JPS5782491A - Copper-tin alloy plating bath - Google Patents

Copper-tin alloy plating bath

Info

Publication number
JPS5782491A
JPS5782491A JP15868680A JP15868680A JPS5782491A JP S5782491 A JPS5782491 A JP S5782491A JP 15868680 A JP15868680 A JP 15868680A JP 15868680 A JP15868680 A JP 15868680A JP S5782491 A JPS5782491 A JP S5782491A
Authority
JP
Japan
Prior art keywords
copper
wts
plating bath
alloy plating
average mol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15868680A
Other languages
Japanese (ja)
Inventor
Kenichi Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP15868680A priority Critical patent/JPS5782491A/en
Publication of JPS5782491A publication Critical patent/JPS5782491A/en
Pending legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To provide a novel copper-tin alloy plating bath which is industrially utilizable and gives luster by adding two kinds of polyethylene glycols of specific mol. wts. to a copper-tin alloy plating bath of copper cyanide-tin pyrophosphate.
CONSTITUTION: Polyethylene glycol of ≤1,500 average mol, wts., and polyethylene glycol of 2,000W5,000 average mol. wts. are added to a copper-tin alloy plating bath. It is desirable to add about 1.0W100g/l the polyethylene glycol of ≤1,500 average mol. wts., and the polyethylene glycol of 2,000W5,000 average mol. wts. is added at about 0.5W2g/l in general in the case of 3,000 average mol. wt., and at about 0.2W1.0g/l in the case of 5,000 average mol. wt. Further, it is possible to improve the luster effect of high electric current density parts by adding about 1W20g/l amino acid, for example, alanine or arginine.
COPYRIGHT: (C)1982,JPO&Japio
JP15868680A 1980-11-11 1980-11-11 Copper-tin alloy plating bath Pending JPS5782491A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15868680A JPS5782491A (en) 1980-11-11 1980-11-11 Copper-tin alloy plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15868680A JPS5782491A (en) 1980-11-11 1980-11-11 Copper-tin alloy plating bath

Publications (1)

Publication Number Publication Date
JPS5782491A true JPS5782491A (en) 1982-05-22

Family

ID=15677133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15868680A Pending JPS5782491A (en) 1980-11-11 1980-11-11 Copper-tin alloy plating bath

Country Status (1)

Country Link
JP (1) JPS5782491A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001295092A (en) * 2000-04-14 2001-10-26 Nippon New Chrome Kk Pyrophosphoric acid bath for copper-tin alloy plating
US8043662B2 (en) 2005-08-22 2011-10-25 Rohm And Haas Electronic Materials Llc Aqueous solution for surface treatment of metal and method for preventing discoloration of metal surface

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001295092A (en) * 2000-04-14 2001-10-26 Nippon New Chrome Kk Pyrophosphoric acid bath for copper-tin alloy plating
US8043662B2 (en) 2005-08-22 2011-10-25 Rohm And Haas Electronic Materials Llc Aqueous solution for surface treatment of metal and method for preventing discoloration of metal surface

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