FR2329772A1 - Bain et procede de depot electrolytique d'argent - Google Patents

Bain et procede de depot electrolytique d'argent

Info

Publication number
FR2329772A1
FR2329772A1 FR7632435A FR7632435A FR2329772A1 FR 2329772 A1 FR2329772 A1 FR 2329772A1 FR 7632435 A FR7632435 A FR 7632435A FR 7632435 A FR7632435 A FR 7632435A FR 2329772 A1 FR2329772 A1 FR 2329772A1
Authority
FR
France
Prior art keywords
money
bath
electrolytic deposit
electrolytic
deposit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7632435A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of FR2329772A1 publication Critical patent/FR2329772A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
FR7632435A 1975-10-28 1976-10-27 Bain et procede de depot electrolytique d'argent Withdrawn FR2329772A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/625,975 US4024031A (en) 1975-10-28 1975-10-28 Silver plating

Publications (1)

Publication Number Publication Date
FR2329772A1 true FR2329772A1 (fr) 1977-05-27

Family

ID=24508426

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7632435A Withdrawn FR2329772A1 (fr) 1975-10-28 1976-10-27 Bain et procede de depot electrolytique d'argent

Country Status (8)

Country Link
US (1) US4024031A (fr)
JP (1) JPS5253735A (fr)
DE (1) DE2649144A1 (fr)
ES (1) ES452704A1 (fr)
FR (1) FR2329772A1 (fr)
GB (1) GB1525828A (fr)
IT (1) IT1068589B (fr)
NL (1) NL7611535A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991014808A1 (fr) * 1990-03-28 1991-10-03 Siemens Aktiengesellschaft Procede pour l'application de depots electrolytiques d'argent-graphite durcis par dispersion

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4155817A (en) * 1978-08-11 1979-05-22 American Chemical And Refining Company, Inc. Low free cyanide high purity silver electroplating bath and method
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
JP4138171B2 (ja) * 1999-08-12 2008-08-20 エヌ・イーケムキャット株式会社 銀電気めっき浴
US6809612B2 (en) * 2002-04-30 2004-10-26 Cts Corporation Dielectric block signal filters with cost-effective conductive coatings
US7235165B2 (en) * 2004-04-02 2007-06-26 Richard Lacey Electroplating solution and method for electroplating
US20130023166A1 (en) * 2011-07-20 2013-01-24 Tyco Electronics Corporation Silver plated electrical contact
US10889907B2 (en) 2014-02-21 2021-01-12 Rohm And Haas Electronic Materials Llc Cyanide-free acidic matte silver electroplating compositions and methods

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US744170A (en) * 1899-08-26 1903-11-17 Andre Darlay Process of depositing metallic coatings on metallic objects.
US2435525A (en) * 1942-05-05 1948-02-03 Mallory & Co Inc P R Electrodeposition of silver from a high silver cyanide content bath
US2504272A (en) * 1944-10-25 1950-04-18 Ewald H Mccoy Electrodeposition of silver
NL273924A (fr) * 1961-01-24
US3427232A (en) * 1967-03-13 1969-02-11 Us Air Force Method of electrode plating silver on magnesium
FR1575777A (fr) * 1968-05-03 1969-07-25
US3691032A (en) * 1970-05-01 1972-09-12 Gen Electric Permalloy film plated wires having superior nondestructive read-out characteristics and method of forming

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991014808A1 (fr) * 1990-03-28 1991-10-03 Siemens Aktiengesellschaft Procede pour l'application de depots electrolytiques d'argent-graphite durcis par dispersion

Also Published As

Publication number Publication date
GB1525828A (en) 1978-09-20
JPS5253735A (en) 1977-04-30
US4024031A (en) 1977-05-17
ES452704A1 (es) 1978-01-16
DE2649144A1 (de) 1977-05-12
NL7611535A (nl) 1977-05-02
IT1068589B (it) 1985-03-21

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Legal Events

Date Code Title Description
ST Notification of lapse