EP2669407B1 - Galvanische Bäder zur Herstellung einer niederkarätigen Goldlegierung und galvanischer Process verwendent diese Bäder - Google Patents
Galvanische Bäder zur Herstellung einer niederkarätigen Goldlegierung und galvanischer Process verwendent diese Bäder Download PDFInfo
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- EP2669407B1 EP2669407B1 EP13170067.6A EP13170067A EP2669407B1 EP 2669407 B1 EP2669407 B1 EP 2669407B1 EP 13170067 A EP13170067 A EP 13170067A EP 2669407 B1 EP2669407 B1 EP 2669407B1
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- EP
- European Patent Office
- Prior art keywords
- salts
- galvanic
- amounts
- gold
- baths
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 8
- 229910001020 Au alloy Inorganic materials 0.000 title claims description 7
- 239000003353 gold alloy Substances 0.000 title claims description 7
- 150000003839 salts Chemical class 0.000 claims description 26
- 239000010931 gold Substances 0.000 claims description 17
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 16
- 229910052737 gold Inorganic materials 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000002253 acid Substances 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 10
- 150000001412 amines Chemical class 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000007864 aqueous solution Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 claims description 7
- 229910052700 potassium Inorganic materials 0.000 claims description 7
- 239000011591 potassium Substances 0.000 claims description 7
- 239000004094 surface-active agent Substances 0.000 claims description 7
- 150000007513 acids Chemical class 0.000 claims description 6
- 239000008139 complexing agent Substances 0.000 claims description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
- 239000000243 solution Substances 0.000 claims description 6
- 230000000536 complexating effect Effects 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 150000002343 gold Chemical class 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- DPRMFUAMSRXGDE-UHFFFAOYSA-N ac1o530g Chemical compound NCCN.NCCN DPRMFUAMSRXGDE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 150000001879 copper Chemical class 0.000 claims description 3
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims description 3
- 150000002471 indium Chemical class 0.000 claims description 3
- 229910052702 rhenium Inorganic materials 0.000 claims description 3
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- GQLPWHMYJOSZCR-UHFFFAOYSA-N (diphosphonoamino)phosphonic acid Chemical compound OP(O)(=O)N(P(O)(O)=O)P(O)(O)=O GQLPWHMYJOSZCR-UHFFFAOYSA-N 0.000 claims description 2
- OXFSTTJBVAAALW-UHFFFAOYSA-N 1,3-dihydroimidazole-2-thione Chemical class SC1=NC=CN1 OXFSTTJBVAAALW-UHFFFAOYSA-N 0.000 claims description 2
- CARFETJZUQORNQ-UHFFFAOYSA-N 1h-pyrrole-2-thiol Chemical class SC1=CC=CN1 CARFETJZUQORNQ-UHFFFAOYSA-N 0.000 claims description 2
- JAAIPIWKKXCNOC-UHFFFAOYSA-N 1h-tetrazol-1-ium-5-thiolate Chemical class SC1=NN=NN1 JAAIPIWKKXCNOC-UHFFFAOYSA-N 0.000 claims description 2
- LLCOQBODWBFTDD-UHFFFAOYSA-N 1h-triazol-1-ium-4-thiolate Chemical class SC1=CNN=N1 LLCOQBODWBFTDD-UHFFFAOYSA-N 0.000 claims description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-M D-gluconate Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O RGHNJXZEOKUKBD-SQOUGZDYSA-M 0.000 claims description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 2
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- IQXHAJSMTNDJGA-UHFFFAOYSA-O azanium;gold(1+);dicyanide Chemical compound [NH4+].[Au+].N#[C-].N#[C-] IQXHAJSMTNDJGA-UHFFFAOYSA-O 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 229940001468 citrate Drugs 0.000 claims description 2
- 150000001860 citric acid derivatives Chemical class 0.000 claims description 2
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 claims description 2
- 235000011180 diphosphates Nutrition 0.000 claims description 2
- KFGJUQRJVQDJHL-UHFFFAOYSA-N ethanethiol Chemical compound CCS.CCS KFGJUQRJVQDJHL-UHFFFAOYSA-N 0.000 claims description 2
- 229940093495 ethanethiol Drugs 0.000 claims description 2
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethyl mercaptane Natural products CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 claims description 2
- -1 ethylenediamine tetramethyl phosphonic acid Chemical compound 0.000 claims description 2
- 229940050410 gluconate Drugs 0.000 claims description 2
- 229910052741 iridium Inorganic materials 0.000 claims description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 150000002688 maleic acid derivatives Chemical class 0.000 claims description 2
- 150000002690 malonic acid derivatives Chemical class 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 claims description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- HBCQSNAFLVXVAY-UHFFFAOYSA-N pyrimidine-2-thiol Chemical class SC1=NC=CC=N1 HBCQSNAFLVXVAY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 125000004434 sulfur atom Chemical group 0.000 claims description 2
- 229940095064 tartrate Drugs 0.000 claims description 2
- 150000003892 tartrate salts Chemical class 0.000 claims description 2
- 229910052714 tellurium Inorganic materials 0.000 claims description 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 2
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims description 2
- 125000004149 thio group Chemical group *S* 0.000 claims description 2
- 150000003573 thiols Chemical class 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 description 12
- 239000000956 alloy Substances 0.000 description 12
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 229960003975 potassium Drugs 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000008367 deionised water Substances 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 229910052793 cadmium Inorganic materials 0.000 description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 231100000614 poison Toxicity 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 229910000337 indium(III) sulfate Inorganic materials 0.000 description 2
- XGCKLPDYTQRDTR-UHFFFAOYSA-H indium(iii) sulfate Chemical compound [In+3].[In+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O XGCKLPDYTQRDTR-UHFFFAOYSA-H 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 239000003440 toxic substance Substances 0.000 description 2
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 description 1
- OCUCCJIRFHNWBP-IYEMJOQQSA-L Copper gluconate Chemical class [Cu+2].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O OCUCCJIRFHNWBP-IYEMJOQQSA-L 0.000 description 1
- MFIHOCAEOJNSOL-UHFFFAOYSA-N [Ag]C#N Chemical class [Ag]C#N MFIHOCAEOJNSOL-UHFFFAOYSA-N 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000012505 colouration Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 229910001449 indium ion Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- 229960002635 potassium citrate Drugs 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- 235000011082 potassium citrates Nutrition 0.000 description 1
- KZVLNAGYSAKYMG-UHFFFAOYSA-N pyridine-2-sulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=N1 KZVLNAGYSAKYMG-UHFFFAOYSA-N 0.000 description 1
- 239000000176 sodium gluconate Substances 0.000 description 1
- 229940005574 sodium gluconate Drugs 0.000 description 1
- 235000012207 sodium gluconate Nutrition 0.000 description 1
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/005—Jewels; Clockworks; Coins
Definitions
- the invention relates to the field of compounds used in galvanic processes, in particular galvanic baths for obtaining a low-carat gold alloy, and to the galvanic process for obtaining said alloy.
- Galvanic baths containing considerable amounts of toxic substances, such as cyanides, and heavy metals, which are also toxic and difficult to remove, for example cadmium, in the matrix have been used for decades to obtain a gold alloy containing less than 75% by weight of gold as metal (corresponding to a gold alloy of 18 carats or less).
- baths of this type also include baths that utilise cyanide in the matrix or that, although they do not contain cyanide in the matrix, contain other doped elements of a certain toxicity.
- US4358351 describes a bath containing gold, copper, zinc, free cyanide and arsenic as gloss additive
- US4487664 describes a bath containing gold-silver and free cyanide
- US5085744 describes a bath containing gold, copper, zinc, free cyanide and antimony as gloss additive
- US4687557 describes a bath containing gold, copper, and cadmium devoid of free cyanide in solution.
- WO 2009/037180 describes a gold alloy plating bath comprising gold, copper and indium ions and free cyanide.
- the present invention makes it possible to satisfy the above-mentioned needs due to alkaline galvanic baths according to claim 1.
- galvanic bath means the aqueous solutions in which the surfaces to be treated by means of the galvanic process are immersed.
- the gold salts are preferably selected from: potassium dicyanoaurate, potassium tetracyanoaurate, ammonium cyanoaurate, or a combination thereof.
- the amount of gold calculated on the basis of the respective salts, is between 0.7 and 4 g/L, preferably between 1.5 and 3 g/L, in order to achieve the desired efficiency and thicknesses.
- copper salts means, for example: sulfate, phosphate, pyrophosphate, chloride, or other salts that are stable under the working conditions of the bath.
- Copper calculated on the basis of the respective salts, is present in an amount between 0.3 and 2.5 g/L, preferably between 0.5 and 2 g/L, in relation to the desired carat value in the 12 - 18 carat range.
- Indium salts useful in accordance with the invention are, for example: chloride, sulfate, citrate, tartrate, gluconate, or any other organic or amine complex compatible with the working conditions of the bath.
- the concentration of indium ranges from 0.1 to 2 g/L, preferably from 0.5 to 1,5 g/L, in relation to the desired carat value in the 12 - 18 carat range.
- the matrix of the bath is formed by polycarboxylic acid salts having both buffer characteristics and complexing power, such as citrates, tartrates, gluconates, maleates, malonates, possibly in combination with the corresponding acids for creation of the expedient buffer, and possibly mixed together in order to achieve the expedient complexing power.
- buffer characteristics and complexing power such as citrates, tartrates, gluconates, maleates, malonates, possibly in combination with the corresponding acids for creation of the expedient buffer, and possibly mixed together in order to achieve the expedient complexing power.
- These acids and the respective salts are each used in an amount ranging from 30 to 150 g/L, more commonly from 50 to 100 g/L.
- Complexing agents that can be expediently used in order to improve the stability of the metals in solution and to regulate the properties thereof in alloy include, for example, ethylenediaminetetraacetic acid and salts thereof, etidronic acid and salts thereof, ethylenediamine tetramethyl phosphonic acid and salts thereof, iminodiacetic acid and salts thereof, nitrilotriphosphonic acid and salts thereof, and nitrilotriacetic acid and salts thereof; these complexing agents normally being used in amounts ranging from 1 to 50 g/L according to the complexing power of each one thereof, a person skilled in the art knowing which complexing agent will be the most suitable for use and in what amounts and combinations, according to the desired carat value in the 12 - 18 carat range.
- a complexing and regulatory action of the alloy metals is due to the amine component of the bath.
- the amines used for this purpose are triethylenetetramine, diethylenetetramine, ethylenediamine and tetraethylenepentamine.
- the amine in question is used in amounts ranging from 0.05 to 1 g/L, more expediently from 0.1 to 0.7 g/L, depending on the desired percentage of indium in alloy, within the carat range from 12 to 18 carats.
- the bath may also obviously contain other components normally used in galvanic processes for their glossing and surfactant action.
- elements such as silver, tellurium, bismuth, iron, zinc, iridium, rhenium, vanadium, molybdenum, tungsten, in such a form so as to be soluble and stable under the working conditions; the amounts to be used range from 0.005 to 0.2 g/L of element as such, and more in particular from 0.010 to 0.1 g/L.
- the formulations according to the invention may also comprise sulfurated compounds, such as organic thiols belonging to the classes of mercaptotetrazoles, mercaptopyrimidines, mercaptopyrrols, mercaptoimidazoles and mercaptotriazoles, possibly containing a sulfur atom in the aromatic ring, possibly having a nitrogen ring condensed with a benzene ring, having one or more thio groups.
- sulfurated compounds such as organic thiols belonging to the classes of mercaptotetrazoles, mercaptopyrimidines, mercaptopyrrols, mercaptoimidazoles and mercaptotriazoles, possibly containing a sulfur atom in the aromatic ring, possibly having a nitrogen ring condensed with a benzene ring, having one or more thio groups.
- the surfactants have both glossing and surfactant action, and those used normally within galvanic scope in baths having matrices of this type are used in this invention: a person skilled in the art will be able to identify the most suitable type to use; however, the amounts used are never greater than 0.005 L/L of an aqueous solution thereof (10% w/v): higher doses lower the efficiency of the bath and create interference with the regular properties of the metals in alloy.
- the bath preferably functions in a pH range between 7 and 12, and more expediently between 8 and 10; the pH is regulated with organic acids belonging to the selected buffer pair, or with mineral acids such as sulfuric acid, phosphoric acid, sulfamic acid, methanesulfonic acid, pyridinesulfonic acid, or with alkali metal hydroxides, such as potassium and sodium.
- organic acids belonging to the selected buffer pair, or with mineral acids such as sulfuric acid, phosphoric acid, sulfamic acid, methanesulfonic acid, pyridinesulfonic acid, or with alkali metal hydroxides, such as potassium and sodium.
- the pH is not a critical parameter in this formulation for obtaining a precise carat value, but it is fundamental that the pH is alkaline for the stability of the components in solution.
- the working temperature of the galvanic bath in question is preferably between 50°C and 70°C; however, this is not a critical parameter for obtaining a precise carat value.
- the current to be applied to the galvanic bath according to the invention is normally between 0.5 - 3 A/cm 2 , preferably 0.7 - 2 A/cm 2 .
- the application times vary according to the amperage imposed and the desired thickness: with the bath according to the invention, it is possible to obtain deposits having thicknesses up to 500 microns.
- gold alloys in which the gold varies from 50% to 75% (percentages expressed in weight) are obtained by deposit at the cathode of the galvanic cell.
- a bath having the following composition was prepared:
- a current of 0.7 A/cm 2 was applied for 3 minutes to a sheet of nickel-plated brass having a surface area of 0.5 cm 2 , suitably de-greased and re-rinsed with deionised water.
- the sheet was rinsed with deionised water and dried by compressed air.
- a bath having the following composition was prepared:
- the bath was brought to pH 9.5 with potassium hydroxide and heated to 60°C.
- a current of 1.5 A/cm 2 was applied for 5 minutes to a sheet of nickel-plated brass having a surface area of 0.5 cm 2 , suitably de-greased and re-rinsed with deionised water.
- the sheet was rinsed with deionised water and dried by compressed air.
- the surface of the alloy was analysed by electronic scan microscope; the following percentages were found
Claims (9)
- Galvanisches Bad, umfassend wässrige Lösungen mit einem alkalischen pH-Wert, die Goldsalze, Kupfersalze und Indiumsalze, organische Polycarbonsäuresalze, organische Amine und möglicherweise Komplexbildner, schwefelhaltige Verbindungen, Tenside und andere Metalle umfassen, wobei die Konzentration an Indium, berechnet auf der Basis der jeweiligen Salze, im Bereich von 0,1 bis 2 g/l liegt;wobei die organischen Amine ausgewählt sind aus der Gruppe umfassend Triethylentetramin, Diethylentetramin, Ethylendiamin und Tetraethylenpentamin; wobei die Amine in Mengen von 0,05 bis 1 g/l verwendet werden;der Komplexbildner ausgewählt ist aus der Gruppe bestehend aus Ethylendiamintetraessigsäure und deren Salzen, Etidronsäure und deren Salzen, Ethylendiamintetramethylphosphonsäure und deren Salzen, Iminodiessigsäure und deren Salzen, Nitrilotriphosphonsäure und deren Salzen sowie Nitrilotriessigsäure und deren Salzen;die sulfurierten Verbindungen ausgewählt sind aus der Gruppe bestehend aus organischen Thiolen, die zu den Klassen 2-(2-Pyrazin)ethanthiol, Mercaptotetrazole, Mercaptopyrimidine, Mercaptopyrrole, Mercaptoimidazole und Mercaptotriazole gehören, die möglicherweise ein Schwefelatom im aromatischen Ring enthalten, möglicherweise einen mit einem Benzolring kondensierten Stickstoffring aufweisen, eine oder mehrere Thiogruppen aufweisen;wobei die Tenside sowohl eine glänzende als auch eine oberflächenaktive Wirkung haben und solche sind, die normalerweise in galvanischen Bädern mit Matrizen verwendet werden, die durch die organischen Polycarbonsäuresalze gebildet werden; wobei die Tenside in einer Menge verwendet werden, die niemals größer als 0,005 l/l einer 10 Gew.%-igen wässrigen Lösung davon ist;die anderen Metalle mit glänzender Wirkung ausgewählt sind aus der Gruppe bestehend aus Silber, Tellur, Wismut, Eisen, Zink, Iridium, Rhenium, Vanadium, Molybdän, Wolfram in einer solchen Form, dass sie unter den Arbeitsbedingungen in Mengen zwischen 0,005 und 0,2 g/l des Elements als solches löslich und stabil sind;diese Polycarbonsäuresalze sowohl Puffereigenschaften als auch komplexbildende Wirkung aufweisen, gegebenenfalls in Kombination mit den entsprechenden Säuren zur Herstellung des zweckmäßigen Puffers, wobei diese Säuren und die jeweiligen Salze jeweils in einer Menge von 30 bis 150 g/l verwendet werden;dadurch gekennzeichnet, dass Cyanid in der Matrix des Bades nicht vorhanden ist und sein Gehalt in der galvanischen Lösung allein durch seine Gegenionenfunktion in den Goldsalzen bedingt ist.
- Galvanisches Bad nach Anspruch 1, wobei die Goldsalze ausgewählt sind aus: Kaliumdicyanoaurat, Kaliumtetracyanoaurat, Ammoniumcyanoaurat oder einer Kombination davon; die Kupfersalze ausgewählt sind aus: Sulfat, Phosphat, Pyrophosphat, Chlorid oder anderen Salzen, die unter den Arbeitsbedingungen des Bades selbst stabil sind, und die Indiumsalze ausgewählt sind aus Chlorid, Sulfat, Citrat, Tartrat, Gluconat oder einem organischen oder Aminkomplex.
- Galvanisches Bad nach Anspruch 2, wobei die Menge an Gold im Bereich von 0,7 bis 4 g/l, vorzugsweise von 1,5 bis 3 g/l, liegt und die Menge an Kupfer zwischen 0,3 und 2,5 g/l, vorzugsweise zwischen 0,5 und 2 g/l beträgt.
- Galvanisches Bad nach einem der Ansprüche 1 bis 3, wobei die Polycarbonsäuresalze ausgewählt sind aus: Citraten, Tartraten, Maleaten, Malonaten, möglicherweise in Kombination mit den entsprechenden Säuren zur Herstellung des geeigneten Puffers und möglicherweise in einer Mischung von Mischungen davon, und vorzugsweise in Mengen zwischen 50 und 100 g/l.
- Galvanisches Bad nach einem der Ansprüche 1 bis 4, wobei die Amine Triethylentetramin und Diethylentetramin sind, vorzugsweise in Mengen, die von 0,1 bis 0,7 g/l variieren.
- Galvanisches Bad nach einem der Ansprüche 1-5, wobei die anderen Metalle in Mengen zwischen 0,010 und 0,1 g/l verwendet werden.
- Galvanische Bäder nach einem der Ansprüche 1 bis 6, wobei die schwefelhaltigen Verbindungen in Mengen zwischen 0,01 und 0,500 g/l und insbesondere in Mengen zwischen 0,05 und 0,200 g/l vorhanden sind.
- Galvanisches Verfahren zur Beschichtung von Gegenständen mit Goldlegierungen von 12 - 18 Karat, dadurch gekennzeichnet, dass die Bäder nach den Ansprüchen 1 bis 7 verwendet werden.
- Galvanisches Verfahren nach Anspruch 8, wobei das Verfahren in einem pH-Bereich zwischen 7 und 12, bei einer Temperatur zwischen 50 °C und 70 °C und mit einem angelegten Strom zwischen 0,5 - 3 A/cm2 durchgeführt wird.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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IT000103A ITFI20120103A1 (it) | 2012-06-01 | 2012-06-01 | Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni. |
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EP2669407A1 EP2669407A1 (de) | 2013-12-04 |
EP2669407B1 true EP2669407B1 (de) | 2022-03-30 |
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EP13170067.6A Active EP2669407B1 (de) | 2012-06-01 | 2013-05-31 | Galvanische Bäder zur Herstellung einer niederkarätigen Goldlegierung und galvanischer Process verwendent diese Bäder |
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EP (1) | EP2669407B1 (de) |
ES (1) | ES2918576T3 (de) |
IT (1) | ITFI20120103A1 (de) |
PT (1) | PT2669407T (de) |
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WO2016020812A1 (en) * | 2014-08-04 | 2016-02-11 | Nutec International Srl | Electrolytic bath, electrolytic deposition method and item obtained with said method |
EP2990507A1 (de) * | 2014-08-25 | 2016-03-02 | ATOTECH Deutschland GmbH | Zusammensetzung, ihre Verwendung und Verfahren zur galvanischen Abscheidung von Gold enthaltenden Schichten |
US20160145756A1 (en) * | 2014-11-21 | 2016-05-26 | Rohm And Haas Electronic Materials Llc | Environmentally friendly gold electroplating compositions and methods |
CN109504991B (zh) * | 2019-01-21 | 2020-08-07 | 南京市产品质量监督检验院 | 一种无氰18k金电铸液、其制备方法及其应用 |
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NL273924A (de) * | 1961-01-24 | |||
ZA734253B (en) * | 1972-07-10 | 1975-02-26 | Degussa | Electrolytic bath |
DE2244434C3 (de) * | 1972-09-06 | 1982-02-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen |
US4088549A (en) * | 1976-04-13 | 1978-05-09 | Oxy Metal Industries Corporation | Bright low karat silver gold electroplating |
GB2028873B (en) * | 1978-08-31 | 1982-11-10 | Lea Ronal Uk Ltd | Gold alloy electroplating bath and method |
DE3020765A1 (de) | 1980-05-31 | 1981-12-10 | Degussa Ag, 6000 Frankfurt | Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten |
DE3309397A1 (de) | 1983-03-16 | 1984-09-20 | Degussa Ag, 6000 Frankfurt | Elektrolytisches bad zum abscheiden von niederkaraetigen, glaenzenden gold-silber-legierungsueberzuegen |
GB8501245D0 (en) * | 1985-01-18 | 1985-02-20 | Engelhard Corp | Gold electroplating bath |
CH662583A5 (fr) | 1985-03-01 | 1987-10-15 | Heinz Emmenegger | Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc. |
US5085744A (en) | 1990-11-06 | 1992-02-04 | Learonal, Inc. | Electroplated gold-copper-zinc alloys |
DE19629658C2 (de) * | 1996-07-23 | 1999-01-14 | Degussa | Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen |
JP4308969B2 (ja) * | 1999-04-28 | 2009-08-05 | セイコーホールディングス株式会社 | めっき皮膜、それを備えた装飾品及びめっき皮膜の製造方法 |
SG127854A1 (en) * | 2005-06-02 | 2006-12-29 | Rohm & Haas Elect Mat | Improved gold electrolytes |
JPWO2008108181A1 (ja) * | 2007-03-02 | 2010-06-10 | シチズン東北株式会社 | 金合金被膜、金合金被膜被覆積層体及び金合金被膜被覆部材 |
CH710184B1 (fr) * | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques. |
-
2012
- 2012-06-01 IT IT000103A patent/ITFI20120103A1/it unknown
-
2013
- 2013-05-31 ES ES13170067T patent/ES2918576T3/es active Active
- 2013-05-31 PT PT131700676T patent/PT2669407T/pt unknown
- 2013-05-31 EP EP13170067.6A patent/EP2669407B1/de active Active
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ITFI20120103A1 (it) | 2013-12-02 |
EP2669407A1 (de) | 2013-12-04 |
ES2918576T3 (es) | 2022-07-19 |
PT2669407T (pt) | 2022-06-28 |
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