HK1028907A1 - Pretreating agent for metal plating, and method for metal plating using the same. - Google Patents

Pretreating agent for metal plating, and method for metal plating using the same.

Info

Publication number
HK1028907A1
HK1028907A1 HK00108303A HK00108303A HK1028907A1 HK 1028907 A1 HK1028907 A1 HK 1028907A1 HK 00108303 A HK00108303 A HK 00108303A HK 00108303 A HK00108303 A HK 00108303A HK 1028907 A1 HK1028907 A1 HK 1028907A1
Authority
HK
Hong Kong
Prior art keywords
metal plating
pretreating agent
metal
same
subjected
Prior art date
Application number
HK00108303A
Inventor
Hideyuki Mori
Masashi Kumagai
Original Assignee
Nikko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Materials Co Ltd filed Critical Nikko Materials Co Ltd
Publication of HK1028907A1 publication Critical patent/HK1028907A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

A method for an electroless metal plating which can be easily applied to a powder or mirror substrate, and a pretreating agent for use in the method. The pretreating agent comprises a silane coupling agent obtained by the reaction of an azole type compound having an active functional group capable of forming a complex with a noble metal with an epoxysilane compound. A substrate to be metal-plated is subjected to a surface preparation using the pretreating agent, is then treated with a solution containing a noble metal ion, and thereafter is subjected to an electroless plating, to thereby provide a metal-plated product.
HK00108303A 1998-07-07 2000-12-21 Pretreating agent for metal plating, and method for metal plating using the same. HK1028907A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19160198 1998-07-07
PCT/JP1999/002180 WO2000001862A1 (en) 1998-07-07 1999-04-23 Pretreating agent for metal plating, and method for metal plating using the same

Publications (1)

Publication Number Publication Date
HK1028907A1 true HK1028907A1 (en) 2001-03-09

Family

ID=16277362

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00108303A HK1028907A1 (en) 1998-07-07 2000-12-21 Pretreating agent for metal plating, and method for metal plating using the same.

Country Status (6)

Country Link
JP (1) JP3277463B2 (en)
KR (1) KR100367164B1 (en)
CN (1) CN1195099C (en)
HK (1) HK1028907A1 (en)
TW (1) TW438905B (en)
WO (1) WO2000001862A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4836312B2 (en) * 2000-08-01 2011-12-14 Ｊｘ日鉱日石金属株式会社 Silver plating pretreatment agent and silver plating method
JP4270768B2 (en) 2000-11-08 2009-06-03 Ｊｆｅスチール株式会社 Tin-plated steel sheet and chemical treatment liquid
JP3849946B2 (en) 2002-09-10 2006-11-22 日鉱金属株式会社 Metal plating method and pretreatment agent
JP4270517B2 (en) * 2003-06-09 2009-06-03 日鉱金属株式会社 Electroless plating method and plated metal
US20070269680A1 (en) * 2004-09-10 2007-11-22 Toshifumi Kawamura Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible Substrate
CN101194041B (en) * 2005-06-17 2010-12-15 住友金属矿山株式会社 Coating liquid for nickel film formation, nickel film and method for producing same
JP5142982B2 (en) * 2006-03-07 2013-02-13 国立大学法人 奈良先端科学技術大学院大学 Metal-coated lipid bilayer vesicle and method for producing the same
TWI427026B (en) * 2008-06-10 2014-02-21 Hon Hai Prec Ind Co Ltd Method for metal plating carbon nanotubes
JP5604787B2 (en) * 2009-01-21 2014-10-15 富士通株式会社 Method for producing electroless plating
US9499912B2 (en) 2014-05-26 2016-11-22 Rohm And Haas Electronic Materials Llc Copolymers of diglycidyl ether terminated polysiloxane compounds and non-aromatic polyamines
EP3296428B1 (en) * 2016-09-16 2019-05-15 ATOTECH Deutschland GmbH Method for depositing a metal or metal alloy on a surface
KR20200130361A (en) * 2018-03-09 2020-11-18 가부시키가이샤 아리사와 세이사쿠쇼 Laminate and its manufacturing method
JP6620277B1 (en) * 2018-08-07 2019-12-18 株式会社豊光社 Method for producing plated glass substrate
CN111826643B (en) * 2020-07-14 2023-05-12 华东理工大学 Method for improving binding force of plating layer by activating copper plating on surface of modified metal
CN111910231B (en) * 2020-07-22 2022-09-27 东莞市百镀通五金电镀实业有限公司 Roughening liquid for roughening glass fiber reinforced plastic and roughening method
CN113445031B (en) * 2021-06-24 2022-07-08 广东硕成科技股份有限公司 Metal active agent and preparation method thereof
CN117385346B (en) * 2023-12-12 2024-02-23 江苏中科智芯集成科技有限公司 Method for copper-based chemical nickel-plating palladium-gold in wafer

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2780373B2 (en) * 1989-09-07 1998-07-30 三菱瓦斯化学株式会社 Method for producing α-hydroxycarboxylic acid amide
JPH05239657A (en) * 1992-02-27 1993-09-17 Mitsubishi Gas Chem Co Inc Production of moisture resistant copper clad substrate
JPH06256358A (en) * 1993-03-01 1994-09-13 Japan Energy Corp New imidazolesilane compound and its production, and metal surface treating agent using the same
JPH07102380A (en) * 1993-09-30 1995-04-18 Nisshinbo Ind Inc Pretreatment for plating of glass fiber
JPH0839728A (en) * 1994-07-27 1996-02-13 Sumitomo Metal Mining Co Ltd Production of metal-clad laminate substrate

Also Published As

Publication number Publication date
CN1262711A (en) 2000-08-09
CN1195099C (en) 2005-03-30
JP3277463B2 (en) 2002-04-22
TW438905B (en) 2001-06-07
WO2000001862A1 (en) 2000-01-13
KR100367164B1 (en) 2003-01-06

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