ATE521734T1 - Cyanidfreies pyrophosphorsäure-bad zum elektrolytischen abscheiden von kupfer- zinnlegierungsüberzügen - Google Patents
Cyanidfreies pyrophosphorsäure-bad zum elektrolytischen abscheiden von kupfer- zinnlegierungsüberzügenInfo
- Publication number
- ATE521734T1 ATE521734T1 AT00305825T AT00305825T ATE521734T1 AT E521734 T1 ATE521734 T1 AT E521734T1 AT 00305825 T AT00305825 T AT 00305825T AT 00305825 T AT00305825 T AT 00305825T AT E521734 T1 ATE521734 T1 AT E521734T1
- Authority
- AT
- Austria
- Prior art keywords
- bath
- copper
- pyrophosphoric acid
- cyanide
- acid bath
- Prior art date
Links
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical group [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 title abstract 2
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 title abstract 2
- 229940005657 pyrophosphoric acid Drugs 0.000 title abstract 2
- 230000008021 deposition Effects 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 2
- 239000000654 additive Substances 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- NDZFNTHGIIQMQI-UHFFFAOYSA-N 1-benzylpyridin-1-ium Chemical class C=1C=CC=C[N+]=1CC1=CC=CC=C1 NDZFNTHGIIQMQI-UHFFFAOYSA-N 0.000 abstract 1
- 229910017755 Cu-Sn Inorganic materials 0.000 abstract 1
- 229910017927 Cu—Sn Inorganic materials 0.000 abstract 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical class O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 239000003093 cationic surfactant Substances 0.000 abstract 1
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000007613 environmental effect Effects 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- RYZCLUQMCYZBJQ-UHFFFAOYSA-H lead(2+);dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Pb+2].[Pb+2].[Pb+2].[O-]C([O-])=O.[O-]C([O-])=O RYZCLUQMCYZBJQ-UHFFFAOYSA-H 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 239000010865 sewage Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 239000003381 stabilizer Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000114282A JP3455712B2 (ja) | 2000-04-14 | 2000-04-14 | 銅−スズ合金めっき用ピロリン酸浴 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE521734T1 true ATE521734T1 (de) | 2011-09-15 |
Family
ID=18626109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT00305825T ATE521734T1 (de) | 2000-04-14 | 2000-07-10 | Cyanidfreies pyrophosphorsäure-bad zum elektrolytischen abscheiden von kupfer- zinnlegierungsüberzügen |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6416571B1 (de) |
| EP (1) | EP1146148B1 (de) |
| JP (1) | JP3455712B2 (de) |
| AT (1) | ATE521734T1 (de) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3455712B2 (ja) * | 2000-04-14 | 2003-10-14 | 日本ニュークローム株式会社 | 銅−スズ合金めっき用ピロリン酸浴 |
| US6773573B2 (en) | 2001-10-02 | 2004-08-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| EP1553213B1 (de) * | 2002-06-13 | 2013-05-29 | Nihon New Chrome Co. Ltd. | Abscheidung einer legierung auf kupfer-zinn-sauerstoff-basis |
| US7867625B2 (en) * | 2002-06-13 | 2011-01-11 | Nihon New Chrome Co., Ltd. | Copper-tin-oxygen alloy plating |
| JP4249438B2 (ja) * | 2002-07-05 | 2009-04-02 | 日本ニュークローム株式会社 | 銅―錫合金めっき用ピロリン酸浴 |
| JP4535786B2 (ja) * | 2004-06-18 | 2010-09-01 | 三井金属鉱業株式会社 | 含銅スズ粉、その含銅スズ粉を含む混合粉体、その含銅スズ粉の製造方法、及び、その含銅スズ粉又は混合粉体を用いた導電ペースト |
| US7296370B2 (en) * | 2004-09-24 | 2007-11-20 | Jarden Zinc Products, Inc. | Electroplated metals with silvery-white appearance and method of making |
| EP1791693B1 (de) * | 2004-09-24 | 2012-06-27 | Jarden Zinc Products, LLC | Galvanisierte metalle von silbrigweissem aussehen und herstellungsverfahren dafür |
| JP2008522030A (ja) * | 2004-11-29 | 2008-06-26 | テクニック・インコーポレイテッド | ほぼ中性ｐＨのスズ電気めっき用溶液 |
| JP4681936B2 (ja) * | 2005-05-20 | 2011-05-11 | 福田金属箔粉工業株式会社 | プラズマディスプレイ電磁波シールドフィルター用銅箔 |
| EP1961840B1 (de) | 2007-02-14 | 2009-12-30 | Umicore Galvanotechnik GmbH | Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten |
| CN101270492B (zh) * | 2007-03-21 | 2010-12-29 | 来明工业(厦门)有限公司 | 锡铜合金镀层的电镀液及电镀方法 |
| PL2103717T3 (pl) * | 2008-02-29 | 2010-07-30 | Atotech Deutschland Gmbh | Kąpiel oparta na pirofosforanach do nakładania warstw stopów cyny |
| DE502008001647D1 (de) * | 2008-05-08 | 2010-12-09 | Umicore Galvanotechnik Gmbh | Modifizierter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten |
| SI2130948T1 (sl) | 2008-06-02 | 2011-04-29 | Atotech Deutschland Gmbh | Kopel, ki vsebuje pirofosfat, za elektrolitsko nanašanje zlitin bakra-kositra brez cianida |
| DE102008032398A1 (de) | 2008-07-10 | 2010-01-14 | Umicore Galvanotechnik Gmbh | Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten |
| CN101768768B (zh) * | 2008-12-26 | 2012-01-25 | 比亚迪股份有限公司 | 一种铝合金无氰无镍电镀方法及其电镀产品 |
| JP5569718B2 (ja) * | 2009-08-21 | 2014-08-13 | キザイ株式会社 | シアンフリー光沢銅−スズ合金めっき浴 |
| DE102009041250B4 (de) | 2009-09-11 | 2011-09-01 | Umicore Galvanotechnik Gmbh | Verfahren zur elektrolytischen Verkupferung von Zinkdruckguss mit verringerter Neigung zur Blasenbildung |
| DE102011008836B4 (de) | 2010-08-17 | 2013-01-10 | Umicore Galvanotechnik Gmbh | Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten |
| JP5731802B2 (ja) * | 2010-11-25 | 2015-06-10 | ローム・アンド・ハース電子材料株式会社 | 金めっき液 |
| JP5595301B2 (ja) * | 2011-02-22 | 2014-09-24 | Ｊｘ日鉱日石金属株式会社 | 銅電解液 |
| CN102220610B (zh) * | 2011-07-29 | 2012-12-05 | 福州大学 | 一种无氰型铜锡合金电镀液 |
| DE102011121798B4 (de) | 2011-12-21 | 2013-08-29 | Umicore Galvanotechnik Gmbh | Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle |
| DE102011121799B4 (de) | 2011-12-21 | 2013-08-29 | Umicore Galvanotechnik Gmbh | Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle |
| CN103668359B (zh) * | 2012-09-06 | 2016-03-02 | 上海造币有限公司 | 一种多层无氰电镀铜-锡合金镀层的电镀液、电镀工艺及其硬币 |
| CN103668402B (zh) * | 2013-10-08 | 2016-06-08 | 常州大学 | 一种纳米复合高锡铜合金电镀材料的制备方法 |
| CN104152955A (zh) * | 2014-07-17 | 2014-11-19 | 广东致卓精密金属科技有限公司 | 碱性溶液电镀光亮白铜锡电镀液及工艺 |
| KR101636361B1 (ko) * | 2014-07-31 | 2016-07-06 | 주식회사 에이피씨티 | 과불소화알킬 계면활성제를 함유하는 솔더범프용 주석합금 전기도금액 |
| JP6491989B2 (ja) * | 2014-10-10 | 2019-03-27 | 日本ニュークローム株式会社 | 表面の虹色着色処理方法 |
| CN104480501A (zh) * | 2014-11-28 | 2015-04-01 | 广东致卓精密金属科技有限公司 | 一种用于滚镀的高锡铜锡合金电镀液和工艺 |
| JP6631349B2 (ja) * | 2015-03-26 | 2020-01-15 | 三菱マテリアル株式会社 | アンモニウム塩を用いためっき液 |
| KR101994248B1 (ko) * | 2015-04-28 | 2019-06-28 | 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 | 전기 도금욕에 대한 첨가제로서 모노아민 및 비스안하이드라이드의 반응 생성물과 디아민의 반응 생성물 |
| CN110357059A (zh) * | 2019-08-01 | 2019-10-22 | 江苏海洋大学 | 一种水热制备焦磷酸锡自组装微米球的方法 |
| CN110644021B (zh) * | 2019-09-16 | 2021-07-06 | 铜陵市华创新材料有限公司 | 一种锂离子电池用4.5μm电解铜箔、制备方法及添加剂 |
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| US3940319A (en) * | 1974-06-24 | 1976-02-24 | Nasglo International Corporation | Electrodeposition of bright tin-nickel alloy |
| US4046648A (en) * | 1975-09-29 | 1977-09-06 | E. I. Du Pont De Nemours And Company | Polyamine additives in alkaline zinc electroplating |
| US4076600A (en) * | 1976-12-20 | 1978-02-28 | R. O. Hull & Company, Inc. | Leveling agent for acid zinc electroplating baths and method |
| US4146441A (en) * | 1977-10-06 | 1979-03-27 | R. O. Hull & Company, Inc. | Additive compositions, baths, and methods for electrodepositing bright zinc deposits |
| JPS5672196A (en) * | 1979-11-19 | 1981-06-16 | Shimizu Shoji Kk | Bright plating bath for copper-tin alloy |
| JPS5818996B2 (ja) * | 1980-02-21 | 1983-04-15 | キザイ株式会社 | 緻密なめっき被膜を得るための中性錫電気めっき浴 |
| JPS5782491A (en) * | 1980-11-11 | 1982-05-22 | Seiko Instr & Electronics Ltd | Copper-tin alloy plating bath |
| US4526968A (en) * | 1981-08-24 | 1985-07-02 | M&T Chemicals Inc. | Quaternary aminehydroxypropane sulfobetaines |
| JPS59215492A (ja) * | 1983-05-19 | 1984-12-05 | Nippon Kagaku Sangyo Kk | 亜鉛合金の電気鍍金浴 |
| JPS6029482A (ja) * | 1983-07-28 | 1985-02-14 | Nippon Kagaku Sangyo Kk | 錫及び錫合金電気めつき液 |
| DE3339541C2 (de) * | 1983-11-02 | 1986-08-07 | Degussa Ag, 6000 Frankfurt | Alkalisch-cyanidisches Bad zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen |
| JPS60181293A (ja) * | 1984-02-27 | 1985-09-14 | Nippon Hyomen Kagaku Kk | アルカリ性浴からの電気亜鉛−鉄合金めつき法 |
| JPS6169997A (ja) * | 1984-09-13 | 1986-04-10 | Nippon Kagaku Sangyo Kk | 金属塩水溶液 |
| US4582576A (en) * | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
| JP3336621B2 (ja) * | 1991-12-17 | 2002-10-21 | ユケン工業株式会社 | めっき用組成液とめっき方法 |
| DE4324995C2 (de) * | 1993-07-26 | 1995-12-21 | Demetron Gmbh | Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen |
| JPH0827590A (ja) * | 1994-07-13 | 1996-01-30 | Okuno Chem Ind Co Ltd | 光沢銅−錫合金めっき浴 |
| JPH1046385A (ja) * | 1996-08-02 | 1998-02-17 | Daiwa Kasei Kenkyusho:Kk | 電気・電子回路部品 |
| JP3674887B2 (ja) * | 1996-09-30 | 2005-07-27 | 日本ニュークローム株式会社 | 銅−スズ合金メッキ用ピロリン酸浴 |
| JPH10245694A (ja) * | 1997-03-03 | 1998-09-14 | Murata Mfg Co Ltd | 錫又は錫合金電気メッキ浴、およびそれを用いた電気メッキ方法 |
| JP4132247B2 (ja) * | 1998-07-09 | 2008-08-13 | 株式会社大和化成研究所 | 電気・電子回路部品 |
| JP4249292B2 (ja) * | 1998-07-10 | 2009-04-02 | 株式会社大和化成研究所 | 錫及び錫合金メッキ浴 |
| US6508927B2 (en) * | 1998-11-05 | 2003-01-21 | C. Uyemura & Co., Ltd. | Tin-copper alloy electroplating bath |
| JP2000265294A (ja) * | 1999-03-15 | 2000-09-26 | Matsushita Electric Ind Co Ltd | 錫及び錫合金めっき浴、めっき皮膜及び半導体装置用のリードフレーム |
| JP3455712B2 (ja) * | 2000-04-14 | 2003-10-14 | 日本ニュークローム株式会社 | 銅−スズ合金めっき用ピロリン酸浴 |
-
2000
- 2000-04-14 JP JP2000114282A patent/JP3455712B2/ja not_active Expired - Lifetime
- 2000-06-29 US US09/606,269 patent/US6416571B1/en not_active Expired - Lifetime
- 2000-07-10 EP EP00305825A patent/EP1146148B1/de not_active Expired - Lifetime
- 2000-07-10 AT AT00305825T patent/ATE521734T1/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US6416571B1 (en) | 2002-07-09 |
| JP3455712B2 (ja) | 2003-10-14 |
| EP1146148A3 (de) | 2004-02-04 |
| JP2001295092A (ja) | 2001-10-26 |
| EP1146148B1 (de) | 2011-08-24 |
| EP1146148A2 (de) | 2001-10-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |