WO2002063070A8 - Nickel cobalt phosphorous low stress electroplating - Google Patents

Nickel cobalt phosphorous low stress electroplating

Info

Publication number
WO2002063070A8
WO2002063070A8 PCT/US2001/004296 US0104296W WO02063070A8 WO 2002063070 A8 WO2002063070 A8 WO 2002063070A8 US 0104296 W US0104296 W US 0104296W WO 02063070 A8 WO02063070 A8 WO 02063070A8
Authority
WO
WIPO (PCT)
Prior art keywords
nickel
salt
nickel cobalt
electroplating
low stress
Prior art date
Application number
PCT/US2001/004296
Other languages
French (fr)
Other versions
WO2002063070A1 (en
Inventor
Darell E Engelhaupt
Brian D Ramsey
Original Assignee
Univ Alabama
Us Gov Nasa
Darell E Engelhaupt
Brian D Ramsey
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Alabama, Us Gov Nasa, Darell E Engelhaupt, Brian D Ramsey filed Critical Univ Alabama
Priority to PCT/US2001/004296 priority Critical patent/WO2002063070A1/en
Publication of WO2002063070A1 publication Critical patent/WO2002063070A1/en
Publication of WO2002063070A8 publication Critical patent/WO2002063070A8/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

An electrolytic plating process is provided for electrodepositing a nickel or nickel cobalt alloy which contains at least 2 % to 25 % by atomic volume of phosphorous. The process solution contains nickel and optionally cobalt sulfate, hypophosphorous acid or a salt thereof, boric acid or a salt thereof, a monodentate organic acid or a salt thereof, and a multidentate organic acid or a salt thereof. The pH of the plating bath is from about 3.0 to about 4.5. An electroplating process is also provided which includes electroplating from the bath a nickel cobalt phosphorous alloy. This process can achieve a deposit with high microyield of at least about 84 kg/mm2 (120 ksi) and a density lower than pure nickel of about 8.0 gm/cc. This process can be used to plate a deposit of essentially zero stress at plating temperatures from ambient to 70 °C.
PCT/US2001/004296 2001-02-08 2001-02-08 Nickel cobalt phosphorous low stress electroplating WO2002063070A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2001/004296 WO2002063070A1 (en) 2001-02-08 2001-02-08 Nickel cobalt phosphorous low stress electroplating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/004296 WO2002063070A1 (en) 2001-02-08 2001-02-08 Nickel cobalt phosphorous low stress electroplating

Publications (2)

Publication Number Publication Date
WO2002063070A1 WO2002063070A1 (en) 2002-08-15
WO2002063070A8 true WO2002063070A8 (en) 2003-11-13

Family

ID=21742328

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/004296 WO2002063070A1 (en) 2001-02-08 2001-02-08 Nickel cobalt phosphorous low stress electroplating

Country Status (1)

Country Link
WO (1) WO2002063070A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010035661A1 (en) * 2010-08-27 2012-03-01 Ipt International Plating Technologies Gmbh Electrolytic bath for electrodeposition and process for its preparation
ITUA20162707A1 (en) * 2016-04-19 2017-10-19 Bluclad S R L Phosphorus-Cobalt-Nickel alloy and its use in the processes of plating with noble metals of non-noble metal objects.
EP3714085B1 (en) * 2017-11-20 2023-08-09 Basf Se Composition for cobalt electroplating comprising leveling agent
CN112614994B (en) * 2020-12-10 2023-02-07 三峡大学 Preparation method of water system zinc-cobalt battery laminated positive electrode material
CN112626541B (en) * 2020-12-15 2023-08-29 永州市产商品质量监督检验所 Preparation method of three-dimensional composite hydrogen evolution material
CN112626554B (en) * 2020-12-15 2023-08-29 永州市产商品质量监督检验所 Preparation method of three-dimensional electrolytic composite hydrogen evolution material
CN113355708A (en) * 2021-05-17 2021-09-07 安徽昀水表面科技有限公司 Phosphorus-nickel alloy electroplating solution and use method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3637471A (en) * 1969-01-29 1972-01-25 Burroughs Corp Method of electrodepositing ferromagnetic alloys
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
US4770751A (en) * 1986-12-30 1988-09-13 Okuno Chemical Industry Co., Ltd. Method for forming on a nonconductor a shielding layer against electromagnetic radiation
DE69220519T2 (en) * 1991-03-04 1998-02-19 Toda Kogyo Corp Process for plating a bonded magnet and bonded magnet with a metal coating

Also Published As

Publication number Publication date
WO2002063070A1 (en) 2002-08-15

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