esters, and glutathione, as well as its salts and/or esters
    in a concentration of 1 - 100 mmol/L, based upon the total amount of these reducing agents.
  2. Electrolyte according to claim 1, characterized in that the silver compound is selected from silver nitrate, silver carbonate, silver methane sulfonate, silver chloride, and silver oxide.
  3. Electrolyte according to any one of claims 1 and 2, characterized in that the palladium compound is selected from palladium hydroxide, palladium chloride, palladium glycinate, palladium methane sulfonate, and palladium sulfate.
  4. Electrolyte according to any one of claims 1 to 3, characterized in that the selenium and/or tellurium compounds are selected from tellurites, selenites, tellurous acid, selenious acid, telluric acid, and selenate as well as tellurate.
  5. Electrolyte according to any one of claims 1 to 4, characterized in that the α-amino acid is selected from alanine, glycine, and valine.
  6. Electrolyte according to any one of claims 1 to 4, characterized in that component (d) is urea.
  7. Electrolyte according to any one of claims 1 to 6, characterized in that the at least one sulfonic acid is selected from ethane sulfonic acid, propane sulfonic acid, benzene sulfonic acid, and methane sulfonic acid.
  8. Electrolyte according to any one of claims 1 to 7, characterized in that the at least one reducing agent is selected from hydroxyphenols, ascorbic acid, and salts and/or esters of sulfurous acid.
  9. Method for the electrolytic deposition of predominantly silver-containing silver-palladium layers from an electrolyte according to any one of claims 1 to 8, characterized in that an electrically conductive substrate is immersed in the electrolyte and a flow of current established between an anode in contact with the electrolyte and the substrate as cathode.
  10. Method according to claim 9, characterized in that the electrolyte temperature is 25 to 70 °C.
  11. Method according to any one of claims 9 and 10, characterized in that the current strength is between 0.5 and 20 A/dm2 during the electrolysis.
  12. Method according to any one of claims 9 to 11, characterized in that the pH value is continuously set to a value of <2 during the electrolysis.
EP15190885.2A 2015-10-21 2015-10-21 Additive for silver palladium alloy electrolytes Not-in-force EP3159435B1 (en)

Priority Applications (9)

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PL15190885T PL3159435T3 (en) 2015-10-21 2015-10-21 Additive for silver palladium alloy electrolytes
EP15190885.2A EP3159435B1 (en) 2015-10-21 2015-10-21 Additive for silver palladium alloy electrolytes
TW105132420A TW201728787A (en) 2015-10-21 2016-10-06 Additive for silver-palladium alloy electrolytes
CN201680061439.2A CN108350592A (en) 2015-10-21 2016-10-19 Additive for silver palladium alloy electrolyte
PCT/EP2016/075096 WO2017067985A1 (en) 2015-10-21 2016-10-19 Additive for silver-palladium alloy electrolytes
JP2018520151A JP2018535318A (en) 2015-10-21 2016-10-19 Additive for silver-palladium alloy electrolyte
KR1020187014301A KR20180072774A (en) 2015-10-21 2016-10-19 Additives for Silver-Palladium Alloy Electrolytes
EP16784879.5A EP3365478A1 (en) 2015-10-21 2016-10-19 Additive for silver-palladium alloy electrolytes
US15/767,234 US20190071789A1 (en) 2015-10-21 2016-10-19 Additive for silver-palladium alloy electrolytes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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EP (2) EP3159435B1 (en)
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KR20210044866A (en) 2018-08-21 2021-04-23 유미코아 갈바노테히닉 게엠베하 Electrolyte for cyanide-free deposition of silver
DE102019106004B4 (en) * 2019-03-08 2023-11-30 Umicore Galvanotechnik Gmbh Additive for the cyanide-free deposition of silver
DE102018126174B3 (en) * 2018-10-22 2019-08-29 Umicore Galvanotechnik Gmbh Thermally stable silver alloy layers, methods of deposition and use
US11242609B2 (en) 2019-10-15 2022-02-08 Rohm and Hass Electronic Materials LLC Acidic aqueous silver-nickel alloy electroplating compositions and methods
DE102020109818A1 (en) * 2020-04-08 2021-04-22 Doduco Solutions Gmbh Electrical connector for connecting an electric vehicle to a charging station
CN111455360A (en) * 2020-05-06 2020-07-28 广东工业大学 Chemical palladium plating reducing agent and chemical palladium plating solution

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US20190071789A1 (en) 2019-03-07
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