CN103069054B - 用于沉积铜-锡合金层的电解质和方法 - Google Patents

用于沉积铜-锡合金层的电解质和方法 Download PDF

Info

Publication number
CN103069054B
CN103069054B CN201180038728.8A CN201180038728A CN103069054B CN 103069054 B CN103069054 B CN 103069054B CN 201180038728 A CN201180038728 A CN 201180038728A CN 103069054 B CN103069054 B CN 103069054B
Authority
CN
China
Prior art keywords
electrolyte
acid
copper
group
thio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180038728.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN103069054A (zh
Inventor
B·威伊米勒
K·布隆德
U·曼茨
F·奥伯斯特
M·托马佐尼
S·博格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Umicore Galvanotechnik GmbH
Original Assignee
Umicore Galvanotechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Umicore Galvanotechnik GmbH filed Critical Umicore Galvanotechnik GmbH
Publication of CN103069054A publication Critical patent/CN103069054A/zh
Application granted granted Critical
Publication of CN103069054B publication Critical patent/CN103069054B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CN201180038728.8A 2010-08-17 2011-08-12 用于沉积铜-锡合金层的电解质和方法 Active CN103069054B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010034646.2 2010-08-17
DE102010034646 2010-08-17
PCT/EP2011/063923 WO2012022689A1 (en) 2010-08-17 2011-08-12 Electrolyte and process for the deposition of copper-tin alloy layers

Publications (2)

Publication Number Publication Date
CN103069054A CN103069054A (zh) 2013-04-24
CN103069054B true CN103069054B (zh) 2016-08-10

Family

ID=44514714

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180038728.8A Active CN103069054B (zh) 2010-08-17 2011-08-12 用于沉积铜-锡合金层的电解质和方法

Country Status (7)

Country Link
US (1) US20130140185A1 (de)
EP (1) EP2606164A1 (de)
JP (1) JP2013534276A (de)
KR (1) KR20130098304A (de)
CN (1) CN103069054B (de)
DE (1) DE102011008836B4 (de)
WO (1) WO2012022689A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012008544A1 (de) 2012-05-02 2013-11-07 Umicore Galvanotechnik Gmbh Verchromte Verbundwerkstoffe ohne Nickelschicht
EP2735627A1 (de) * 2012-11-26 2014-05-28 ATOTECH Deutschland GmbH Kupferplattierbadzusammensetzung
US20160298249A1 (en) * 2014-09-30 2016-10-13 Rohm And Haas Electronic Materials Llc Cyanide-free electroplating baths for white bronze based on copper (i) ions
WO2016188806A1 (de) 2015-05-22 2016-12-01 Basf Se Beta-naphtholethersulfonate, verfahren zu deren herstellung und deren verwendung als glanzverbesserer
CN105220189A (zh) * 2015-10-30 2016-01-06 无锡市嘉邦电力管道厂 一种钐-锡-铜合金电镀液及其电镀方法
DE202021004169U1 (de) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronzeschicht als Edelmetallersatz in Smart Cards
DE102021117095A1 (de) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
CN1220709A (zh) * 1996-05-30 1999-06-23 恩索恩Omi公司 作铜添加剂用的烷氧基化二硫醇
DE10046600A1 (de) * 2000-09-20 2002-04-25 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten
CN1733978A (zh) * 2004-07-22 2006-02-15 罗门哈斯电子材料有限公司 匀涂剂化合物
CN101194049A (zh) * 2005-04-14 2008-06-04 恩索恩公司 电沉积青铜的方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
US6508927B2 (en) * 1998-11-05 2003-01-21 C. Uyemura & Co., Ltd. Tin-copper alloy electroplating bath
JP3433291B2 (ja) * 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
JP2001181889A (ja) 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
JP3455712B2 (ja) 2000-04-14 2003-10-14 日本ニュークローム株式会社 銅−スズ合金めっき用ピロリン酸浴
WO2002024979A1 (de) 2000-09-20 2002-03-28 Dr.-Ing. Max Schlötter Gmbh & Co. Kg Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
EP1260614B1 (de) * 2001-05-24 2008-04-23 Shipley Co. L.L.C. Zinn Platierung
US20040247865A1 (en) * 2001-07-27 2004-12-09 Federico Pavan Electrolytic process for depositing a layer of copper on a steel wire
JP4698904B2 (ja) * 2001-09-20 2011-06-08 株式会社大和化成研究所 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品
JP3876383B2 (ja) * 2002-06-03 2007-01-31 京都市 銅−錫合金めっき浴及び該めっき浴を用いた銅−錫合金めっき方法
JP4249438B2 (ja) 2002-07-05 2009-04-02 日本ニュークローム株式会社 銅―錫合金めっき用ピロリン酸浴
EP1408141B1 (de) 2002-10-11 2014-12-17 Enthone Inc. Verfahren und Elektrolyt zur galvanischen Abscheidung von Bronzen
JP4332667B2 (ja) * 2003-10-16 2009-09-16 石原薬品株式会社 スズ及びスズ合金メッキ浴

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
CN1220709A (zh) * 1996-05-30 1999-06-23 恩索恩Omi公司 作铜添加剂用的烷氧基化二硫醇
DE10046600A1 (de) * 2000-09-20 2002-04-25 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten
CN1733978A (zh) * 2004-07-22 2006-02-15 罗门哈斯电子材料有限公司 匀涂剂化合物
CN101194049A (zh) * 2005-04-14 2008-06-04 恩索恩公司 电沉积青铜的方法

Also Published As

Publication number Publication date
US20130140185A1 (en) 2013-06-06
CN103069054A (zh) 2013-04-24
DE102011008836A1 (de) 2012-02-23
EP2606164A1 (de) 2013-06-26
DE102011008836B4 (de) 2013-01-10
WO2012022689A1 (en) 2012-02-23
KR20130098304A (ko) 2013-09-04
JP2013534276A (ja) 2013-09-02

Similar Documents

Publication Publication Date Title
CN103069054B (zh) 用于沉积铜-锡合金层的电解质和方法
TWI391534B (zh) 青銅之電沈積方法
CN102016130B (zh) 改性铜-锡电解液和沉积青铜层的方法
CN101622379B (zh) 铜-锡-电解液和沉积青铜层的方法
JP6370380B2 (ja) 銀−パラジウム合金の電着のための電解質、及びその析出方法
CN105829583B (zh) 从电解质中沉积铜-锡合金和铜-锡-锌合金
TW201026909A (en) Process for the deposition of platinum-rhodium layers having improved whiteness
JP4675626B2 (ja) ブロンズ電析法及び電解質
JP2013534276A5 (de)
CN108138346B (zh) 用于电化学沉积Cu-Sn-Zn-Pd合金的电镀浴、所述合金的电化学沉积方法、包含所述合金的基材和基材的用途
CA3024991A1 (en) Ternary zinc-nickel-iron alloys and alkaline electrolytes for plating such alloys
WO2017021916A2 (en) Tin/copper alloys containing palladium, method for their preparation and use thereof
CN112888811A (zh) 热稳定银合金涂层
CN107406998B (zh) 使用了硫鎓盐的电镀液
KR100419655B1 (ko) 아연-니켈 합금전기도금용액을 이용한 아연-니켈 합금전기도금강판의 제조방법
CN102732920B (zh) 18开3n金合金的制备方法
JP2016532004A (ja) 電気めっき浴

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant