ES452704A1 - Un metodo para electrodepositar plata. - Google Patents

Un metodo para electrodepositar plata.

Info

Publication number
ES452704A1
ES452704A1 ES452704A ES452704A ES452704A1 ES 452704 A1 ES452704 A1 ES 452704A1 ES 452704 A ES452704 A ES 452704A ES 452704 A ES452704 A ES 452704A ES 452704 A1 ES452704 A1 ES 452704A1
Authority
ES
Spain
Prior art keywords
bath
strike
plating bath
current density
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES452704A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of ES452704A1 publication Critical patent/ES452704A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Un método para electroodepositar plata en el que se deposita electrolíticamente plata sobre una pieza de trabajo, que comprende utilizar la pieza de trabajo como cátodo en un baño de chapado electrolítico acuoso, caracterizado por el hecho de que el baño contiene XH2PO4, Y2HPO4 y ZAg(CN)2, donde X, Y y Z son sodio, potasio o amonio y el pH del baño está comprendido entre 6,8 y 7,2.
ES452704A 1975-10-28 1976-10-26 Un metodo para electrodepositar plata. Expired ES452704A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/625,975 US4024031A (en) 1975-10-28 1975-10-28 Silver plating

Publications (1)

Publication Number Publication Date
ES452704A1 true ES452704A1 (es) 1978-01-16

Family

ID=24508426

Family Applications (1)

Application Number Title Priority Date Filing Date
ES452704A Expired ES452704A1 (es) 1975-10-28 1976-10-26 Un metodo para electrodepositar plata.

Country Status (8)

Country Link
US (1) US4024031A (es)
JP (1) JPS5253735A (es)
DE (1) DE2649144A1 (es)
ES (1) ES452704A1 (es)
FR (1) FR2329772A1 (es)
GB (1) GB1525828A (es)
IT (1) IT1068589B (es)
NL (1) NL7611535A (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4155817A (en) * 1978-08-11 1979-05-22 American Chemical And Refining Company, Inc. Low free cyanide high purity silver electroplating bath and method
DE4010346A1 (de) * 1990-03-28 1991-10-02 Siemens Ag Verfahren zum aufbringen von silber-graphit-dispersionsueberzuegen
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
JP4138171B2 (ja) * 1999-08-12 2008-08-20 エヌ・イーケムキャット株式会社 銀電気めっき浴
US6809612B2 (en) * 2002-04-30 2004-10-26 Cts Corporation Dielectric block signal filters with cost-effective conductive coatings
US7235165B2 (en) * 2004-04-02 2007-06-26 Richard Lacey Electroplating solution and method for electroplating
US20130023166A1 (en) * 2011-07-20 2013-01-24 Tyco Electronics Corporation Silver plated electrical contact
US10889907B2 (en) 2014-02-21 2021-01-12 Rohm And Haas Electronic Materials Llc Cyanide-free acidic matte silver electroplating compositions and methods

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US744170A (en) * 1899-08-26 1903-11-17 Andre Darlay Process of depositing metallic coatings on metallic objects.
US2435525A (en) * 1942-05-05 1948-02-03 Mallory & Co Inc P R Electrodeposition of silver from a high silver cyanide content bath
US2504272A (en) * 1944-10-25 1950-04-18 Ewald H Mccoy Electrodeposition of silver
NL273924A (es) * 1961-01-24
US3427232A (en) * 1967-03-13 1969-02-11 Us Air Force Method of electrode plating silver on magnesium
FR1575777A (es) * 1968-05-03 1969-07-25
US3691032A (en) * 1970-05-01 1972-09-12 Gen Electric Permalloy film plated wires having superior nondestructive read-out characteristics and method of forming

Also Published As

Publication number Publication date
FR2329772A1 (fr) 1977-05-27
JPS5253735A (en) 1977-04-30
IT1068589B (it) 1985-03-21
DE2649144A1 (de) 1977-05-12
NL7611535A (nl) 1977-05-02
GB1525828A (en) 1978-09-20
US4024031A (en) 1977-05-17

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