CN103668402B - 一种纳米复合高锡铜合金电镀材料的制备方法 - Google Patents
一种纳米复合高锡铜合金电镀材料的制备方法 Download PDFInfo
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- CN103668402B CN103668402B CN201310463482.XA CN201310463482A CN103668402B CN 103668402 B CN103668402 B CN 103668402B CN 201310463482 A CN201310463482 A CN 201310463482A CN 103668402 B CN103668402 B CN 103668402B
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- 238000009713 electroplating Methods 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 title claims abstract description 11
- 239000002114 nanocomposite Substances 0.000 title abstract 2
- 229910000597 tin-copper alloy Inorganic materials 0.000 title abstract 2
- 238000007747 plating Methods 0.000 claims abstract description 66
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000011248 coating agent Substances 0.000 claims abstract description 26
- 238000000576 coating method Methods 0.000 claims abstract description 26
- 239000011858 nanopowder Substances 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 229910052593 corundum Inorganic materials 0.000 claims description 21
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 21
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 16
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 238000012360 testing method Methods 0.000 claims description 13
- 229910001369 Brass Inorganic materials 0.000 claims description 11
- 239000010951 brass Substances 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 230000004913 activation Effects 0.000 claims description 8
- 239000003513 alkali Substances 0.000 claims description 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 8
- 229910000396 dipotassium phosphate Inorganic materials 0.000 claims description 8
- 239000010935 stainless steel Substances 0.000 claims description 8
- 229910001220 stainless steel Inorganic materials 0.000 claims description 8
- 239000001117 sulphuric acid Substances 0.000 claims description 8
- 235000011149 sulphuric acid Nutrition 0.000 claims description 8
- 238000006386 neutralization reaction Methods 0.000 claims description 7
- 238000011010 flushing procedure Methods 0.000 claims description 5
- 210000000952 spleen Anatomy 0.000 claims description 2
- 210000002784 stomach Anatomy 0.000 claims description 2
- 239000002131 composite material Substances 0.000 abstract description 19
- 239000000956 alloy Substances 0.000 abstract description 8
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract description 5
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 abstract description 3
- 235000011180 diphosphates Nutrition 0.000 abstract description 3
- 238000009826 distribution Methods 0.000 abstract description 3
- 229910021645 metal ion Inorganic materials 0.000 abstract description 2
- 239000011148 porous material Substances 0.000 abstract description 2
- 238000004070 electrodeposition Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 15
- 239000010949 copper Substances 0.000 description 13
- 239000012153 distilled water Substances 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 7
- 238000013019 agitation Methods 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 239000002585 base Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- 239000012669 liquid formulation Substances 0.000 description 5
- 238000003760 magnetic stirring Methods 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 229910000570 Cupronickel Inorganic materials 0.000 description 4
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 4
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000010183 spectrum analysis Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 206010016825 Flushing Diseases 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- LEKPFOXEZRZPGW-UHFFFAOYSA-N copper;dicyanide Chemical compound [Cu+2].N#[C-].N#[C-] LEKPFOXEZRZPGW-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- -1 mantoquita Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
实例 | 不同测试点的显微硬度(HV) | 显微硬度的平均值(HV) |
1 | 110.6,118.3,119.9,120.0,112.4 | 116.24 |
2 | 121.4,124.6,120.0,121.0,120.9 | 121.58 |
3 | 153.6,142.8,144.1,140.7,149.2 | 146.08 |
4 | 130.7,130.8,131.0,146.5,131.2 | 134.04 |
5 | 140.1,133.8,137.3,134.1,134.8 | 136.02 |
元素 | 重量百分比(wt%) |
O | 2.83 |
Al | 0.20 |
Cu | 54.50 |
Sn | 42.47 |
总量 | 100.00 |
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310463482.XA CN103668402B (zh) | 2013-10-08 | 2013-10-08 | 一种纳米复合高锡铜合金电镀材料的制备方法 |
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Application Number | Priority Date | Filing Date | Title |
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CN201310463482.XA CN103668402B (zh) | 2013-10-08 | 2013-10-08 | 一种纳米复合高锡铜合金电镀材料的制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN103668402A CN103668402A (zh) | 2014-03-26 |
CN103668402B true CN103668402B (zh) | 2016-06-08 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105603449B (zh) * | 2015-12-22 | 2018-01-05 | 北京化工大学 | 一种Cu2ZnSnS4半导体薄膜及其电化学制备方法 |
CN107227469B (zh) * | 2017-06-26 | 2019-01-15 | 南京市产品质量监督检验院 | 一种3d硬金电铸液、其制备方法及其应用 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6416571B1 (en) * | 2000-04-14 | 2002-07-09 | Nihon New Chrome Co., Ltd. | Cyanide-free pyrophosphoric acid bath for use in copper-tin alloy plating |
CN101918618A (zh) * | 2008-02-29 | 2010-12-15 | 阿托特德国有限公司 | 用于电镀锡合金层的焦磷酸盐基镀液 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4157308B2 (ja) * | 2001-06-27 | 2008-10-01 | シャープ株式会社 | めっき膜の形成方法及び該方法によりめっき膜が形成された電子部品 |
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2013
- 2013-10-08 CN CN201310463482.XA patent/CN103668402B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6416571B1 (en) * | 2000-04-14 | 2002-07-09 | Nihon New Chrome Co., Ltd. | Cyanide-free pyrophosphoric acid bath for use in copper-tin alloy plating |
CN101918618A (zh) * | 2008-02-29 | 2010-12-15 | 阿托特德国有限公司 | 用于电镀锡合金层的焦磷酸盐基镀液 |
Non-Patent Citations (2)
Title |
---|
Electrodeposition and characterization of Al2O3–Cu(Sn), CaF2–Cu(Sn)and talc–Cu(Sn) electrocomposite coatings;Y.L.Wang;《Surface and Coatings Technology》;19980804;第106卷;第162–166页 * |
无氰电镀高锡铜锡合金工艺;刘建平;《电镀与涂饰》;20080315(第3期);第9-11页 * |
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Effective date of registration: 20231227 Address after: 321 Provincial Road, Yi'an Economic Development Zone, Yi'an District, Tongling City, Anhui Province, 244000 Patentee after: Anhui Hangtong Surface Decoration Co.,Ltd. Address before: 237000 Hangbu Town Economic Development Zone, Shucheng County, Luan City, Anhui Province Patentee before: Anhui Jinrui surface treatment Co.,Ltd. |