JP2013534276A5 - - Google Patents

Download PDF

Info

Publication number
JP2013534276A5
JP2013534276A5 JP2013524427A JP2013524427A JP2013534276A5 JP 2013534276 A5 JP2013534276 A5 JP 2013534276A5 JP 2013524427 A JP2013524427 A JP 2013524427A JP 2013524427 A JP2013524427 A JP 2013524427A JP 2013534276 A5 JP2013534276 A5 JP 2013534276A5
Authority
JP
Japan
Prior art keywords
electrolyte
acid
copper
tin
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013524427A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013534276A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2011/063923 external-priority patent/WO2012022689A1/en
Publication of JP2013534276A publication Critical patent/JP2013534276A/ja
Publication of JP2013534276A5 publication Critical patent/JP2013534276A5/ja
Pending legal-status Critical Current

Links

JP2013524427A 2010-08-17 2011-08-12 銅−錫合金層を沈着する電解質および方法 Pending JP2013534276A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010034646.2 2010-08-17
DE102010034646 2010-08-17
PCT/EP2011/063923 WO2012022689A1 (en) 2010-08-17 2011-08-12 Electrolyte and process for the deposition of copper-tin alloy layers

Publications (2)

Publication Number Publication Date
JP2013534276A JP2013534276A (ja) 2013-09-02
JP2013534276A5 true JP2013534276A5 (de) 2015-07-02

Family

ID=44514714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013524427A Pending JP2013534276A (ja) 2010-08-17 2011-08-12 銅−錫合金層を沈着する電解質および方法

Country Status (7)

Country Link
US (1) US20130140185A1 (de)
EP (1) EP2606164A1 (de)
JP (1) JP2013534276A (de)
KR (1) KR20130098304A (de)
CN (1) CN103069054B (de)
DE (1) DE102011008836B4 (de)
WO (1) WO2012022689A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012008544A1 (de) 2012-05-02 2013-11-07 Umicore Galvanotechnik Gmbh Verchromte Verbundwerkstoffe ohne Nickelschicht
EP2735627A1 (de) * 2012-11-26 2014-05-28 ATOTECH Deutschland GmbH Kupferplattierbadzusammensetzung
US20160298249A1 (en) * 2014-09-30 2016-10-13 Rohm And Haas Electronic Materials Llc Cyanide-free electroplating baths for white bronze based on copper (i) ions
CN107922324B (zh) * 2015-05-22 2021-02-02 巴斯夫欧洲公司 β-萘酚醚磺酸盐、其制备方法及其作为亮度改进剂的用途
CN105220189A (zh) * 2015-10-30 2016-01-06 无锡市嘉邦电力管道厂 一种钐-锡-铜合金电镀液及其电镀方法
DE102021117095A1 (de) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz
DE202021004169U1 (de) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronzeschicht als Edelmetallersatz in Smart Cards

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
US6508927B2 (en) * 1998-11-05 2003-01-21 C. Uyemura & Co., Ltd. Tin-copper alloy electroplating bath
JP3433291B2 (ja) * 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
JP2001181889A (ja) 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
JP3455712B2 (ja) 2000-04-14 2003-10-14 日本ニュークローム株式会社 銅−スズ合金めっき用ピロリン酸浴
DE10046600C2 (de) * 2000-09-20 2003-02-20 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten
JP2004510053A (ja) 2000-09-20 2004-04-02 デーエル.−イーエヌゲー.マックス シュレッター ゲーエムベーハー ウント ツェーオー.カーゲー 錫−銅合金層を析出させるための電解質及び方法
DE60226196T2 (de) * 2001-05-24 2009-05-14 Shipley Co., L.L.C., Marlborough Zinn-Plattieren
EP1412560A1 (de) * 2001-07-27 2004-04-28 PIRELLI PNEUMATICI Società per Azioni Elektrolyseverfahren zur abscheidung einer kupferschicht auf einem stahldraht
JP4698904B2 (ja) * 2001-09-20 2011-06-08 株式会社大和化成研究所 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品
JP3876383B2 (ja) * 2002-06-03 2007-01-31 京都市 銅−錫合金めっき浴及び該めっき浴を用いた銅−錫合金めっき方法
JP4249438B2 (ja) 2002-07-05 2009-04-02 日本ニュークローム株式会社 銅―錫合金めっき用ピロリン酸浴
ES2531163T3 (es) * 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces
JP4332667B2 (ja) * 2003-10-16 2009-09-16 石原薬品株式会社 スズ及びスズ合金メッキ浴
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes

Similar Documents

Publication Publication Date Title
TWI391534B (zh) 青銅之電沈積方法
US20110089043A1 (en) Modified copper-tin electrolyte and process for the deposition of bronze layers
JP2013534276A5 (de)
EP2310558B1 (de) Verbesserter kupfer-zinn-elektrolyt und verfahren zur auftragung von zinn-bronzeschichten
JP2013534276A (ja) 銅−錫合金層を沈着する電解質および方法
US8211285B2 (en) Copper-tin electrolyte and method for depositing bronze layers
JP6054676B2 (ja) シアン化物非含有ホワイトブロンズの接着促進
JP4675626B2 (ja) ブロンズ電析法及び電解質
TWI417427B (zh) 含銀合金鍍敷浴、使用其之電解鍍敷方法
CN105829583A (zh) 从电解质中沉积铜-锡合金和铜-锡-锌合金
JP2016529400A (ja) 銀−パラジウム合金の電着のための電解質、及びその析出方法
JP2023096665A (ja) 還元型無電解インジウムメッキ浴