JP6489257B1 - Tin-plated copper wire, method of manufacturing the same, insulated wire, cable - Google Patents

Abstract

An object of the present invention is to improve the wear resistance of a tin-plated layer in a tin-plated copper wire. An X-ray is measured by irradiating a tin-plated layer with a copper wire containing copper and a tin-plated layer formed on the outer periphery of the copper wire and containing Cu6Sn5 as a tin-copper compound. In the line diffraction pattern, the integrated intensity IA of the peak corresponding to the Miller index (101) plane of the tin-copper compound constituting the tin plating layer and the integrated intensity of the peak corresponding to the Miller index (111) surface of copper constituting the copper wire A tin-plated copper wire is provided, wherein the integrated intensity ratio of integrated intensity IA to the sum with IB is 15% or more. [Selected figure] Figure 1

Description

  The present invention relates to a tin-plated copper wire, a method of manufacturing the same, an insulated wire, and a cable.

  There are insulated wires and cables with high flexibility that are used for industrial robots, machine tools, and various electric devices. In such an insulated wire or cable excellent in flexibility, in order to obtain desired flexibility, a stranded wire in which thin copper wires are twisted is used. The copper wire may be tin-plated for the purpose of suppressing deterioration of surface quality due to corrosion or the like.

  As a tin plating method to a copper wire, there is a hot-dip plating method (see, for example, Patent Document 1). In the hot-dip plating method, for example, a copper wire is immersed in a molten metal in which tin is melted and then pulled up to adhere the molten tin to the surface of the copper wire and solidify it to form a tin plating layer.

  For example, a tin-plated copper wire in which a tin plating layer is provided on a copper wire is formed into a stranded wire by twisting a plurality of wires, and is used as a conductor constituting an insulated wire or a cable. By forming an insulating layer on the outer periphery of the stranded wire, an insulated wire or cable can be obtained.

JP 2001-345018 A

  However, in the tin-plated copper wire, the tin-plated copper wire rubs against each other in the production process of the stranded wire, or the tin-plated copper wire contacts the members constituting the manufacturing apparatus such as a guide or a pulley. May wear out and copper wire may be exposed. The exposure of the copper wire causes corrosion or discoloration of the copper wire, which reduces the reliability of the tin-plated copper wire.

  An object of the present invention is to provide a technique for improving the wear resistance of a tin-plated layer in a tin-plated copper wire.

According to one aspect of the invention:
Copper wire containing copper,
And a tin plating layer formed on the outer periphery of the copper wire and containing Cu ₆ Sn ₅ as a tin-copper compound,
In X-ray diffraction pattern measured by irradiating X-rays to the tin-plated layer, and the integrated intensity I _A of the peak corresponding to Miller indices (101) plane of the tin-copper compound constituting the tin plating layer integrated intensity ratio of the integrated intensity I _a to the sum of the integrated intensity I _B of a peak corresponding to Miller indices (111) plane of the copper constituting the copper wire is 15% or more,
A tin plated copper wire is provided.

According to another aspect of the invention,
Adding copper to the molten tin, and adjusting the concentration of copper in the molten tin to be 80% or more of the saturation concentration of copper at the temperature of the molten tin;
Forming a tin plating layer containing Cu ₆ Sn ₅ as a tin-copper compound on the surface of the copper wire by immersing and pulling up a copper wire containing copper in the molten tin in which the copper concentration is adjusted; And
In X-ray diffraction pattern measured by irradiating X-rays to the tin-plated layer, and the integrated intensity I _A of the peak corresponding to Miller indices (101) plane of the tin-copper compound constituting the tin plating layer integrated intensity ratio of the integrated intensity I _a to the sum of the integrated intensity I _B of a peak corresponding to Miller indices (111) plane of the copper constituting the copper wire is 15% or more,
A method of making a tin plated copper wire is provided.

According to yet another aspect of the invention,
An insulated wire comprising: a conductor comprising a stranded wire obtained by twisting a plurality of tin-plated copper wires; and an insulating layer covering the conductor,
The tin-plated copper wire is
Copper wire containing copper,
And a tin plating layer formed on the outer periphery of the copper wire and containing Cu ₆ Sn ₅ as a tin-copper compound,
In X-ray diffraction pattern measured by irradiating X-rays to the tin-plated layer, and the integrated intensity I _A of the peak corresponding to Miller indices (101) plane of the tin-copper compound constituting the tin plating layer integrated intensity ratio of the integrated intensity I _a to the sum of the integrated intensity I _B of a peak corresponding to Miller indices (111) plane of the copper constituting the copper wire is 15% or more,
An insulated wire is provided.

According to yet another aspect of the invention,
What is claimed is: 1. A cable comprising: a conductor comprising a stranded wire obtained by twisting a plurality of tin-plated copper wires;
The tin-plated copper wire is
Copper wire containing copper,
And a tin plating layer formed on the outer periphery of the copper wire and containing Cu ₆ Sn ₅ as a tin-copper compound,
In X-ray diffraction pattern measured by irradiating X-rays to the tin-plated layer, and the integrated intensity I _A of the peak corresponding to Miller indices (101) plane of the tin-copper compound constituting the tin plating layer integrated intensity ratio of the integrated intensity I _a to the sum of the integrated intensity I _B of a peak corresponding to Miller indices (111) plane of the copper constituting the copper wire is 15% or more,
A cable is provided.

  According to the present invention, the wear resistance of the tin plating layer can be improved in the tin plating copper wire.

It is a figure which shows the cross section perpendicular | vertical to the length direction of the tin plating copper wire concerning one Embodiment of this invention. It is the schematic which shows the structure of a tin plating layer typically. It is the schematic for demonstrating the manufacturing method of the tin plating copper wire concerning one Embodiment of this invention. It is a figure which shows the X-ray-diffraction pattern of a tin plating layer about each tin plating copper wire of Example 1, 2 and Comparative Examples 1, 2. FIG. It is a SEM image of the alloy layer surface about the tin plating copper wire of Example 1. FIG. It is a SEM image of the alloy layer surface about the tin plating copper wire of Example 2. FIG. It is a SEM image of the alloy layer surface about the tin plating copper wire of comparative example 1. FIG.

  The tin plating layer is formed by immersing and pulling up a copper wire containing copper in a molten tin solution in which tin is melted, whereby an alloy layer containing a tin-copper compound and a tin layer containing tin are laminated from the copper wire side. And be configured. The formation of the alloy layer is caused by the formation of an intermetallic compound (tin-copper alloy) between copper and tin when the copper wire and molten tin come in contact with each other. Generally, the alloy layer is formed of a tin-copper compound harder than tin and is excellent in abrasion resistance, but the ratio of the tin plating layer tends to be low.

  The inventors of the present invention conducted a study focusing on increasing the ratio of the alloy layer to the tin plating layer in order to improve the wear resistance of the tin plating layer. As a result, it has been found that it is preferable to add copper to molten tin and to make the copper concentration 80% or more of the saturation concentration with respect to the temperature.

  Specifically, when a copper wire is immersed in a molten tin, a reaction occurs in which a tin-copper compound is generated between the copper wire and the molten tin, and a reaction in which copper of the copper wire is eluted into the molten tin. In the case where copper is not added to the molten tin, the reaction of elution of copper is relatively easy to proceed, so the formation of the alloy layer is difficult to proceed. On the other hand, when copper is added to the molten tin, elution of copper is suppressed particularly when the copper concentration is equal to or higher than a predetermined value, and the formation of a tin-copper compound tends to proceed. As described above, by performing melt plating after setting the copper concentration in the molten tin to a predetermined value or more, the ratio of the alloy layer to the tin plating layer can be increased, and desired wear resistance can be realized in the tin plating layer. The present invention has been made based on such findings.

<One embodiment>
Hereinafter, an embodiment of the present invention will be described using the drawings. FIG. 1 is a cross-sectional view perpendicular to the longitudinal direction of a tin-plated copper wire according to an embodiment of the present invention. FIG. 2 is a schematic view schematically showing the structure of a tin plating layer. In addition, the numerical range represented using "-" in this specification means the range which includes the numerical value described before and after "-" as a lower limit and an upper limit.

(Tin-plated copper wire)
As shown in FIG. 1, the tin-plated copper wire 1 is configured to include a copper wire 11 containing copper and a tin-plated layer 12.

  As the copper wire 11 containing copper, for example, a wire made of tough pitch copper, oxygen-free copper or the like, or a wire made of a copper alloy can be used. The wire diameter of the copper wire 11 can be suitably changed according to a use, and it is good to be referred to as 0.08 mm-0.6 mm, for example from a viewpoint of flexibility.

  The copper wire 11 is preferably formed of the following copper alloy material from the viewpoint of flexibility. Specifically, in the copper alloy material, the concentration of titanium is 5 to 55 mass ppm, the concentration of sulfur is 3 to 12 mass ppm, the concentration of oxygen is 2 to 30 mass ppm, and the balance is copper and unavoidable impurities. Since this copper alloy material contains a small amount of Ti, it can be annealed by low temperature heating and has high extensibility.

A tin plating layer 12 is formed on the surface of the copper wire 11 by hot-dip plating. The tin plating layer 12 contains Cu ₆ Sn ₅ as a tin-copper compound formed between copper contained in the copper wire 11 and molten tin. In the present embodiment, the tin plating layer 12 is substantially constituted of an alloy layer containing a tin-copper compound by performing melt plating using molten tin in which the copper concentration is adjusted. In addition, being comprised substantially from an alloy layer is not limited to when comprised only from an alloy layer. For example, as shown in FIG. 2, the tin plating layer 12 has a laminated structure in which an alloy layer 12 a containing a tin-copper alloy and a tin layer 12 b containing tin are laminated in order from the copper wire 11 side. It also includes the case where the thickness is negligible with respect to the alloy layer 12a.

The tin plating layer 12 is substantially composed of a tin-copper compound, and when the X-ray diffraction pattern is measured by irradiating the surface with X-rays, the tin-copper compound constituting the tin plating layer 12 Of the integrated intensity I _A with respect to the sum of the integrated intensity I _A of the peak corresponding to the Miller index (101) plane and the integrated intensity I _{B of the} peak corresponding to the Miller index (111) surface of copper constituting the copper wire 11 The intensity ratio (I _A / (I _A + I _B ) × 100) is configured to be 15% or more.

  Here, calculation of the integral intensity ratio will be described.

The integrated intensity ratio is determined based on an X-ray diffraction pattern obtained by measuring the diffraction angle and the intensity of the diffracted X-rays detected by irradiating X-rays at an arbitrary position of the tin plating layer 12. Specifically, for example, an X-ray diffraction pattern as shown in FIG. 4 is obtained with an X-ray incident angle of 5 °, and the integrated intensity I _{A of the} peak corresponding to the Miller index (101) plane for the tin-copper compound , and integrated intensity I _B of a peak corresponding to Miller indices (111) plane were measured for copper can be calculated.

  By setting the integrated strength ratio to 15% or more, the tin plating layer 12 can be substantially constituted of a tin-copper compound, and desired wear resistance can be obtained. The larger the integrated strength ratio, the higher the wear resistance, but the thicker the tin plating layer 12 is, the lower the flexibility of the tin-plated copper wire 1 may be. Therefore, from the viewpoint of flexibility, the integrated intensity ratio is preferably 50% or less. The integrated strength ratio is more preferably 19% to 30% from the viewpoint of achieving a good balance between wear resistance and flexibility in the tin-plated copper wire 1.

  The thickness of the tin plating layer 12 is preferably large from the viewpoint of improving wear resistance, but is preferably thin from the viewpoint of flexibility of the tin-plated copper wire 1. From the viewpoint of obtaining appropriate flexibility while maintaining high wear resistance, the thickness is preferably 0.1 μm to 0.5 μm.

  The tin plating layer 12 is obtained by pressing a silicon probe provided on an atomic force microscope (AFM) with a diamond probe on the surface of the tin plating layer 12 with a load of 1 μN at a speed of 50 μm / sec. It is preferable to have abrasion resistance such that scratch marks are not formed when sliding back and forth 100 times. According to such a tin plating layer 12, even if, for example, the tin-plated copper wire 1 is rubbed or brought into contact with another member, the exposure of the copper wire 11 can be suppressed.

(Production method of tin plated copper wire)
Then, the manufacturing method of the tin plating copper wire 1 mentioned above is demonstrated using FIG. FIG. 3 is a schematic view for explaining a method of manufacturing a tin-plated copper wire according to an embodiment of the present invention.

  First, a molten tin 21 for forming the tin plating layer 12 is prepared. In the present embodiment, a predetermined amount of copper raw material is added to the plating tank 20 together with the tin raw material, these are melted by heating, and a tin molten metal 21 in which tin and copper are melted is prepared. The addition amount of the copper raw material is adjusted so that the copper concentration in the molten tin 21 becomes 80% or more of the saturation concentration of copper at the temperature of the molten tin 21.

  The saturation concentration of copper means the concentration at which copper is saturated and melted in tin (solid solution without precipitation) when tin and copper form a liquid phase (melt) in the equilibrium phase diagram of copper and tin. Show. For example, the saturation concentration of copper is 3.0% by mass at a melt temperature of 310 ° C., 5.5% by mass at 380 ° C., 6.8% by mass at 400 ° C., and 8.5% at 430 ° C. %, It becomes 10.0 mass% at 450 ° C.

  In the present embodiment, the addition amount of copper is adjusted so that the copper concentration is 80% or more of the saturation concentration according to the heating temperature of the molten tin 21. When the copper concentration in the molten metal 21 is less than 80% of the saturation concentration, when the copper wire 11 is immersed in the tin molten metal 21, elution of copper from the copper wire 11 relatively occurs rather than formation of a tin-copper alloy. As the tin-copper compound ratio decreases, the desired wear resistance can not be obtained. In this respect, by setting the copper concentration to 80% or more of the saturation concentration, the ratio of the tin-copper compound in the tin plating layer 12 can be increased to obtain high wear resistance.

  The copper contained in the tin molten metal 21 does not act to constitute the tin plating layer 12 itself, but is present in the molten metal 21 to suppress the elution of copper from the copper wire 11 and to be tin copper. Act to promote the formation of alloys.

  Further, a heater is attached to the plating tank 20, for example, so that the molten tin 21 can be heated, and the temperature of the molten metal 21 is maintained constant so that tin and copper can be held in a molten state. The temperature of the molten metal 21 is maintained, for example, at 250 ° C to 350 ° C.

  Subsequently, for example, a copper wire 11 having a wire diameter of 0.08 mm to 0.6 mm is prepared. By pulling out the copper wire 11, it travels at a predetermined linear velocity.

  Subsequently, the copper wire 11 is introduced into and immersed in the tin melt 21 to which copper is added to adjust the copper concentration, and after being immersed for a predetermined time, the copper wire 11 is pulled up from the tin melt 21.

  The molten tin 21 adheres to the surface of the copper wire 11 drawn from the plating tank 20. At this time, elution of copper from the copper wire 11 and formation of a tin-copper alloy occur between the copper wire 11 and the molten tin 21. In the present embodiment, by setting the copper concentration in the tin melt 21 to 80% or more of the saturation concentration, the formation of a tin-copper alloy is promoted more than the elution of copper from the copper wire 11.

  Subsequently, the copper wire 11 to which the molten tin 21 adheres is inserted into the die 30. The die 30 has a hole through which the copper wire 11 is inserted, and the hole diameter of the die 30 is set so as to remove an excess portion of the molten tin 21 adhering to the copper wire 11 and to adjust to a predetermined coating thickness. . The hole diameter may be appropriately changed in accordance with the thickness of the tin plating layer 12 and may be, for example, 10 μm to 50 μm larger than the outer diameter of the copper wire 11.

  The molten tin 21 attached to the surface of the copper wire 11 is cooled and gradually solidified to form a tin plating layer 12.

  Thus, the tin-plated copper wire 1 of the present embodiment is obtained. In the tin plating layer 12 of the tin plating copper wire 1, the ratio of the tin copper compound can be increased by promoting the formation of the tin copper compound, and the integrated intensity ratio of the peak corresponding to the tin copper compound is 15% or more It can be done.

(cable)
The tin-plated copper wire 1 described above can be used as a conductor of a cable. Specifically, a plurality of tin-plated copper wires 1 may be twisted to form a stranded wire, and an insulating layer may be provided on the outer periphery of the stranded wire to form a cable (for example, a robot cable).

  In addition, the number which twists the tin plating copper wire 1 is not specifically limited, According to the kind of cable, it can change suitably. Further, as the insulating layer, a conventionally known resin material can be used, and it may be appropriately selected according to the characteristics required for the cable.

<Effect of this embodiment>
According to this embodiment, one or more of the following effects can be obtained.

  According to the tin-plated copper wire 1 of the present embodiment, the tin-plated layer 12 is substantially constituted of the alloy layer 12 a containing a tin-copper compound, and in the X-ray diffraction pattern of the tin-plated layer 12, tin copper The integrated intensity ratio of the peak corresponding to the compound is 15% or more. Since the tin-copper compound is harder than tin, the wear resistance of the tin-plated layer 12 can be increased by configuring the tin-plated layer 12 so that the ratio of the tin-copper compound is high.

  In addition, since the tin plating layer 12 is excellent in wear resistance, peeling of the tin plating layer 12 occurs even if the tin plated copper wires 1 are twisted together or come into contact with other members in the process of twisting. Since the exposure of the copper wire 11 can be suppressed, the reliability of the cable can be improved.

  Moreover, it is preferable that the thickness of the tin plating layer 12 is 0.1 micrometer-0.5 micrometer. In the tin plating layer 12, since the ratio of the hard tin-copper compound is increased, desired wear resistance can be obtained while forming the tin plating layer 12 as thin as 0.1 μm to 0.5 μm or less. In addition, by forming the tin plating layer 12 thin, flexibility of the tin plating copper wire 1 can be maintained high.

  The tin plating layer 12 is 100 reciprocating slides at a speed of 50 μm / sec in a state in which a silicon probe provided on an atomic force microscope is diamond-coated with a silicon probe and pressed against the surface of the tin plating layer with a load of 1 μN. It is preferable to have abrasion resistance such that scratch marks are not formed when moved. By having wear resistance such that the scratch marks do not get deeper, the exposure of the copper wire 11 can be further suppressed and the reliability of the cable can be further improved.

  In this embodiment, in order to form the tin plating layer 12, tin and copper melt, and the tin molten metal 21 whose copper concentration is 80% or more of the saturation concentration of copper at the temperature of the tin molten metal 21 is used. According to such a tin molten metal 21, the formation of the tin-copper alloy can be promoted rather than the elution of copper when the copper wire 11 is immersed, so the ratio of the tin-copper compound in the tin plating layer 12 formed by solidification Can be enhanced. Then, by configuring the tin plating layer 12 so that the integrated intensity ratio of the peak corresponding to the tin-copper compound is 15% or more, high wear resistance can be obtained.

  Further, in the tin-plated copper wire 1 according to this embodiment, the tin-plated copper wire 1 may be rubbed even when the wire or cable in which the tin-plated copper wire 1 is used is repeatedly bent. Since 12 is hard to wear, it can control that copper wire 11 is exposed.

  As mentioned above, although one Embodiment of this invention was described concretely, this invention is not limited to the above-mentioned embodiment, It can change suitably in the range which does not deviate from the summary.

  Next, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.

Example 1
In this example, a tin-plated copper wire was produced, and the wear resistance of the tin-plated layer was evaluated.

  First, a molten metal for forming a tin plating layer was prepared. In this example, the copper raw material and the tin raw material were melted by heating to prepare a molten metal whose copper concentration is 80% of the saturation concentration (saturation concentration ratio). Specifically, the temperature of the tin melt is set to 310 ° C., and the saturation concentration of copper at that temperature is 3.0% by mass, so that the copper concentration in the tin melt is 2.4% by mass. Was added. Subsequently, a copper wire having a wire diameter of 0.45 mm was introduced into and immersed in a molten tin whose copper concentration was adjusted. Thereafter, the copper wire was pulled up and inserted into a die to remove excess tin melt. Thereafter, the molten tin was solidified by cooling to form a tin plating layer. Thus, a tin-plated copper wire of Example 1 was produced.

  About the produced tin plating copper wire, the X-ray-diffraction measurement of the tin plating layer was performed. As a result, an X-ray diffraction pattern as shown in FIG. 4 was obtained. According to FIG. 4, it was confirmed that the integrated intensity ratio of the peak corresponding to the Miller index (101) plane of the tin-copper compound is 19% and is 15% or more.

  In addition, the thickness of the tin plating layer was measured by an electrolytic dissolution method. Specifically, when measured using an electrolytic film thickness meter, it was confirmed that the thickness of the tin plating layer was 0.30 μm.

  Moreover, the grade of formation of the tin-copper compound was confirmed in the tin plating layer. Specifically, the tin plating layer was subjected to etching (hydrochlorination treatment) to remove the tin layer on the surface of the tin plating layer to expose the tin-copper compound, and the surface was observed with an electron microscope. As a result, as shown in FIG. 5, it was confirmed that a tin-copper compound was formed on the surface of the copper wire. Moreover, no exposure of the copper wire was confirmed, and it was confirmed that a tin-copper compound was formed to cover the surface of the copper wire.

  Further, with respect to the tin-plated copper wire of Example 1, the wear resistance of the tin-plated layer was measured by the following method. Specifically, the probe provided on the atomic force microscope is pressed against the surface of the tin plating layer with a load of 1 μN, and after sliding the probe 100 reciprocates in that state, the surface of the tin plating layer is observed And confirmed the presence of scratch marks. In Example 1, even when the probe was scratched, almost no appearance of rubbing on the surface of the tin plating layer was observed. From this, it was confirmed that the tin-plated copper wire of Example 1 had wear resistance to such an extent that the tin-plated layer did not peel off at the time of twisting.

  The adjustment conditions (temperature and copper concentration) of the tin melt, the configuration of the tin plating layer, and the evaluation results are summarized in Table 1 below.

(Example 2, Comparative Example 1)
In Example 2 and Comparative Example 1, a tin-plated copper wire was produced and evaluated in the same manner as in Example 1 except that the adjustment conditions of the molten tin were appropriately changed as shown in Table 1.

  In Example 2, it was confirmed that the integral intensity ratio of the tin-copper compound in the tin plating layer can be 24% by setting the copper concentration in the tin molten metal to 96% of the saturation concentration. That is, in Example 2, it was confirmed that the ratio of the tin-copper compound is higher than 19% of Example 1. When the surface of the tin-copper compound was observed, as shown in FIG. 6, it was confirmed that the tin-copper compound was covering without exposing the copper wire. Also, no scratch marks were observed as in Example 1.

  On the other hand, in Comparative Example 1, it was confirmed that the formation of the tin-copper compound did not proceed because the copper concentration in the molten tin was set to 65% and was set to less than 80% of the saturation concentration. Specifically, when the tin plating layer of the tin plated copper wire of Comparative Example 1 was etched and the surface was observed, as shown in FIG. 7, the copper wire was exposed, and most of the tin copper compound was formed. It was not confirmed. Moreover, it was confirmed that the integrated intensity ratio of the tin-copper compound is 1% and less than 15%. From this, it was confirmed that the formation of the tin-copper compound did not proceed in the tin plating layer of Comparative Example 1, and the tin plating layer was mainly formed of the tin layer. In such a tin-plated copper wire of Comparative Example 1, scratch marks were clearly recognized, and it was confirmed that the desired abrasion resistance was not obtained.

  As described above, it was confirmed that by setting the copper concentration in the molten metal to a predetermined value or more, the ratio of the tin-copper compound in the tin plating layer can be increased, and the wear resistance can be improved.

<Preferred embodiment of the present invention>
The preferred embodiments of the present invention will be additionally described below.

[Supplementary Note 1]
According to one aspect of the invention:
Copper wire containing copper,
And a tin plating layer formed on the outer periphery of the copper wire and containing Cu ₆ Sn ₅ as a tin-copper compound,
In X-ray diffraction pattern measured by irradiating X-rays to the tin-plated layer, and the integrated intensity I _A of the peak corresponding to Miller indices (101) plane of the tin-copper compound constituting the tin plating layer integrated intensity ratio of the integrated intensity I _a to the sum of the integrated intensity I _B of a peak corresponding to Miller indices (111) plane of the copper constituting the copper wire is 15% or more,
A tin plated copper wire is provided.

[Supplementary Note 2]
In the tin-plated copper wire of Appendix 1, preferably
The integrated intensity ratio is 50% or less.

[Supplementary Note 3]
Preferably, in the tin-plated copper wire of Appendix 1 or 2,
The integrated intensity ratio is 19% or more and 30% or less.

[Supplementary Note 4]
In the tin-plated copper wire according to any one of appendices 1 to 3, preferably
The thickness of the tin plating layer is 0.1 μm or more and 0.5 μm or less.

[Supplementary Note 5]
According to another aspect of the invention,
Adding copper to the molten tin, and adjusting the concentration of copper in the molten tin to be 80% or more of the saturation concentration of copper at the temperature of the molten tin;
Forming a tin plating layer containing Cu ₆ Sn ₅ as a tin-copper compound on the surface of the copper wire by immersing and pulling up a copper wire containing copper in the molten tin in which the copper concentration is adjusted; And
In X-ray diffraction pattern measured by irradiating X-rays to the tin-plated layer, and the integrated intensity I _A of the peak corresponding to Miller indices (101) plane of the tin-copper compound constituting the tin plating layer integrated intensity ratio of the integrated intensity I _a to the sum of the integrated intensity I _B of a peak corresponding to Miller indices (111) plane of the copper constituting the copper wire is 15% or more,
A method of making a tin plated copper wire is provided.

[Supplementary Note 6]
According to yet another aspect of the invention,
An insulated wire comprising: a conductor comprising a stranded wire obtained by twisting a plurality of tin-plated copper wires; and an insulating layer covering the conductor,
The tin-plated copper wire is
Copper wire containing copper,
And a tin plating layer formed on the outer periphery of the copper wire and containing Cu ₆ Sn ₅ as a tin-copper compound,
In X-ray diffraction pattern measured by irradiating X-rays to the tin-plated layer, and the integrated intensity I _A of the peak corresponding to Miller indices (101) plane of the tin-copper compound constituting the tin plating layer integrated intensity ratio of the integrated intensity I _a to the sum of the integrated intensity I _B of a peak corresponding to Miller indices (111) plane of the copper constituting the copper wire is 15% or more,
An insulated wire is provided.

[Supplementary Note 7]
According to yet another aspect of the invention,
What is claimed is: 1. A cable comprising: a conductor comprising a stranded wire obtained by twisting a plurality of tin-plated copper wires;
The tin-plated copper wire is
Copper wire containing copper,
And a tin plating layer formed on the outer periphery of the copper wire and containing Cu ₆ Sn ₅ as a tin-copper compound,
In X-ray diffraction pattern measured by irradiating X-rays to the tin-plated layer, and the integrated intensity I _A of the peak corresponding to Miller indices (101) plane of the tin-copper compound constituting the tin plating layer integrated intensity ratio of the integrated intensity I _a to the sum of the integrated intensity I _B of a peak corresponding to Miller indices (111) plane of the copper constituting the copper wire is 15% or more,
A cable is provided.

1 Tin-plated copper wire 11 conductor (copper wire)
12 tin plating layer 12a alloy layer 12b tin layer

Claims (5)

Copper wire containing copper,
An alloy layer formed on the outer periphery of the copper wire, composed of a tin-copper compound composed of Cu ₆ Sn ₅ and covering the surface of the copper wire, and a tin layer composed of tin are laminated in order from the copper wire side With a tin-plated layer,
In X-ray diffraction pattern measured by irradiating X-rays to the tin-plated layer, and the integrated intensity I _A of the peak corresponding to Miller indices (101) plane of the tin-copper compound constituting the tin plating layer the integrated intensity ratio of the integrated intensity I _a to the sum of the integrated intensity I _B of a peak corresponding to Miller indices (111) plane of the copper composing the copper wire is 24% or less 19% or more,
Tin plated copper wire. The thickness of the tin plating layer is 0.1 μm to 0.5 μm.
The tin-plated copper wire according to claim 1 . Copper is added to the tin melt, and the copper concentration in the tin melt is from 2.4% by mass to 2.9% by mass so as to be 80% to 96% of the saturation concentration of copper at the temperature of the tin melt. Adjusting process,
By immersing and pulling up a copper wire containing copper in the molten tin in which the copper concentration is adjusted , an alloy layer composed of a tin-copper compound composed of Cu ₆ Sn ₅ and covering the surface of the copper wire, and composed of tin Forming on the surface of the copper wire a tin plating layer in which the tin layer to be mixed is sequentially laminated from the copper wire side ,
In X-ray diffraction pattern measured by irradiating X-rays to the tin-plated layer, and the integrated intensity I _A of the peak corresponding to Miller indices (101) plane of the tin-copper compound constituting the tin plating layer the integrated intensity ratio of the integrated intensity I _a to the sum of the integrated intensity I _B of a peak corresponding to Miller indices (111) plane of the copper composing the copper wire is 24% or less 19% or more,
Method of manufacturing tin-plated copper wire. An insulated wire comprising: a conductor comprising a stranded wire obtained by twisting a plurality of tin-plated copper wires; and an insulating layer covering the conductor,
The tin-plated copper wire is
Copper wire containing copper,
An alloy layer formed on the outer periphery of the copper wire, composed of a tin-copper compound composed of Cu ₆ Sn ₅ and covering the surface of the copper wire, and a tin layer composed of tin are laminated in order from the copper wire side With a tin-plated layer,
In X-ray diffraction pattern measured by irradiating X-rays to the tin-plated layer, and the integrated intensity I _A of the peak corresponding to Miller indices (101) plane of the tin-copper compound constituting the tin plating layer the integrated intensity ratio of the integrated intensity I _a to the sum of the integrated intensity I _B of a peak corresponding to Miller indices (111) plane of the copper composing the copper wire is 24% or less 19% or more,
Insulated wire. What is claimed is: 1. A cable comprising: a conductor comprising a stranded wire obtained by twisting a plurality of tin-plated copper wires;
The tin-plated copper wire is
Copper wire containing copper,
An alloy layer formed on the outer periphery of the copper wire, composed of a tin-copper compound composed of Cu ₆ Sn ₅ and covering the surface of the copper wire, and a tin layer composed of tin are laminated in order from the copper wire side With a tin-plated layer,
In X-ray diffraction pattern measured by irradiating X-rays to the tin-plated layer, and the integrated intensity I _A of the peak corresponding to Miller indices (101) plane of the tin-copper compound constituting the tin plating layer the integrated intensity ratio of the integrated intensity I _a to the sum of the integrated intensity I _B of a peak corresponding to Miller indices (111) plane of the copper composing the copper wire is 24% or less 19% or more,
cable.