FR2446872A1 - Procede d'elimination d'ions cuivre d'un bain en contenant - Google Patents

Procede d'elimination d'ions cuivre d'un bain en contenant

Info

Publication number
FR2446872A1
FR2446872A1 FR7930466A FR7930466A FR2446872A1 FR 2446872 A1 FR2446872 A1 FR 2446872A1 FR 7930466 A FR7930466 A FR 7930466A FR 7930466 A FR7930466 A FR 7930466A FR 2446872 A1 FR2446872 A1 FR 2446872A1
Authority
FR
France
Prior art keywords
tin
lead
ions
substrate
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7930466A
Other languages
English (en)
Other versions
FR2446872B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Inc
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of FR2446872A1 publication Critical patent/FR2446872A1/fr
Application granted granted Critical
Publication of FR2446872B1 publication Critical patent/FR2446872B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/10—Bearings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/20—Regeneration of process solutions of rinse-solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Procédé d'électrodéposition d'une couche de recouvrement de plomb-étain à la surface d'une structure portante formée par dépôt simultané de plomb, cuivre et étain. Il consiste à deposer électrolytiquement une couche de plomb-étain-cuivre sur la surface d'un substrat métallique à partir d'un bain contenant des ions de ces métaux, à retirer le substrat revêtu du bain, à rincer le substrat ainsi revêtu avec de l'eau pour en éliminer l'électrolyte entraîné, à mettre cette eau en contact avec du plomb ou de l'étain ou leurs alliages pour remplacer les ions cuivre qu'elle contient par des ions de ces métaux, les ions cuivre se déposant sur le reste de ce métal, à placer ce substrat rincé dans un bain dépourvu d'ions cuivre, contenant des ions plomb et étain, et à faire passer un courant à travers ce bain pour déposer une couche d'étain-plomb sur ce substrat
FR7930466A 1979-01-22 1979-12-12 Procede d'elimination d'ions cuivre d'un bain en contenant Granted FR2446872A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/005,602 US4187166A (en) 1979-01-22 1979-01-22 Method of removing copper ions from a bath containing same

Publications (2)

Publication Number Publication Date
FR2446872A1 true FR2446872A1 (fr) 1980-08-14
FR2446872B1 FR2446872B1 (fr) 1983-01-14

Family

ID=21716702

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7930466A Granted FR2446872A1 (fr) 1979-01-22 1979-12-12 Procede d'elimination d'ions cuivre d'un bain en contenant

Country Status (12)

Country Link
US (1) US4187166A (fr)
JP (1) JPS55100992A (fr)
KR (1) KR850000304B1 (fr)
AU (1) AU527503B2 (fr)
BR (1) BR7908545A (fr)
CA (1) CA1153728A (fr)
DE (1) DE2947998A1 (fr)
FR (1) FR2446872A1 (fr)
GB (1) GB2039955B (fr)
IN (1) IN152023B (fr)
IT (1) IT1120140B (fr)
MX (1) MX153508A (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4405412A (en) * 1982-03-29 1983-09-20 Dart Industries Inc. Removal of copper contamination from tin plating baths
DE3502278C2 (de) * 1985-01-24 1987-05-07 MTU Motoren- und Turbinen-Union München GmbH, 8000 München Vorrichtung zur Erfassung von Meßwerten in rotierenden Anordnungen
JPH0288847A (ja) * 1988-09-26 1990-03-29 Oyo Kikaku:Kk 二重床構築方法
JPH0293096A (ja) * 1988-09-30 1990-04-03 Daiwa Kasei Kenkyusho:Kk 滑り軸受の表面合金層の製造法
JPH0491712U (fr) * 1990-12-28 1992-08-10
US6143146A (en) * 1998-08-25 2000-11-07 Strom; Doug Filter system
US6332973B1 (en) * 2000-01-25 2001-12-25 Advanced Micro Devices, Inc. CMOS chemical bath purification
US6740221B2 (en) 2001-03-15 2004-05-25 Applied Materials Inc. Method of forming copper interconnects
WO2003063067A1 (fr) * 2002-01-24 2003-07-31 Chatterbox Systems, Inc. Procedes et systemes de localisation de position dans des textes imprimes et de diffusion d'informations multimedia
WO2003085713A1 (fr) * 2002-04-03 2003-10-16 Applied Materials, Inc. Placage homogene d'alliage de cuivre et d'etain pour l'amelioration de la resistance d'electromigration dans des interconnexions
JP4243985B2 (ja) * 2002-09-24 2009-03-25 大日本スクリーン製造株式会社 金属イオンの除去方法及び基板処理装置
US20040118699A1 (en) * 2002-10-02 2004-06-24 Applied Materials, Inc. Homogeneous copper-palladium alloy plating for enhancement of electro-migration resistance in interconnects
KR102523503B1 (ko) * 2018-05-09 2023-04-18 어플라이드 머티어리얼스, 인코포레이티드 전기도금 시스템들에서 오염을 제거하기 위한 시스템들 및 방법들

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2734024A (en) * 1956-02-07 Method of making bearings
FR1334413A (fr) * 1962-06-25 1963-08-09 Coussinets Ste Indle Procédés de préparation ou de régénération de bains mixtes de fluoborates de plomb et d'étain

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3812020A (en) * 1969-08-11 1974-05-21 Allied Chem Electrolyte and method for electroplating an indium-copper alloy and printed circuits so plated
US3940319A (en) * 1974-06-24 1976-02-24 Nasglo International Corporation Electrodeposition of bright tin-nickel alloy

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2734024A (en) * 1956-02-07 Method of making bearings
FR1334413A (fr) * 1962-06-25 1963-08-09 Coussinets Ste Indle Procédés de préparation ou de régénération de bains mixtes de fluoborates de plomb et d'étain

Also Published As

Publication number Publication date
FR2446872B1 (fr) 1983-01-14
GB2039955B (en) 1983-01-26
JPS6214038B2 (fr) 1987-03-31
BR7908545A (pt) 1980-09-02
DE2947998A1 (de) 1980-07-31
KR830002066A (ko) 1983-05-21
IT1120140B (it) 1986-03-19
JPS55100992A (en) 1980-08-01
CA1153728A (fr) 1983-09-13
IN152023B (fr) 1983-10-01
GB2039955A (en) 1980-08-20
MX153508A (es) 1986-11-10
US4187166A (en) 1980-02-05
DE2947998C2 (fr) 1988-10-27
KR850000304B1 (ko) 1985-03-18
IT7950987A0 (it) 1979-12-04
AU5356079A (en) 1981-07-02
AU527503B2 (en) 1983-03-10

Similar Documents

Publication Publication Date Title
FR2446872A1 (fr) Procede d'elimination d'ions cuivre d'un bain en contenant
De Lepinay et al. Electroplating silicon and titanium in molten fluoride media
JPS61119699A (ja) 金属または金属合金の箔を製造するシステム並びに方法
TWI507571B (zh) 藉由電鑄法但不使用有毒金屬或類金屬而獲致黃金合金沉積的方法
Schlesinger Electroplating
WO2000011233A3 (fr) Procede de fluxage pour galvanisation d'acier
JP2005511898A (ja) アルミニウム材料の被覆のための前処理プロセス
FR2434874A1 (fr) Procede pour enlever une couche superficielle de metal ou d'alliage
FR2362219A1 (fr) Procede pour la pre-metallisation de surfaces d'acier
FR2459299A1 (fr) Procede pour le depot galvanoplastique d'un alliage d'or
US2870070A (en) Electrodeposition of tin and electrolyte therefor
JPS57114695A (en) Production of zinc plated steeel plate of superior blackening resistance and intergranular corrosion resistance
ATE371266T1 (de) Verbesserung der qualität einer in einem plattierungsbad abgeschiedenen metallhaltigen schicht
SU553309A1 (ru) Способ подготовки поверхности катодов
Horvick Zinc in the World of Electroplating
WO1993020264A1 (fr) Procede de fabrication d'un materiau stratifie ou de pieces stratifiees pour palier lisse
JPS57203799A (en) Producing device for iron-zinc alloy electroplated steel plate
DE1934081C3 (de) Verfahren zur Verbesserung der ElektroschweiBbarkeit und der Korrosionsfestigkeit von galvanisch verzinktem
SU367746A1 (ru) Контактно-химический способ осаждени металлов
JPS5743997A (en) Uniform electroplating method
Smirnov et al. Rate of Circulation of Electrolyte in the Electrolytic Refining of Copper
Kukanskis et al. Electrolytic Method for the Dissolution of Copper Particles Formed During Electroless Copper Deposition
JP2665981B2 (ja) アルミニウムまたはアルミニウム合金のメッキ処理方法
Mamontov The Formation of Voids During the Initial Period of Copper Electrocrystallization on Inert Substrates
JPS54149335A (en) Silver plating method for lead frame

Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse