BR7908545A - Processo para eletrodepositar uma camada de cobertura de chumbo-estanho sobre a superficie de uma estrutura de mancal,e processo para remover ions de cobre a partir de um banho contendo ions de chumbo,ions de cobre e ions de estanho - Google Patents

Processo para eletrodepositar uma camada de cobertura de chumbo-estanho sobre a superficie de uma estrutura de mancal,e processo para remover ions de cobre a partir de um banho contendo ions de chumbo,ions de cobre e ions de estanho

Info

Publication number
BR7908545A
BR7908545A BR7908545A BR7908545A BR7908545A BR 7908545 A BR7908545 A BR 7908545A BR 7908545 A BR7908545 A BR 7908545A BR 7908545 A BR7908545 A BR 7908545A BR 7908545 A BR7908545 A BR 7908545A
Authority
BR
Brazil
Prior art keywords
ions
copper ions
electrodepositing
cover layer
bearing structure
Prior art date
Application number
BR7908545A
Other languages
English (en)
Inventor
W Kruper
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of BR7908545A publication Critical patent/BR7908545A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/10—Bearings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/20—Regeneration of process solutions of rinse-solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
BR7908545A 1979-01-22 1979-12-27 Processo para eletrodepositar uma camada de cobertura de chumbo-estanho sobre a superficie de uma estrutura de mancal,e processo para remover ions de cobre a partir de um banho contendo ions de chumbo,ions de cobre e ions de estanho BR7908545A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/005,602 US4187166A (en) 1979-01-22 1979-01-22 Method of removing copper ions from a bath containing same

Publications (1)

Publication Number Publication Date
BR7908545A true BR7908545A (pt) 1980-09-02

Family

ID=21716702

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7908545A BR7908545A (pt) 1979-01-22 1979-12-27 Processo para eletrodepositar uma camada de cobertura de chumbo-estanho sobre a superficie de uma estrutura de mancal,e processo para remover ions de cobre a partir de um banho contendo ions de chumbo,ions de cobre e ions de estanho

Country Status (12)

Country Link
US (1) US4187166A (pt)
JP (1) JPS55100992A (pt)
KR (1) KR850000304B1 (pt)
AU (1) AU527503B2 (pt)
BR (1) BR7908545A (pt)
CA (1) CA1153728A (pt)
DE (1) DE2947998A1 (pt)
FR (1) FR2446872A1 (pt)
GB (1) GB2039955B (pt)
IN (1) IN152023B (pt)
IT (1) IT1120140B (pt)
MX (1) MX153508A (pt)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4405412A (en) * 1982-03-29 1983-09-20 Dart Industries Inc. Removal of copper contamination from tin plating baths
DE3502278A1 (de) * 1985-01-24 1986-07-24 MTU Motoren- und Turbinen-Union München GmbH, 8000 München Vorrichtung zur messung von druecken in rotierenden anordnungen (systemen)
JPH0288847A (ja) * 1988-09-26 1990-03-29 Oyo Kikaku:Kk 二重床構築方法
JPH0293096A (ja) * 1988-09-30 1990-04-03 Daiwa Kasei Kenkyusho:Kk 滑り軸受の表面合金層の製造法
JPH0491712U (pt) * 1990-12-28 1992-08-10
US6143146A (en) * 1998-08-25 2000-11-07 Strom; Doug Filter system
US6332973B1 (en) * 2000-01-25 2001-12-25 Advanced Micro Devices, Inc. CMOS chemical bath purification
US6740221B2 (en) 2001-03-15 2004-05-25 Applied Materials Inc. Method of forming copper interconnects
US7239747B2 (en) * 2002-01-24 2007-07-03 Chatterbox Systems, Inc. Method and system for locating position in printed texts and delivering multimedia information
WO2003085713A1 (en) * 2002-04-03 2003-10-16 Applied Materials, Inc. Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects
JP4243985B2 (ja) * 2002-09-24 2009-03-25 大日本スクリーン製造株式会社 金属イオンの除去方法及び基板処理装置
US20040118699A1 (en) * 2002-10-02 2004-06-24 Applied Materials, Inc. Homogeneous copper-palladium alloy plating for enhancement of electro-migration resistance in interconnects
KR102523503B1 (ko) * 2018-05-09 2023-04-18 어플라이드 머티어리얼스, 인코포레이티드 전기도금 시스템들에서 오염을 제거하기 위한 시스템들 및 방법들

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2734024A (en) * 1956-02-07 Method of making bearings
FR1334413A (fr) * 1962-06-25 1963-08-09 Coussinets Ste Indle Procédés de préparation ou de régénération de bains mixtes de fluoborates de plomb et d'étain
US3812020A (en) * 1969-08-11 1974-05-21 Allied Chem Electrolyte and method for electroplating an indium-copper alloy and printed circuits so plated
US3940319A (en) * 1974-06-24 1976-02-24 Nasglo International Corporation Electrodeposition of bright tin-nickel alloy

Also Published As

Publication number Publication date
FR2446872B1 (pt) 1983-01-14
FR2446872A1 (fr) 1980-08-14
US4187166A (en) 1980-02-05
GB2039955B (en) 1983-01-26
KR850000304B1 (ko) 1985-03-18
AU527503B2 (en) 1983-03-10
GB2039955A (en) 1980-08-20
DE2947998A1 (de) 1980-07-31
AU5356079A (en) 1981-07-02
MX153508A (es) 1986-11-10
IT1120140B (it) 1986-03-19
JPS6214038B2 (pt) 1987-03-31
KR830002066A (ko) 1983-05-21
DE2947998C2 (pt) 1988-10-27
IN152023B (pt) 1983-10-01
IT7950987A0 (it) 1979-12-04
JPS55100992A (en) 1980-08-01
CA1153728A (en) 1983-09-13

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Legal Events

Date Code Title Description
MK Patent expired

Effective date: 19941227