MY151335A - Electroplating solution containing organic acid complexing agent - Google Patents

Electroplating solution containing organic acid complexing agent

Info

Publication number
MY151335A
MY151335A MYPI20030505A MY151335A MY 151335 A MY151335 A MY 151335A MY PI20030505 A MYPI20030505 A MY PI20030505A MY 151335 A MY151335 A MY 151335A
Authority
MY
Malaysia
Prior art keywords
solution
complexing agent
electroplatable
solution containing
organic acid
Prior art date
Application number
Inventor
Hradil George
Original Assignee
Technic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technic filed Critical Technic
Publication of MY151335A publication Critical patent/MY151335A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

A SOLUTION FOR USE IN CONNECTION WITH THE DEPOSITION OF ONE OR MORE METALS ON ELECTROPLATABLE SUBSTRATES. THIS SOLUTION INCLUDES WATER; A METAL ION; AND A COMPLEXING AGENT. THE COMPLEXING AGENT IS ADVANTAGEOUSLY AN ORGANIC COMPOUND HAVING BETWEEN 4 AND 18 CARBON ATOMS WHICH INCLUDES AT LEAST TWO HYDROXYL GROUPS AND A FIVE OR SIX MEMBERED RING THAT CONTAINS AT LEAST ONE OXYGEN ATOM. THE COMPOUND IS PRESENT IN AN AMOUNT SUFFICIENT TO COMPLEX THE METAL IN THE SOLUTION AND INHIBIT OXIDATION OF THE METAL. IF NECESSARY, A SUITABLE PH ADJUSTING AGENT CAN BE INCLUDED IN THE SOLUTION TO MAINTAIN THE PH OF THE SOLUTION IN THE RANGE OF BETWEEN 2 AND 10 AND PREFERABLY TO A PH OF ABOUT 3.5 TO 5.5. AT THE PREFERRED PH RANGE, THE SOLUTION IS PARTICULARLY USEFUL FOR ELECTROPLATING COMPOSITE ARTICLES THAT HAVE ELECTROPLATABLE PORTIONS AND NON-ELECTROPLATABLE PORTIONS WITHOUT DELETERIOUSLY AFFECTING THE NON-ELECTROPLATABLE PORTIONS.
MYPI20030505 2002-02-15 2003-02-14 Electroplating solution containing organic acid complexing agent MY151335A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35733002P 2002-02-15 2002-02-15
US10/277,234 US20030159938A1 (en) 2002-02-15 2002-10-22 Electroplating solution containing organic acid complexing agent

Publications (1)

Publication Number Publication Date
MY151335A true MY151335A (en) 2014-05-15

Family

ID=27757599

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20030505 MY151335A (en) 2002-02-15 2003-02-14 Electroplating solution containing organic acid complexing agent

Country Status (8)

Country Link
US (1) US20030159938A1 (en)
JP (1) JP2005517814A (en)
KR (1) KR20040085194A (en)
CN (1) CN100469942C (en)
AU (1) AU2003217344A1 (en)
MY (1) MY151335A (en)
TW (1) TWI296289B (en)
WO (1) WO2003071001A1 (en)

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FR2832160B1 (en) * 2001-11-15 2005-01-14 Atofina PROCESS FOR WORKING OR FORMING METALS IN THE PRESENCE OF AQUEOUS LUBRICANTS BASED ON METHANESULFONIC ACID (AMS) OR AMS WATER SOLUBLE SALT
US7275012B2 (en) * 2002-12-30 2007-09-25 Intel Corporation Automated method and apparatus for processor thermal validation
CN100457977C (en) * 2004-08-03 2009-02-04 上海新阳半导体材料有限公司 Electroplating additive and its preparation method
KR20080024525A (en) * 2005-07-11 2008-03-18 테크닉,인코포레이티드 Tin electrodeposits having properties or characteristics that minimize tin whisker growth
US20070034118A1 (en) * 2005-08-12 2007-02-15 Jardine Leslie A Dosage efficient, storage stable compositions for reducing chromium (VI) in cement
JP4539719B2 (en) * 2006-02-01 2010-09-08 株式会社村田製作所 Manufacturing method of ceramic electronic component and Sn plating bath
EP1918426A1 (en) 2006-10-09 2008-05-07 Enthone, Inc. Cyanide free electrolyte composition und process for plating silver or alloys thereof on substrates
US20110206909A1 (en) * 2008-10-31 2011-08-25 Sundew Technologies Llc Coatings for suppressing metallic whiskers
CN102282155B (en) 2008-12-02 2017-06-09 日本波涛生命科学公司 The synthetic method of the nucleic acid of phosphorus atoms modification
KR101286661B1 (en) 2009-02-06 2013-07-16 데와키 유카리 Silver-containing alloy plating bath and method for electrolytic plating using same
US9744183B2 (en) 2009-07-06 2017-08-29 Wave Life Sciences Ltd. Nucleic acid prodrugs and methods of use thereof
US9080247B2 (en) * 2009-07-31 2015-07-14 Shinji Dewaki Tin-containing alloy plating bath, electroplating method using same, and substrate with the electroplating deposited thereon
DK2620428T3 (en) 2010-09-24 2019-07-01 Wave Life Sciences Ltd Asymmetric help group
DK2734208T3 (en) 2011-07-19 2017-06-19 Wave Life Sciences Ltd PROCEDURES FOR SYNTHESIS OF FUNCTIONALIZED NUCLEIC ACIDS
EP2872485B1 (en) 2012-07-13 2020-12-16 Wave Life Sciences Ltd. Asymmetric auxiliary group
EP3077578A4 (en) * 2013-12-05 2017-07-26 Honeywell International Inc. Stannous methansulfonate solution with adjusted ph
PT3094728T (en) 2014-01-16 2022-05-19 Wave Life Sciences Ltd Chiral design
CA2951437C (en) 2014-07-07 2022-03-15 Honeywell International Inc. Thermal interface material with ion scavenger
US10287471B2 (en) 2014-12-05 2019-05-14 Honeywell International Inc. High performance thermal interface materials with low thermal impedance
JP2016125130A (en) 2015-01-08 2016-07-11 株式会社デンソー Composite material, method for forming composite material, electrode plated by composite material, and connection structure
CN104593835B (en) * 2015-02-04 2017-10-24 广东羚光新材料股份有限公司 The neutral tin plating electrolyte electroplated for chip components and parts termination electrode
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
CN105401177A (en) * 2015-12-14 2016-03-16 广东美的暖通设备有限公司 Anti-corrosion treatment method for heat exchanger, heat exchanger and air conditioner
CN109072051B (en) 2016-03-08 2023-12-26 霍尼韦尔国际公司 Phase change material
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
KR20180024765A (en) * 2016-08-31 2018-03-08 주식회사 호진플라텍 Tin-bismuth-lead ternary alloy solder composition using electroplating
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
CN108866583B (en) * 2018-08-28 2020-07-21 广州三孚新材料科技股份有限公司 Tin or tin-lead alloy plating solution applied to leadless electronic component, and preparation method and plating method thereof
CN109576758B (en) * 2018-11-28 2019-11-05 广州旭淼新材料科技有限公司 Environment-friendly type list pink salt electrolytic coloring additive
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN113025825B (en) * 2021-03-05 2022-03-01 华东理工大学 Method for leaching valuable metals from batteries using nanobubbles

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US6773573B2 (en) * 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate

Also Published As

Publication number Publication date
AU2003217344A1 (en) 2003-09-09
TWI296289B (en) 2008-05-01
WO2003071001A1 (en) 2003-08-28
JP2005517814A (en) 2005-06-16
KR20040085194A (en) 2004-10-07
CN100469942C (en) 2009-03-18
CN1633519A (en) 2005-06-29
TW200303938A (en) 2003-09-16
US20030159938A1 (en) 2003-08-28

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