IN2014DE02341A - - Google Patents

Info

Publication number
IN2014DE02341A
IN2014DE02341A IN2341DE2014A IN2014DE02341A IN 2014DE02341 A IN2014DE02341 A IN 2014DE02341A IN 2341DE2014 A IN2341DE2014 A IN 2341DE2014A IN 2014DE02341 A IN2014DE02341 A IN 2014DE02341A
Authority
IN
India
Prior art keywords
layer
alloy layer
alloy
based surface
less
Prior art date
Application number
Inventor
Naoki Kato
Yuki Inoue
Yoshie Tarutani
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of IN2014DE02341A publication Critical patent/IN2014DE02341A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
    • C23C10/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
    • C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

Abstract

A tin-plated copper-alloy terminal material 5 in which: a Sn-based surface layer formed on a surface of a substrate made of Cu alloy, and a Cu-Sn alloy layer/a Ni-Sn alloy layer/a Ni or Ni alloy layer are formed in sequence from the Sn-based surface layer between the Sn-based surface layer and the substrate; the Cu-Sn alloy layer is a compound-alloy layer containing Cu6Sn5 as a main component and a part of Cu in the Cu6Sn5 is displaced by Ni; the Ni-Snalloy layer is a compound-alloy layer containing Ni3Sn4 as a main component and a part of Ni in the Ni3Sn4 is displaced by Cu; an arithmetic average roughness Ra of the Cu-Sn alloy layer is 0.3 µm or more in at least one direction and arithmetic average roughness Ra in all directions is 1.0 µm or less; an oil-sump depth Rvk of the Cu-Sn alloy layer is 0.5 µm or more; an average thickness of the Sn-based surface layer is 0.4 µm or more and 1.0 µm or less; and a dynamic friction coefficient is 0.3 or less.
IN2341DE2014 2013-08-26 2014-08-18 IN2014DE02341A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013174844 2013-08-26

Publications (1)

Publication Number Publication Date
IN2014DE02341A true IN2014DE02341A (en) 2015-06-26

Family

ID=51392117

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2341DE2014 IN2014DE02341A (en) 2013-08-26 2014-08-18

Country Status (7)

Country Link
US (1) US20150056466A1 (en)
EP (1) EP2843086A3 (en)
JP (1) JP2015063750A (en)
KR (1) KR20150024252A (en)
CN (1) CN104425940A (en)
IN (1) IN2014DE02341A (en)
TW (1) TW201512430A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201311944A (en) * 2011-08-12 2013-03-16 Mitsubishi Materials Corp Tin-plated copper alloy terminal member with outstanding insertion and removal characteristics
JP6221695B2 (en) * 2013-03-25 2017-11-01 三菱マテリアル株式会社 Tin-plated copper alloy terminal material with excellent insertability
JP6039540B2 (en) * 2013-12-13 2016-12-07 三井金属鉱業株式会社 Electrolytic copper foil and method for producing the same
JP6160582B2 (en) * 2014-09-11 2017-07-12 三菱マテリアル株式会社 Tin-plated copper alloy terminal material and manufacturing method thereof
JP6543138B2 (en) * 2015-08-28 2019-07-10 Ｄｏｗａメタルテック株式会社 Sn plated material and method of manufacturing the same
JP5939345B1 (en) * 2015-11-06 2016-06-22 株式会社オートネットワーク技術研究所 Terminal fittings and connectors
WO2017195768A1 (en) * 2016-05-10 2017-11-16 三菱マテリアル株式会社 Tinned copper terminal material, terminal, and electrical wire end part structure
JP6543216B2 (en) * 2016-05-19 2019-07-10 Ｄｏｗａメタルテック株式会社 Sn plated material and method of manufacturing the same
WO2018074256A1 (en) * 2016-10-17 2018-04-26 古河電気工業株式会社 Conductive bar material
JP6423025B2 (en) 2017-01-17 2018-11-14 三菱伸銅株式会社 Tin-plated copper terminal material excellent in insertion / removability and manufacturing method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050037229A1 (en) * 2001-01-19 2005-02-17 Hitoshi Tanaka Plated material, method of producing same, and electrical / electronic part using same
JP4024244B2 (en) 2004-12-27 2007-12-19 株式会社神戸製鋼所 Conductive material for connecting parts and method for manufacturing the same
JP2007063624A (en) 2005-08-31 2007-03-15 Nikko Kinzoku Kk Copper alloy tinned strip having excellent insertion/withdrawal property and heat resistance
JP4503620B2 (en) * 2007-01-25 2010-07-14 株式会社神戸製鋼所 Conductive material for connecting parts and method for manufacturing the same
TW201413068A (en) * 2012-07-02 2014-04-01 Mitsubishi Materials Corp Tin-plated copper alloy terminal member with outstanding insertion and removal characteristics and method of manufacturing the same

Also Published As

Publication number Publication date
CN104425940A (en) 2015-03-18
EP2843086A3 (en) 2015-06-03
EP2843086A2 (en) 2015-03-04
KR20150024252A (en) 2015-03-06
TW201512430A (en) 2015-04-01
US20150056466A1 (en) 2015-02-26
JP2015063750A (en) 2015-04-09

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