KR830002066A - 구리이온이 함유되어 있는 욕(浴)에서 구리이온을 제거하는 방법 - Google Patents

구리이온이 함유되어 있는 욕(浴)에서 구리이온을 제거하는 방법 Download PDF

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Publication number
KR830002066A
KR830002066A KR1019800000192A KR800000192A KR830002066A KR 830002066 A KR830002066 A KR 830002066A KR 1019800000192 A KR1019800000192 A KR 1019800000192A KR 800000192 A KR800000192 A KR 800000192A KR 830002066 A KR830002066 A KR 830002066A
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KR
South Korea
Prior art keywords
substrate
lead
ions
tin
copper ions
Prior art date
Application number
KR1019800000192A
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English (en)
Other versions
KR850000304B1 (ko
Inventor
에이. 크루퍼 웨인
Original Assignee
로버트 티. 노리스
굴드 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 로버트 티. 노리스, 굴드 인코포레이티드 filed Critical 로버트 티. 노리스
Publication of KR830002066A publication Critical patent/KR830002066A/ko
Application granted granted Critical
Publication of KR850000304B1 publication Critical patent/KR850000304B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/10—Bearings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/20—Regeneration of process solutions of rinse-solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys

Abstract

내용 없음

Description

구리이온이 함유되어 있는 욕(浴)에서 구리이온을 제거하는 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (1)

  1. 적당한 금속성 기질을 납이온, 주석이온 및 구리이온이 함유되어 있는 전기도금욕에 넣고 이 도금욕에 전류를 통과시켜 상기 기질의 표면에 납-주석-구리층을 전착시키고, 도금된 기질을 상기욕으로부터 회수한 후 이 기질을 수성세척매체로 세척하여 도금욕중의 도금된 기질로부터 전해질을 제거하고, 상기 수석 세척매체를 납주석 및 이의 합금중에서 선택된 금속과 충분한 시간 접촉시킴으로써 매체내의 구리이온을 금속이온으로 치환시키고 상기 구리이온을 금속의 잔류물에 전착시킨 다음 세척되고 도금된 기질을 구리이온은 함유되지 않고 주석과 납이온이 함유되어 있는 전기도금욕에 넣고 이 전기도금욕에 전류를 통과시켜 상기 기질의 표면에 납-주석층을 전착시킴을 특징으로 하여 납, 구리 및 주석을 금속성기질에 공-전착시켜 형성된 베어링 구조의 표면에 납-주석층을 전착시키는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019800000192A 1979-01-22 1980-01-19 베어링 표면층에 납-주석층을 전착시키는 용액속의 구리이온 제거방법 KR850000304B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5,602 1979-01-22
US06/005,602 US4187166A (en) 1979-01-22 1979-01-22 Method of removing copper ions from a bath containing same

Publications (2)

Publication Number Publication Date
KR830002066A true KR830002066A (ko) 1983-05-21
KR850000304B1 KR850000304B1 (ko) 1985-03-18

Family

ID=21716702

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019800000192A KR850000304B1 (ko) 1979-01-22 1980-01-19 베어링 표면층에 납-주석층을 전착시키는 용액속의 구리이온 제거방법

Country Status (12)

Country Link
US (1) US4187166A (ko)
JP (1) JPS55100992A (ko)
KR (1) KR850000304B1 (ko)
AU (1) AU527503B2 (ko)
BR (1) BR7908545A (ko)
CA (1) CA1153728A (ko)
DE (1) DE2947998A1 (ko)
FR (1) FR2446872A1 (ko)
GB (1) GB2039955B (ko)
IN (1) IN152023B (ko)
IT (1) IT1120140B (ko)
MX (1) MX153508A (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4405412A (en) * 1982-03-29 1983-09-20 Dart Industries Inc. Removal of copper contamination from tin plating baths
DE3502278A1 (de) * 1985-01-24 1986-07-24 MTU Motoren- und Turbinen-Union München GmbH, 8000 München Vorrichtung zur messung von druecken in rotierenden anordnungen (systemen)
JPH0288847A (ja) * 1988-09-26 1990-03-29 Oyo Kikaku:Kk 二重床構築方法
JPH0293096A (ja) * 1988-09-30 1990-04-03 Daiwa Kasei Kenkyusho:Kk 滑り軸受の表面合金層の製造法
JPH0491712U (ko) * 1990-12-28 1992-08-10
US6143146A (en) * 1998-08-25 2000-11-07 Strom; Doug Filter system
US6332973B1 (en) * 2000-01-25 2001-12-25 Advanced Micro Devices, Inc. CMOS chemical bath purification
US6740221B2 (en) 2001-03-15 2004-05-25 Applied Materials Inc. Method of forming copper interconnects
US7239747B2 (en) * 2002-01-24 2007-07-03 Chatterbox Systems, Inc. Method and system for locating position in printed texts and delivering multimedia information
US20030188974A1 (en) * 2002-04-03 2003-10-09 Applied Materials, Inc. Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects
JP4243985B2 (ja) * 2002-09-24 2009-03-25 大日本スクリーン製造株式会社 金属イオンの除去方法及び基板処理装置
US20040118699A1 (en) * 2002-10-02 2004-06-24 Applied Materials, Inc. Homogeneous copper-palladium alloy plating for enhancement of electro-migration resistance in interconnects
US20190345624A1 (en) * 2018-05-09 2019-11-14 Applied Materials, Inc. Systems and methods for removing contaminants in electroplating systems

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2734024A (en) * 1956-02-07 Method of making bearings
FR1334413A (fr) * 1962-06-25 1963-08-09 Coussinets Ste Indle Procédés de préparation ou de régénération de bains mixtes de fluoborates de plomb et d'étain
US3812020A (en) * 1969-08-11 1974-05-21 Allied Chem Electrolyte and method for electroplating an indium-copper alloy and printed circuits so plated
US3940319A (en) * 1974-06-24 1976-02-24 Nasglo International Corporation Electrodeposition of bright tin-nickel alloy

Also Published As

Publication number Publication date
IT1120140B (it) 1986-03-19
IT7950987A0 (it) 1979-12-04
IN152023B (ko) 1983-10-01
AU5356079A (en) 1981-07-02
GB2039955A (en) 1980-08-20
AU527503B2 (en) 1983-03-10
FR2446872B1 (ko) 1983-01-14
MX153508A (es) 1986-11-10
BR7908545A (pt) 1980-09-02
GB2039955B (en) 1983-01-26
JPS55100992A (en) 1980-08-01
CA1153728A (en) 1983-09-13
JPS6214038B2 (ko) 1987-03-31
DE2947998C2 (ko) 1988-10-27
KR850000304B1 (ko) 1985-03-18
US4187166A (en) 1980-02-05
DE2947998A1 (de) 1980-07-31
FR2446872A1 (fr) 1980-08-14

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