CN108866583B - Tin or tin-lead alloy plating solution applied to leadless electronic component, and preparation method and plating method thereof - Google Patents
Tin or tin-lead alloy plating solution applied to leadless electronic component, and preparation method and plating method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Abstract
The invention discloses a plating solution applied to lead-free electronic component multi-element complex tinning or tin-lead alloy, a preparation method thereof and an electroplating method, wherein the electroplating solution comprises a multi-element complexing agent, tin methane sulfonate, lead methane sulfonate, a surfactant, a semi-bright additive and an antioxidant, and the pH value of the plating solution is 4-7, wherein the content of the complexing agent in the plating solution is 200-300 g/L, the content of metal tin is 10-25 g/L, the content of metal lead is 1.0-2.5 g/L, the content of the surfactant is 1-8 g/L, the content of the semi-bright additive is 0.05-0.3 g/L, the content of the antioxidant is 0.4-2 g/L, and the balance of water.
Description
Technical Field
The invention relates to the field of electroplating, in particular to a plating solution for plating tin or tin-lead alloy of a leadless electronic component, a preparation method thereof and an electroplating method thereof.
Background
The electrode of leadless electronic element (capacitor, resistor, inductance) mostly adopts three-layer metal technology, i.e. the bottom electrode metal of the end is Ag, the middle layer is nickel, and the external electrode metal is tin or tin-lead alloy layer. The bottom electrode is made of conductive silver slurry through coating, drying and sintering, and the middle electrode and the external electrode are made through electroplating. The early parts of these devices were tin plated or tin-lead alloys using the highly acidic fluoroboric acid or methanesulfonic acid systems. However, since the plating speed in the acidic plating solution is fast, when the plating layer exceeds a certain thickness, namely more than 5um, the plating layer is easy to climb, namely the plating layer extends to a place without being coated with silver paste, more importantly, the corrosion and dissolution of the acidic plating solution to leadless electronic components such as chip resistors and multilayer chip ceramic dielectric capacitors which are packaged by special glass and take high-activity ceramics as base materials are very obvious, the performance of the components is greatly influenced, waste products of batch electroplating are caused, and the plating solution has great pollution to electronic component production sites with high environmental requirements.
Aiming at the situations, a process close to neutral or weak acid electrolytic tin plating or tin-lead alloy plating is developed at home and abroad, and the corrosion to glass and ceramics is slowed down. But because of the problem of plating climbing, the yield after plating is still difficult to further improve, which is also a problem difficult to solve when plating the workpieces.
The factors influencing the formation of the creeping plating comprise the temperature and the pH value of the plating solution, the rotating speed of a roller during barrel plating, the composition of the plating solution, the plating time and the like, wherein the components of the plating solution are the key factors. The method adopts a certain complexing agent, prevents the generation of 'creeping plating' by controlling proper electroplating process parameters and electroplating conditions, and becomes a difficult point in the prior art.
In the prior art, a method of barrel plating or high-speed spin plating an electronic component and a neutral tin plating solution used therein, patent No. CN201711057609.2, discloses that the neutral tin plating solution uses a plating solution including (a) stannous ions, (B) an acid or salt, (C) a complexing agent, and (D) a diamine having a polyoxyalkylene chain and having a pH value in the range between 4 and 8. The use of this neutral tin plating liquid can prevent electronic components from being connected together during barrel plating, thereby achieving an improvement in barrel plating manufacturability. The invention mentions controlling the plating solution at a mildly acidic or neutral ph but does not mention the "overplating" problem and solution. A neutral tin plating solution for electroplating terminal electrodes of sheet-type components, disclosed in patent No. CN201510058597.X, has a pH value of 7.0 +/-0.5, and comprises: acetic acid and sodium acetate as buffering agents; sodium citrate as a complexing agent; sodium methanesulfonate and sodium sulfate as conductive salts; morin as an antioxidant; at least one of alkyl polyglycoside, glucose amide, alcohol ether carboxylate, amide ether carboxylate, monoalkyl phosphate ester and monoalkyl ether phosphate ester as surfactant; divalent tin ions. The plating solution is a neutral system and there is no mention of the "creeping plating" problem and solution.
Disclosure of Invention
In view of the above, the invention aims to solve the problems in the prior art and provide a tin or tin-lead alloy plating solution applied to a leadless electronic component and a preparation method thereof, wherein the plating solution has a pH value of 4-7, adopts a multi-element complex, better prevents the generation of 'creeping plating', is stable, is not easy to be turbid after long-term use, and is harmless to human bodies and the environment.
In order to solve the technical problems, the invention adopts the following technical scheme:
a plating solution for tin plating or tin-lead alloy plating of leadless electronic components comprises a multi-complexing agent, tin methane sulfonate, lead methane sulfonate, a surfactant, a semi-bright additive, an antioxidant and water, wherein the pH value of the plating solution is 4-7, the plating solution is prepared by mixing a copper plating solution and a tin-lead alloy plating solution,
the content of the complexing agent is 200-300 g/L;
the tin methane sulfonate is a concentrated solution containing 300 g/L of metal tin, the content of the metal tin in the plating solution is 10-25 g/L,
the lead methanesulfonate is a concentrated solution containing 500 g/L of metal lead, and the content of the metal lead in the plating solution is 1.0-2.5 g/L;
the content of the surfactant is 1-8 g/L;
the content of the semi-bright additive is 0.05-0.3 g/L;
the content of the antioxidant is 0.4-2 g/L;
the balance of water.
Further, the complexing agent is selected from at least 2 of sulfamate, citrate, gluconate, tartrate, methylsulfonate and triethanolamine, preferably triethanolamine, gluconate and methylsulfonate, and the content of the complexing agent in the plating solution is preferably 240-280 g/L.
Furthermore, the content of the metallic tin in the plating solution is preferably 15-20 g/L.
Furthermore, the content of the metal lead in the plating solution is preferably 1.5-2.0 g/L, so that the mass fraction of the lead in the plating layer is about 10%.
The surfactant is at least 2 selected from alkyl alcohol polyoxyethylene ether, alkylphenol polyoxyethylene ether, polyoxypropylene ether, bisphenol A polyoxyethylene ether and naphthol ethoxy propoxy addition product, preferably the alkylphenol polyoxyethylene ether and the bisphenol A polyoxyethylene ether, and the content of the surfactant in the plating solution is preferably 3-5 g/L.
Furthermore, the semi-bright additive is selected from one of 2-mercaptobenzimidazole, 2-mercaptobenzothiazole and imidazole, preferably 2-mercaptobenzimidazole, and the content of the semi-bright additive in the plating solution is preferably 0.1-0.2 g/L.
The antioxidant is dissolved completely in ethanol, propylene glycol, isopropanol and the like in advance, and then added into the plating solution, wherein the concentration of the antioxidant in the plating solution is preferably 0.8-1.5 g/L.
The invention also discloses a preparation method of the plating solution for plating tin or tin-lead alloy for the leadless electronic component, which comprises the following steps:
adding water into a container, adding a complexing agent, stirring until the complexing agent is completely dissolved, slowly adding a tin methane sulfonate solution and a lead methane sulfonate solution in sequence, adding a surfactant, a semi-bright additive and an antioxidant, fully stirring, adding pure water to be close to a required volume, adjusting the pH value to 4-7 by using the methyl sulfonic acid or sodium hydroxide, continuously adding the pure water to a constant volume, wherein the antioxidant is added into the container after being completely dissolved by ethanol, propylene glycol, isopropanol and the like in advance.
Preferably, the methanesulfonic acid is a plating-grade solution with a content of 70% (weight ratio) and is used for adjusting the pH value of the plating solution to be 4-7.
The invention also discloses an electroplating method of the plating solution for plating tin or tin-lead alloy of the leadless electronic component, which comprises the following steps:
(1) nickel plating: activating a plated piece coated with a silver layer by using 10% by volume of methanesulfonic acid, and barrel-plating nickel sulfamate; in the nickel plating process, the temperature of the electroplating solution is 50-60 ℃, the optimal temperature is 55 ℃, the pH value is 3.8-4.5, and the cathode current density is 0.1-5A/dm2The plating voltage is 8-12V, the anode used for electroplating is a sulfur-containing nickel cake (the mass fraction of sulfur is 0.015-0.023%), the rotating speed of the roller is 5-7 r/min, when the leadless ceramic element is barrel-plated, the copper material conductive balls (or conductive rods) and the mixed ceramic element are loaded into the roller together, full-immersion electroplating is adopted, and the thickness of barrel-plated nickel is 3-6 um. Applying (a) toThe electroplating solution for nickel plating comprises 270-330 g/L g of nickel sulfamate, 15-20 g/L g of nickel chloride and 30-40 g/L g of boric acid;
(2) applying tin or tin-lead alloy: putting the nickel-plated electronic element into the tin or tin-lead alloy plating solution to plate tin or tin-lead alloy, and after plating, washing and drying;
in the process of plating tin or tin-lead alloy, the temperature of the electroplating solution is 15-25 ℃, the optimal temperature is 20 ℃, and the current density of plating is 0.1-3A/dm2The anode used for electroplating is pure tin or tin-lead alloy (the mass fraction of lead is 5-10%), the rotating speed of the roller is 5-7 r/min, when the leadless ceramic element is barrel-plated, the copper material conductive bead (or conductive rod) mixed ceramic element is put into the roller together, and the full immersion electroplating is adopted.
Compared with the prior art, the invention has the following beneficial effects: according to the invention, through screening and adopting a multi-element complex, the metal tin and the lead are effectively complexed, the pH value of the plating solution is kept at 4-7, the cathode polarization is increased, and the growth speed of crystal grains is inhibited, so that the generation of 'creeping plating' during electroplating is prevented, and the yield of the leadless electronic component after plating is greatly improved.
Drawings
Fig. 1 is a crystal phase diagram of a leadless inductive tin-lead alloy (tin mass fraction 90%) magnified 1000 times.
Fig. 2 is a phase diagram of pure tin plating of a leadless inductor at 1000 times magnification.
Detailed Description
In order to make the present invention more clear and intuitive for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
A plating solution for tin plating or tin-lead alloy plating applied to leadless electronic components comprises a multi-complexing agent, tin methane sulfonate, lead methane sulfonate, a surfactant, a semi-bright additive, an antioxidant and water, wherein the pH of the plating solution is adjusted to 4-7 by using methane sulfonic acid or sodium hydroxide.
The complexing agent is at least 2 selected from sulfamate, citrate, gluconate, tartrate, methylsulfonate and triethanolamine, and the concentration of the complexing agent in the plating solution is 200-300 g/L, preferably 240-280 g/L.
The content of the metallic tin in the plating solution is 10-25 g/L, and the preferable concentration is 15-20 g/L. the used tin methane sulfonate is a concentrated solution containing 300 g/L of metallic tin.
The content of metallic lead in the plating solution is 1.0-2.5 g/L, the preferable concentration is 1.5-2.0 g/L, so that the mass fraction of lead in the plating layer is about 10%, and the used lead methyl sulfonate is a concentrated solution containing 500 g/L of lead.
The surfactant is selected from at least 2 of alkyl alcohol polyoxyethylene ether, alkylphenol polyoxyethylene ether, polyoxypropylene ether, bisphenol A polyoxyethylene ether and naphthol ethoxy propoxy addition products, preferably the alkylphenol polyoxyethylene ether and the bisphenol A polyoxyethylene ether, and the concentration of the surfactant in the plating solution is 1-8 g/L, preferably 3-5 g/L.
The semi-bright additive is selected from one of 2-mercaptobenzimidazole, 2-mercaptobenzothiazole and imidazole, preferably 2-mercaptobenzimidazole, and the concentration of the semi-bright additive in the plating solution is 0.05-0.3 g/L, preferably 0.1-0.2 g/L.
The antioxidant is at least 2 selected from catechol, hydroquinone, resorcinol, morin, phenol and naphthol ethoxy sulfonic acid, preferably morin and resorcinol, the antioxidant is dissolved completely by ethanol, propylene glycol, isopropanol and the like in advance and then added into the plating solution, and the concentration of the antioxidant in the plating solution is 0.4-2 g/L, preferably 0.8-1.5 g/L.
The balance of water.
The methanesulfonic acid is an electroplating-grade solution with the content of 70 percent (weight ratio) and is used for adjusting the pH value of the electroplating solution to be kept between 4 and 7.
Preparation of electroplating solutions
The preparation method of the multi-element complex tinning or tin-lead alloy solution applied to the leadless electronic component comprises the following steps: adding pure water with the required volume of about 50% into a container, adding a complexing agent, stirring until the complexing agent is completely dissolved, slowly adding a tin methane sulfonate solution and a lead methane sulfonate solution in sequence, adding a surfactant, a semi-bright additive and an antioxidant, fully stirring, adding pure water to be close to the required volume, adjusting the pH value to 4-7 by using methane sulfonic acid or sodium hydroxide, and adding pure water to a constant volume.
Electroplating method
A multi-element complex tin or tin-lead alloy plating solution applied to a leadless electronic component comprises the following steps: (1) nickel plating: activating a plated piece coated with a silver layer by using 10% by volume of methanesulfonic acid, and barrel-plating nickel sulfamate; in the nickel plating process, the temperature of the electroplating solution is 50-60 ℃, the optimal temperature is 55 ℃, the pH value is 3.8-4.5, and the cathode current density is 0.1-5A/dm2The plating voltage is 8-12V, the anode used for electroplating is a sulfur-containing nickel cake (the mass fraction of sulfur is 0.015-0.023%), the rotating speed of a roller is 5-7 r/min, when a leadless ceramic element is barrel-plated, a copper conductive ball (or conductive rod) mixed ceramic element is put into the roller together, full-immersion electroplating is adopted, and the plating solution for applying nickel with the thickness of 3-6 um. of barrel-plated nickel comprises 270-330 g/L of nickel aminosulfonate, 15-20 g/L of nickel chloride and 30-40 g/L of boric acid;
(2) applying tin or tin-lead alloy: putting the nickel-plated electronic element into the tin or tin-lead alloy plating solution to plate tin or tin-lead alloy, and after plating, washing and drying;
in the process of plating tin or tin-lead alloy, the temperature of the electroplating solution is 15-25 ℃, the optimal temperature is 20 ℃, and the current density of plating is 0.1-3A/dm2The anode used for electroplating is pure tin or tin-lead alloy (the mass fraction of lead is 5-10%), the rotating speed of the roller is 5-7 r/min, when the leadless ceramic element is barrel-plated, the copper material conductive bead (or conductive rod) mixed ceramic element is put into the roller together, and the full immersion electroplating is adopted.
Example 1
The tin-plated or tin-lead alloy applied to the leadless electronic component in the embodiment comprises 20g of triethanolamine, 80g of sodium gluconate, 100 g of sodium methanesulfonate, 0.5 g of alkylphenol ethoxylate, 0.5 g of bisphenol A ethoxylate, 0.05 g of 2-mercaptobenzimidazole, 0.2g of morin, 0.2g of resorcinol, 33.3 ml of tin methanesulfonate solution (10 g of tin-containing ions), and 2 ml of lead methanesulfonate solution (1 g of lead-containing ions are added during tin-lead alloy plating). The 2-mercaptobenzimidazole, the morin and the catechol are dissolved by 20 ml of propylene glycol and then added into the electroplating solution. The solution is prepared into 1 liter of multi-element complex tinning or tin-lead alloy solution, and the pH value is adjusted to 4-7 by sodium hydroxide or methanesulfonic acid.
Example 2
The tin-plated or tin-lead alloy applied to the leadless electronic component in the embodiment comprises 20g of triethanolamine, 100 g of sodium gluconate, 120 g of sodium methanesulfonate, 2g of alkylphenol ethoxylate, 1 g of bisphenol A polyoxyethylene ether, 0.1 g of 2-mercaptobenzimidazole, 0.2g of morin, 0.6 g of resorcinol, 50 ml of tin methanesulfonate solution (containing 15 g of tin ions), and 3 ml of lead methanesulfonate solution (containing 1.5g of lead ions) added during tin-lead alloy plating. The 2-mercaptobenzimidazole, morin and resorcinol are dissolved in 20 ml of propylene glycol and then added into the electroplating solution. The solution is prepared into 1 liter of multi-element complex tinning or tin-lead alloy solution, and the pH value is adjusted to 4-7 by sodium hydroxide or methanesulfonic acid.
Example 3
The tin-plated or tin-lead alloy applied to the leadless electronic component in the embodiment comprises 30g of triethanolamine, 110 g of sodium gluconate, 140 g of sodium methanesulfonate, 3g of alkylphenol polyoxyethylene, 2g of bisphenol A polyoxyethylene ether, 0.2g of 2-mercaptobenzothiazole, 0.2g of morin, 1.3 g of resorcinol, 66.6 ml of tin methanesulfonate solution (containing 20g of tin ions), and 4 ml of lead methanesulfonate solution (added during tin-lead alloy plating) (containing 2g of lead ions). The 2-mercaptobenzimidazole, morin and resorcinol were dissolved in 30 ml of propylene glycol and then added to the plating solution. The solution is prepared into 1 liter of multi-element complex tinning or tin-lead alloy solution, and the pH value is adjusted to 4-7 by sodium hydroxide or methanesulfonic acid.
Example 4
The tin-plated or tin-lead alloy applied to the leadless electronic component in the embodiment comprises 30g of triethanolamine, 125 g of sodium gluconate, 145 g of sodium methanesulfonate, 5g of alkylphenol polyoxyethylene, 3g of bisphenol A polyoxyethylene ether, 0.3g of 2-mercaptobenzimidazole, 0.3g of morin, 1.7 g of resorcinol, 83.3 ml of tin methanesulfonate solution (containing 25g of tin ions), 5 ml of lead methanesulfonate solution (added during tin-lead alloy plating) (containing 2.5g of lead ions), and the 2-mercaptobenzimidazole, morin and resorcinol are dissolved by 30 ml of propylene glycol and then added into the electroplating solution. The solution is prepared into 1 liter of multi-element complex tinning or tin-lead alloy solution, and the pH value is adjusted to 4-7 by sodium hydroxide or methanesulfonic acid.
Example 5
The tin-plated or tin-lead alloy applied to the leadless electronic component in the embodiment comprises 40g of triethanolamine, 80g of sodium gluconate, 130 g of sodium methanesulfonate, 2g of alkylphenol ethoxylate, 1 g of bisphenol A polyoxyethylene ether, 0.06 g of 2-mercaptobenzimidazole, 0.2g of morin, 0.8 g of resorcinol, 33.3 ml of tin methanesulfonate solution (containing 10 g of tin ions), and 2 ml of lead methanesulfonate solution (containing 1 g of lead ions) added during tin-lead alloy plating. The 2-mercaptobenzimidazole, morin and resorcinol are dissolved in 20 ml of propylene glycol and then added into the electroplating solution. The solution is prepared into 1 liter of multi-element complex tinning or tin-lead alloy solution, and the pH value is adjusted to 4-7 by sodium hydroxide or methanesulfonic acid.
Example 6
The tin-plated or tin-lead alloy applied to the leadless electronic component in the embodiment comprises 40g of triethanolamine, 125 g of sodium gluconate, 130 g of sodium methanesulfonate, 3g of alkylphenol ethoxylate, 1 g of bisphenol A polyoxyethylene ether, 0.1 g of 2-mercaptobenzimidazole, 0.1 g of morin, 0.6 g of resorcinol, 50 ml of tin methanesulfonate solution (containing 15 g of tin ions), and 3 ml of lead methanesulfonate solution (containing 1.5g of lead ions) added during tin-lead alloy plating. The 2-mercaptobenzimidazole, morin and resorcinol are dissolved in 20 ml of propylene glycol and then added into the electroplating solution. The solution is prepared into 1 liter of multi-element complex tinning or tin-lead alloy solution, and the pH value is adjusted to 4-7 by sodium hydroxide or methanesulfonic acid.
Barrel plating conditions:
roller: small roller, the volume in the cylinder is about 500 ml.
Electroplating objects: with a ceramic inductor, 60g, the electrodes have been nickel plated.
Conducting and stirring materials: 400g of pure copper beads with the diameter of about 2-2.5 mm.
Current density: 0.2A/dm2。
Temperature of plating solution: at 20 ℃.
Electroplating time: and (4) 120 min.
Rotating speed of the roller: 6 rpm.
Inductors of different specifications were plated with tin or tin-lead alloy in 10 batches each in examples 1 to 6 under the above conditions.
The quality condition of the plated product is as follows:
the appearance of each batch is inspected completely, the result is qualified, and the phenomenon of creeping plating is avoided.
And (3) performing sampling inspection on the thickness of 20 detection electrodes of tin plating or tin-lead layers in each batch, wherein the result is more than 6 mu m, the mass fraction of lead in the tin-lead alloy accounts for 8-12%, and the detection electrodes are all qualified.
And performing spot inspection on 20 detection electrode coating soldering tests in each batch, wherein the soldering tin is full, and the defects of holes, black spots, no soldering and the like are overcome, so that the product is completely qualified.
Every batch of 5 pieces of crystal phase images which are shot and magnified 1000 times are randomly inspected, the crystal phase images are clear, fine and smooth, and all the crystal phases are qualified as shown in figures 1 and 2
The embodiments described above are presented to enable those skilled in the art to make and use the invention. It will be readily apparent to those skilled in the art that various modifications to these embodiments may be made, and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the embodiments described herein, and those skilled in the art should make improvements and modifications to the present invention based on the disclosure of the present invention within the protection scope of the present invention.
Claims (7)
1. A plating solution for tin plating or tin-lead alloy plating applied to leadless electronic components is characterized by comprising a polybasic complexing agent, tin methane sulfonate, lead methane sulfonate, a surfactant, a semi-bright additive, an antioxidant and water, wherein the pH value of the plating solution is 4-7, the plating solution is prepared by mixing the tin methane sulfonate, the lead methane sulfonate, the surfactant, the semi-bright additive, the antioxidant and the water,
the complexing agent is triethanolamine, gluconate and methylsulfonate, and the content of the complexing agent is 200-300 g/L;
the tin methane sulfonate is a concentrated solution containing 300 g/L of metal tin, the content of the metal tin in the plating solution is 10-25 g/L,
the lead methanesulfonate is a concentrated solution containing 500 g/L of metal lead, and the content of the metal lead in the plating solution is 1.0-2.5 g/L;
the surfactant is alkylphenol polyoxyethylene ether and bisphenol A polyoxyethylene ether, and the content of the surfactant is 1-8 g/L;
the semi-bright additive is selected from one of 2-mercaptobenzimidazole, 2-mercaptobenzothiazole and imidazole, and the content of the semi-bright additive is 0.05-0.3 g/L;
the content of the antioxidant is 0.4-2 g/L;
the balance of water.
2. The plating solution for tin or tin-lead alloy application to a leadless electronic component according to claim 1, wherein in the plating solution,
the content of the complexing agent is 240-280 g/L;
the content of the metallic tin is 15-20 g/L;
the content of the metallic lead is 1.5-2.0 g/L;
the content of the surfactant is 3-5 g/L;
the content of the semi-bright additive is 0.1-0.2 g/L;
the content of the antioxidant is 0.8-1.5 g/L;
the balance of water.
3. The plating solution for tin or tin-lead alloy plating for leadless electronic components as claimed in claim 1 or 2, wherein said antioxidant is at least 2 selected from catechol, hydroquinone, resorcinol, morin, phenol, and naphtholethyloxy sulfonic acid.
4. The method for preparing the tin or tin-lead alloy plating solution for leadless electronic components as claimed in claim 1 or 2, characterized by comprising the steps of:
adding water into a container, adding a complexing agent, stirring until the complexing agent is completely dissolved, slowly adding a tin methane sulfonate solution and a lead methane sulfonate solution in sequence, adding a surfactant, a semi-bright additive and an antioxidant, fully stirring, adding pure water to be close to a required volume, adjusting the pH value to 4-7 by using the methyl sulfonic acid or sodium hydroxide, continuously adding the pure water to a constant volume, wherein the antioxidant is added into the container after being completely dissolved by ethanol, propylene glycol, isopropanol and the like in advance.
5. The method for preparing the tin or tin-lead alloy plating solution for leadless electronic components of claim 4, wherein the methanesulfonic acid is 70% by weight plating grade solution.
6. The plating method of the plating solution of tin or tin-lead alloy for leadless electronic components according to claim 1 or 2, characterized by comprising the steps of:
(1) nickel plating: activating a plated piece coated with a silver layer by using 10% by volume of methanesulfonic acid, and barrel-plating nickel sulfamate;
in the nickel plating process, the temperature of the electroplating solution is 50-60 ℃, the pH value is 3.8-4.5, and the cathode current density is 0.1-5A/dm2The plating voltage is 8-12V, an anode used for electroplating is a nickel cake with the sulfur content of 0.015-0.023% by mass, the rotating speed of a roller is 5-7 r/min, when a leadless ceramic element is barrel-plated, a copper conductive ball or conductive rod mixed ceramic element is put into the roller together, full-immersion electroplating is adopted, and the thickness of barrel-plated nickel is 3-6 um, wherein an electroplating solution used for plating nickel comprises the following components, namely 270-330 g/L of nickel sulfamate, 15-20 g/L of nickel chloride and 30-40 g/L of boric acid;
(2) applying tin or tin-lead alloy: putting the nickel-plated electronic element into the tin or tin-lead alloy plating solution for electroplating tin or tin-lead alloy, and after the plating is finished, washing and drying;
in the process of plating tin or tin-lead alloy, the temperature of the electroplating solution is 15-25 ℃, and the current density of plating is 0.1-3A/dm2For electroplatingThe anode is pure tin or tin-lead alloy containing 5-10% of lead by mass, the rotating speed of the roller is 5-7 r/min, and when the leadless ceramic element is barrel-plated, the copper conductive beads or conductive rod mixed ceramic element are loaded into the roller together, and full-immersion electroplating is adopted.
7. The plating method of a plating solution of tin or tin-lead alloy for leadless electronic components as set forth in claim 6, wherein the temperature of the plating solution during said step (2) of applying tin or tin-lead alloy is 20 ℃.
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| CN110318076A (en) * | 2019-07-17 | 2019-10-11 | 安徽启明表面技术有限公司 | The preparation method of zinc-plating brightener |
| CN111472027B (en) * | 2020-05-09 | 2020-12-25 | 广东哈福科技有限公司 | Electrotinning additive and preparation method and use method thereof |
| CN112410831B (en) * | 2020-11-17 | 2021-11-26 | 广州三孚新材料科技股份有限公司 | Electrotinning solution for heterojunction solar cell and preparation method thereof |
| CN113862733B (en) * | 2021-11-01 | 2022-10-25 | 江苏艾森半导体材料股份有限公司 | Barrel plating neutral tin plating process |
| CN113930812B (en) * | 2021-11-15 | 2023-10-31 | 广东羚光新材料股份有限公司 | Tin plating liquid and tin plating method for chip electronic component |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1335418A (en) * | 2000-05-24 | 2002-02-13 | 株式会社村田制作所 | Electronic element, method for producing electronic element and circuit board |
| CN1549875A (en) * | 2001-08-31 | 2004-11-24 | 罗姆和哈斯电子材料有限责任公司 | Electrolytic tin-plating solution and method for electroplating |
| CN1633519A (en) * | 2002-02-15 | 2005-06-29 | 技术公司 | Electroplating solution containing organic acid complexing agent |
| CN101080513A (en) * | 2004-11-29 | 2007-11-28 | 技术公司 | Near neutral pH tin electroplating solution |
| CN101922026A (en) * | 2010-08-18 | 2010-12-22 | 济南德锡科技有限公司 | Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof |
| KR20150114838A (en) * | 2014-04-02 | 2015-10-13 | 주식회사 익스톨 | Tin-silver electroplating solution, producing method thereof and formation method of tin-silver solder bump using the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4698904B2 (en) * | 2001-09-20 | 2011-06-08 | 株式会社大和化成研究所 | Tin or tin-based alloy plating bath, tin salt and acid or complexing agent solution for building bath, maintenance or replenishment of the plating bath, and electric / electronic parts manufactured using the plating bath |
-
2018
- 2018-08-28 CN CN201810990764.8A patent/CN108866583B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1335418A (en) * | 2000-05-24 | 2002-02-13 | 株式会社村田制作所 | Electronic element, method for producing electronic element and circuit board |
| CN1549875A (en) * | 2001-08-31 | 2004-11-24 | 罗姆和哈斯电子材料有限责任公司 | Electrolytic tin-plating solution and method for electroplating |
| CN1633519A (en) * | 2002-02-15 | 2005-06-29 | 技术公司 | Electroplating solution containing organic acid complexing agent |
| CN101080513A (en) * | 2004-11-29 | 2007-11-28 | 技术公司 | Near neutral pH tin electroplating solution |
| CN101922026A (en) * | 2010-08-18 | 2010-12-22 | 济南德锡科技有限公司 | Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof |
| KR20150114838A (en) * | 2014-04-02 | 2015-10-13 | 주식회사 익스톨 | Tin-silver electroplating solution, producing method thereof and formation method of tin-silver solder bump using the same |
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