JP2003086024A - Sn PLATING FLAT CONDUCTOR AND FLAT CABLE USING THE SAME - Google Patents
Sn PLATING FLAT CONDUCTOR AND FLAT CABLE USING THE SAMEInfo
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- JP2003086024A JP2003086024A JP2001278322A JP2001278322A JP2003086024A JP 2003086024 A JP2003086024 A JP 2003086024A JP 2001278322 A JP2001278322 A JP 2001278322A JP 2001278322 A JP2001278322 A JP 2001278322A JP 2003086024 A JP2003086024 A JP 2003086024A
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フレキシブル・フ
ラット・ケーブルなどの電子機器用のケーブルの導体と
して使用されるＳｎ系めっき平角導体およびそれを用い
たフラットケーブルに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Sn-plated flat rectangular conductor used as a conductor of a cable for electronic equipment such as a flexible flat cable and a flat cable using the same.
【０００２】[0002]
【従来の技術】Ｓｎ系めっき平角導体の断面図を図２
に、Ｓｎ系めっき平角導体を用いたフレキシブル・フラ
ット・ケーブルの断面図を図３に示す。2. Description of the Related Art A cross-sectional view of a Sn-plated rectangular conductor is shown in FIG.
Fig. 3 shows a sectional view of a flexible flat cable using a Sn-plated rectangular conductor.
【０００３】従来、フレキシブル・フラット・ケーブル
１２に使用される導体線には、テープ状のＳｎ系めっき
平角導体９が使用されている。Ｓｎ系めっき平角導体９
を構成している導体７のサイズは、その断面の厚さ
（ｔ）が０．０２〜０．０１mm、幅（ｗ）が０．３〜
１．５mm程度のものが主に使用されている。また、導体
７には無酸素銅やタフピッチ銅が用いられ、製造工程の
中間で導体７にＳｎ系めっき層８が施され、最終工程で
圧延・焼鈍されて製品となる。その後、ＰＥＴ（ポリエ
チレンテレフタレート）などの絶縁体からなるプラスチ
ックフィルム１０ａ、１０ｂを接着剤１１を介してラミ
ネートして、フレキシブル・フラット・ケーブル１２が
製造される。Conventionally, a tape-shaped Sn-plated flat rectangular conductor 9 has been used for the conductor wire used in the flexible flat cable 12. Sn-based plated rectangular conductor 9
As for the size of the conductor 7 which constitutes, the cross-section has a thickness (t) of 0.02 to 0.01 mm and a width (w) of 0.3 to.
The thing of about 1.5 mm is mainly used. Oxygen-free copper or tough pitch copper is used for the conductor 7, and the Sn-based plating layer 8 is applied to the conductor 7 in the middle of the manufacturing process, and the product is rolled and annealed in the final process. After that, the plastic films 10a and 10b made of an insulating material such as PET (polyethylene terephthalate) are laminated via the adhesive 11 to manufacture the flexible flat cable 12.
【０００４】[0004]
【発明が解決しようとする課題】従来、Ｓｎ系めっき平
角導体９を用いたフレキシブル・フラット・ケーブル１
２は、耐屈曲ケーブルとして使用されることが多いた
め、Ｓｎ系めっき平角導体９には耐屈曲特性が要求され
る。また、コネクタと接続されるためにＳｎ系めっき平
角導体９とコネクタ端子との接合性、また、耐磨耗性が
必要である。さらに、Ｓｎ系めっき平角導体９が他のリ
ードとはんだ付される場合があるので、はんだ付性も要
求される。したがって、上記の各種特性が両立できるＳ
ｎ系めっき平角導体９が必要である。Conventionally, a flexible flat cable 1 using a Sn-plated flat rectangular conductor 9 is used.
Since No. 2 is often used as a bending resistant cable, the Sn-based plated rectangular conductor 9 is required to have bending resistance. Further, in order to be connected to the connector, the Sn-based plated rectangular conductor 9 and the connector terminal are required to have bondability and abrasion resistance. Further, since the Sn-based plated rectangular conductor 9 may be soldered to other leads, solderability is also required. Therefore, S that can achieve the above various characteristics at the same time
The n-type plated rectangular conductor 9 is required.
【０００５】本発明の目的は、耐屈曲性、コネクタ接合
性、耐磨耗性およびはんだ付性に優れたＳｎ系めっき平
角導体およびそれを用いたフラットケーブルを提供する
ことにある。An object of the present invention is to provide a Sn-plated flat rectangular conductor excellent in bending resistance, connector joining property, abrasion resistance and solderability, and a flat cable using the same.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するため
に、本発明のＳｎ系めっき平角導体は、厚さ０．１mm以
下、幅１．５mm以下の矩形状断面を有する導体の表面全
体に厚さ０．０５μｍ以上のＳｎ系めっき層を設けたこ
とにある。In order to solve the above-mentioned problems, the Sn-plated rectangular conductor of the present invention has an entire surface of a conductor having a rectangular cross section with a thickness of 0.1 mm or less and a width of 1.5 mm or less. This is because an Sn-based plating layer having a thickness of 0.05 μm or more was provided.
【０００７】前記Ｓｎ系めっき層は、純Ｓｎ系めっき部
分の層と当該純Ｓｎ系めっき部分の層と前記導体の間に
形成される金属間化合物層から成り、前記純Ｓｎ系めっ
き部分の層の厚さＶ１と、前記金属間化合物層の厚さＶ
２の比が、以下の（１）式を満足するように構成するの
が好ましい。The Sn-based plating layer comprises a layer of a pure Sn-based plating portion, an intermetallic compound layer formed between the layer of the pure Sn-based plating portion and the conductor, and a layer of the pure Sn-based plating portion. V1 and the thickness V of the intermetallic compound layer
It is preferable that the ratio of 2 satisfies the following expression (1).
【０００８】２＜Ｖ１／Ｖ２＜２０ （１）
また、上記Ｓｎ系めっき平角導体を１本配置または複数
本並列配置し、絶縁性のプラスチックフィルムでラミネ
ートしてフラットケーブルが形成される。2 <V1 / V2 <20 (1) Further, one or a plurality of the Sn-plated rectangular flat conductors are arranged in parallel and laminated with an insulating plastic film to form a flat cable.
【０００９】[0009]
【発明の実施の形態】以下、本発明の好適一実施の形態
を添付図面に基づいて説明する。図１は、本発明のＳｎ
系めっき平角導体の部分断面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows the Sn of the present invention.
It is a fragmentary sectional view of a system plating rectangular conductor.
【００１０】１は、銅または銅合金からなる導体であ
り、平角導体を構成している部分である。２は、平角導
体（導体１）の表面全体に均一に施したＳｎ系めっき層
である。Reference numeral 1 denotes a conductor made of copper or a copper alloy, which is a portion forming a rectangular conductor. Reference numeral 2 is a Sn-based plating layer uniformly applied to the entire surface of the rectangular conductor (conductor 1).
【００１１】Ｓｎ系めっき層２の厚さは、０．０５μｍ
以上とした。Ｓｎ系めっき層２の厚さを０．０５μｍ以
上としたのは、銅または銅合金からなる導体１にＳｎ系
めっきを施した場合、導体１とＳｎ系めっき層２の接触
面において銅（Ｃｕ）と錫（Ｓｎ）が反応して、Ｃｕ3
ＳｎやＣｕ6Ｓｎ5の金属間化合物層４を形成する。Ｓｎ
系めっき層２の厚さが０．０５μｍよりも少ないとＳｎ
系めっき層２自体全てが、金属間化合物層になる。金属
間化合物（Ｃｕ3Ｓｎ、Ｃｕ6Ｓｎ5等）は、硬く脆く、
且つはんだ濡れ性が悪いという特徴があるため、Ｓｎ系
めっき層自体が金属間化合物になると、Ｓｎ系めっき平
角導体の機械的特性（例えば屈曲特性）が低下し、さら
に各種電子部品とのはんだ付時に不具合が生じてしま
う。したがって、Ｓｎ系めっき層２の厚さは、０．０５
μｍ以上、好ましくは０．５μｍ以上にするのがよい。The thickness of the Sn-based plating layer 2 is 0.05 μm.
That's it. The thickness of the Sn-based plating layer 2 is set to 0.05 μm or more because when the Sn-based plating is applied to the conductor 1 made of copper or copper alloy, copper (Cu) is formed on the contact surface between the conductor 1 and the Sn-based plating layer 2. ) And tin (Sn) react to form Cu 3
An intermetallic compound layer 4 of Sn or Cu 6 Sn 5 is formed. Sn
If the thickness of the system plating layer 2 is less than 0.05 μm, Sn
The entire system plating layer 2 itself becomes an intermetallic compound layer. Intermetallic compounds (Cu 3 Sn, Cu 6 Sn 5, etc.) are hard and brittle,
In addition, because the solder wettability is poor, if the Sn-based plating layer itself becomes an intermetallic compound, the mechanical properties (for example, bending properties) of the Sn-based flat rectangular conductor will deteriorate, and soldering with various electronic components will also occur. Sometimes problems occur. Therefore, the thickness of the Sn-based plating layer 2 is 0.05
The thickness is preferably at least μm, more preferably at least 0.5 μm.
【００１２】さらに、以下に示すめっき構造を有するＳ
ｎ系めっき平角導体であれば、耐屈曲性、コネクタ接合
性、耐磨耗性およびはんだ付性の各種特性に優れている
ことを見出した。Further, S having the following plating structure
It has been found that the n-type plated rectangular conductor is excellent in various characteristics such as bending resistance, connector bondability, abrasion resistance and solderability.
【００１３】Ｓｎ系めっき平角導体の製造工程におい
て、最終工程の焼鈍条件を調整することにより、Ｓｎ系
めっき層２中の純Ｓｎ系めっき部分の層３の厚さＶ１と
金属間化合物（Ｃｕ3Ｓｎ、Ｃｕ6Ｓｎ5等）層４の厚さ
Ｖ２を制御し、それらの厚さの比が以下の（１）式で規
定される構成にする（すなわち、純Ｓｎ系めっき部分の
層３の体積量と金属間化合物層４の体積量の比を規定し
たのと略同じである）。これによって、耐屈曲性、コネ
クタとの接合性、耐磨耗性、はんだ付性を兼ね備えるこ
とができる。In the manufacturing process of the Sn-plated rectangular conductor, the thickness V1 of the layer 3 of the pure Sn-plated portion in the Sn-plated layer 2 and the intermetallic compound (Cu 3 Sn, Cu 6 Sn 5, etc.) The thickness V2 of the layer 4 is controlled so that the ratio of the thicknesses thereof is defined by the following formula (1) (that is, the layer 3 of the pure Sn-based plated portion is It is substantially the same as defining the ratio of the volume amount to the volume amount of the intermetallic compound layer 4). As a result, it is possible to have bending resistance, connector bondability, abrasion resistance, and solderability.
【００１４】２＜Ｖ１／Ｖ２＜２０ （１）
Ｓｎ系めっき層２中の純Ｓｎ系めっき部分の層３の厚さ
Ｖ１と、金属間化合物層４の厚さＶ２の比を上記（１）
式で規定される構成にする理由は以下のとおりである。2 <V1 / V2 <20 (1) The ratio of the thickness V1 of the layer 3 of the pure Sn-based plating portion in the Sn-based plating layer 2 to the thickness V2 of the intermetallic compound layer 4 is the above (1).
The reason why the structure is defined by the formula is as follows.
【００１５】まず、Ｖ１／Ｖ２を２より大きくしなけれ
ばいけない理由は、これ以下であるとＳｎ系めっき層２
中に占める金属間化合物の割合が大きくなるため、Ｓｎ
系めっき層２の延性が低下し、屈曲寿命の低下が著しく
なるためである。また、はんだ濡れ性も著しく悪くなり
好ましくない。また、コネクタ端子との接続は、金属端
子が平角導体のＳｎ系めっき層２に食い込んで、十分な
接触がなされるが、金属間化合物が多く形成するとＳｎ
系めっき層２が硬化し、金属端子のＳｎ系めっき層２へ
の食い込みが不十分となる。好ましくは、Ｖ１／Ｖ２の
比を３以上にするのがよい。一方、Ｖ１／Ｖ２の比を２
０以下にする理由は、それ以上であると耐屈曲性、コネ
クタ接合性、はんだ濡れ性は、満足できるが、Ｓｎ系め
っき層が極めて軟質化するため耐磨耗性が優れなくなり
不具合が生じる。好ましくは、Ｖ１／Ｖ２の比は１０以
下がよい。First, the reason why V1 / V2 must be made larger than 2 is that the Sn-based plating layer 2 is
Since the proportion of the intermetallic compound in the inside becomes large, Sn
This is because the ductility of the system plating layer 2 is reduced and the flexing life is significantly reduced. Further, the solder wettability is remarkably deteriorated, which is not preferable. Further, in connection with the connector terminal, the metal terminal digs into the Sn-based plating layer 2 of the rectangular conductor to make sufficient contact, but if a large amount of intermetallic compound is formed, Sn is formed.
The system plating layer 2 hardens, and the bite of the metal terminal into the Sn system plating layer 2 becomes insufficient. Preferably, the ratio of V1 / V2 is 3 or more. On the other hand, the ratio of V1 / V2 is 2
The reason for setting it to 0 or less is that if it is more than that, the flex resistance, connector bondability, and solder wettability are satisfactory, but the Sn-based plating layer becomes extremely soft, and the abrasion resistance becomes poor, causing a problem. Preferably, the V1 / V2 ratio is 10 or less.
【００１６】本発明で用いられるめっきの材質は、Ｓｎ
−Ｐｂはんだめっきばかりでなく、鉛フリーはんだめっ
き、例えば、Ｓｎめっき、Ｓｎ−Ａｇめっきなどを含む
ことは言うまでもない。The plating material used in the present invention is Sn
It goes without saying that not only -Pb solder plating but also lead-free solder plating, such as Sn plating and Sn-Ag plating, is included.
【００１７】上記本発明のＳｎ系めっき平角導体を用い
たフラットケーブルの例としては、図３に示すようなフ
レキシブル・フラット・ケーブルがある。An example of a flat cable using the Sn-plated rectangular conductor of the present invention is a flexible flat cable as shown in FIG.
【００１８】Ｓｎ系めっき平角導体９として上記本発明
によるものを用い、それを１本配置または複数本並列配
置し、片面に接着剤１１が備えられた絶縁性のプラスチ
ックフィルム１０ａ、１０ｂで上下から挟み込んでラミ
ネートして形成される。The Sn-based plated rectangular conductor 9 according to the present invention is used, and one or a plurality of Sn-plated rectangular conductors are arranged in parallel, and insulating plastic films 10a and 10b having an adhesive 11 on one surface are used from above and below. It is formed by sandwiching and laminating.
【００１９】[0019]
【実施例】（試料No.１〜５）導体１のサイズが、厚さ
０．０３５mm、幅０．３０mmからなる以下に示す５種類
のＳｎ系めっき平角導体を試作した。なお、めっきの材
質はＳｎを用いた。最終工程の焼鈍において各Ｓｎ系め
っき平角導体毎に焼鈍温度を変えて、純Ｓｎ系めっき部
分の層３の厚さＶ１と、金属間化合物（Ｃｕ3Ｓｎ、Ｃ
ｕ6Ｓｎ5等）層４の厚さＶ２の比Ｖ１／Ｖ２が１１．
０、７．２、４．３、３．０、２．８であるＳｎ系めっ
き平角導体をそれぞれ試作した。上記厚さ比Ｖ１／Ｖ２
は、Ｓｎ系めっき平角導体の断面を電子顕微鏡（ＳＥ
Ｍ）で観察し、ライン分析を実施するとともにＳｎ系め
っき平角導体の表面を薄膜Ｘ線回折し、両者の結果を総
合して評価した。上記５種類のＳｎ系めっき平角導体毎
に、Ｓｎ系めっき平角導体を厚さ２５μｍのＰＥＴ（ポ
リエチレンテレフタレート）でラミネートし５種類の試
料No.１〜５からなるフレキシブル・フラット・ケーブ
ルを製造した。得られたフレキシブル・フラット・ケー
ブルの屈曲特性、Ｓｎ系めっき平角導体とコネクタとの
接合性、耐磨耗性、はんだ濡れ性を評価した。Example (Sample Nos. 1 to 5) The following five types of Sn-based plated rectangular conductors having the thickness of the conductor 1 of 0.035 mm and the width of 0.30 mm were experimentally manufactured. The plating material was Sn. In the final step of annealing, the annealing temperature is changed for each Sn-based plated rectangular conductor, and the thickness V1 of the layer 3 of the pure Sn-based plated portion and the intermetallic compound (Cu 3 Sn, C
The ratio of the thickness V2 of u 6 Sn 5 or the like) layer 4 V1 / V2 is 11.
Sn-plated rectangular conductors having a thickness of 0, 7.2, 4.3, 3.0, 2.8 were manufactured as prototypes. Above thickness ratio V1 / V2
Shows an electron microscope (SE
M), line analysis was performed, and the surface of the Sn-based plated rectangular conductor was subjected to thin film X-ray diffraction, and the results of both were comprehensively evaluated. For each of the above-mentioned 5 types of Sn-plated flat rectangular conductors, a Sn-plated flat rectangular conductor was laminated with PET (polyethylene terephthalate) having a thickness of 25 μm to manufacture flexible flat cables consisting of 5 types of sample Nos. 1 to 5. The bending characteristics of the obtained flexible flat cable, the bondability between the Sn-based plated rectangular conductor and the connector, the abrasion resistance, and the solder wettability were evaluated.
【００２０】屈曲特性は、摺動試験装置を用いて、曲げ
半径３．５mm、屈曲試験速度１，５００回／分、ストロ
ーク２５mmの条件で実施した。また、コネクタとの接合
性は、コネクタとのＳｎ系めっき平角導体を接続後、熱
衝撃試験（−５５℃×３０分／２５℃×５分／８５℃×
３０分／２５℃×５を１００サイクル）を実施し、試験
前後での接触抵抗増加率で評価した。また、耐磨耗性
は、コネクタにＳｎ系めっき平角導体を差し込んで取り
はずす作業を50回繰り返し、めっき表面からのめっきカ
スの発生量で評価した。はんだ濡れ性は、メニスコグラ
フ法を用いた。（試料No.６〜８）導体のサイズが、厚
さ０．０３５mm、幅０．３０mmからなる以下に示す３種
類のＳｎ系めっき平角導体を試作した。なお、めっきの
材質はＳｎを用いた。最終工程の焼鈍において各Ｓｎ系
めっき平角導体毎に焼鈍温度を変えて、純Ｓｎ系めっき
部分の層の厚さＶ１と、金属間化合物（Ｃｕ3Ｓｎ、Ｃ
ｕ6Ｓｎ5等）層の厚さＶ２の比Ｖ１／Ｖ２が２２．５、
２．０、１．３であるＳｎ系めっき平角導体をそれぞれ
試作した。また、それら３種類のＳｎ系めっき平角導体
毎に、Ｓｎ系めっき平角導体を厚さ２５μｍのＰＥＴ
（ポリエチレンテレフタレート）でラミネートし３種類
の試料No.６〜８からなるフレキシブル・フラット・ケ
ーブルを製造した。得られたフレキシブル・フラット・
ケーブルの屈曲特性、Ｓｎ系めっき平角導体とコネクタ
との接合性、耐磨耗性、はんだ濡れ性を評価した。評価
方法に関しては、前述の通りである。The bending characteristics were measured by using a sliding tester under the conditions of a bending radius of 3.5 mm, a bending test speed of 1,500 times / min, and a stroke of 25 mm. In addition, the bondability with the connector is determined by a thermal shock test (−55 ° C. × 30 minutes / 25 ° C. × 5 minutes / 85 ° C. ×) after connecting the Sn-plated rectangular conductor with the connector.
30 minutes / 25 ° C. × 5 for 100 cycles) was performed, and the contact resistance increase rate before and after the test was evaluated. The abrasion resistance was evaluated by inserting the Sn-based plated rectangular conductor into the connector and removing the same 50 times, and the amount of plating residue generated from the plated surface was evaluated. For solder wettability, a meniscograph method was used. (Sample Nos. 6 to 8) The following three types of Sn-plated rectangular conductors having a thickness of 0.035 mm and a width of 0.30 mm were trial-produced. The plating material was Sn. In the annealing in the final step, the annealing temperature is changed for each Sn-plated rectangular conductor, the layer thickness V1 of the pure Sn-plated portion and the intermetallic compound (Cu 3 Sn, C
u 6 Sn 5 etc.) ratio V1 / V2 of layer thickness V2 is 22.5,
Prototypes of Sn-plated flat rectangular conductors of 2.0 and 1.3 were produced. In addition, for each of these three types of Sn-plated flat rectangular conductors, a Sn-plated flat rectangular conductor with a thickness of 25 μm PET
Laminated with (polyethylene terephthalate) to produce flexible flat cables consisting of three types of sample Nos. 6 to 8. The resulting flexible flat
The bending characteristics of the cable, the bondability between the Sn-plated rectangular conductor and the connector, the abrasion resistance, and the solder wettability were evaluated. The evaluation method is as described above.
【００２１】試料No.１〜８のフレキシブル・フラット
・ケーブルの各種特性の評価結果を表１に示す。表１に
示したとおり、本発明による試料No.１〜５のフレキシ
ブル・フラット・ケーブルは、いずれの特性においても
良好な特性を有することがわかる。また、比較例である
試料No.６〜８のフレキシブル・フラット・ケーブルに
おいては、その何れかの特性に不具合が生じていること
がわかる。Table 1 shows the evaluation results of various characteristics of the flexible flat cables of Sample Nos. 1 to 8. As shown in Table 1, it is understood that the flexible flat cables of Sample Nos. 1 to 5 according to the present invention have good characteristics in all characteristics. Further, it is understood that in the flexible flat cables of sample Nos. 6 to 8 which are comparative examples, any one of the characteristics has a defect.
【００２２】[0022]
【表１】 [Table 1]
【００２３】[0023]
【発明の効果】以上の要するに、本発明によれば、フラ
ットケーブ用導体に要求される耐屈曲性、コネクタ接合
性、耐磨耗性、はんだ付性などの各種特性を満足できる
Ｓｎ系めっき平角導体およびそれを用いたフラットケー
ブルが得られる。In summary, according to the present invention, the Sn-plated rectangular flat plate which can satisfy various characteristics such as bending resistance, connector bondability, wear resistance, and solderability required for the conductor for flat cave. A conductor and a flat cable using the conductor are obtained.
【図１】本発明のＳｎ系めっき平角導体の部分断面図で
ある。FIG. 1 is a partial cross-sectional view of a Sn-based plated rectangular conductor of the present invention.
【図２】Ｓｎ系めっき平角導体の断面図である。FIG. 2 is a cross-sectional view of a Sn-based plated rectangular conductor.
【図３】Ｓｎ系めっき平角導体を用いたフレキシブル・
フラット・ケーブルの断面図である。[Fig. 3] Flexible using Sn-based flat rectangular conductor
It is sectional drawing of a flat cable.
１ 導体 ２ Ｓｎ系めっき層 ３ 純Ｓｎ系めっき部分の層 ４ 金属間化合物層 ７ 導体 ８ Ｓｎ系めっき層 ９ Ｓｎ系めっき平角導体 １０ａ、１０ｂ プラスチックフィルム １１ 接着剤 １２ フレキシブル・フラット・ケーブル 1 conductor 2 Sn-based plating layer 3 Layer of pure Sn-based plating 4 Intermetallic compound layer 7 conductor 8 Sn-based plating layer 9 Sn-based flat rectangular conductor 10a, 10b Plastic film 11 adhesive 12 Flexible flat cable
───────────────────────────────────────────────────── フロントページの続き (72)発明者 青山 正義 茨城県日立市日高町５丁目１番１号 日立 電線株式会社日高工場内 Ｆターム(参考） 4K024 AA07 AA21 AA22 AB19 BA09 BB09 BC03 DB01 DB10 GA03 GA16 5G307 BA04 BB02 BC06 5G311 CA01 CB01 CB05 CF06 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Masayoshi Aoyama Hitachi, 1-1 Hidaka-cho, Hitachi City, Ibaraki Prefecture Electric Wire Co., Ltd. Hidaka Factory F-term (reference) 4K024 AA07 AA21 AA22 AB19 BA09 BB09 BC03 DB01 DB10 GA03 GA16 5G307 BA04 BB02 BC06 5G311 CA01 CB01 CB05 CF06
Claims (3)
状断面を有する導体の表面全体に厚さ０．０５μｍ以上
のＳｎ系めっき層を有するＳｎ系めっき平角導体。1. A Sn-based plated rectangular conductor having a Sn-based plating layer with a thickness of 0.05 μm or more on the entire surface of a conductor having a rectangular cross section with a thickness of 0.1 mm or less and a width of 1.5 mm or less.
分の層と当該純Ｓｎ系めっき部分の層と前記導体の間に
形成される金属間化合物層から成り、前記純Ｓｎ系めっ
き部分の層の厚さＶ１と、前記金属間化合物層の厚さＶ
２の比が、以下の（１）式で規定されることを特徴とす
る請求項１記載のＳｎ系めっき平角導体。 ２＜Ｖ１／Ｖ２＜２０ （１）2. The Sn-based plated layer comprises a layer of a pure Sn-based plated portion, an intermetallic compound layer formed between the layer of the pure Sn-based plated portion and the conductor, and the pure Sn-based plated portion. Layer thickness V1 and the intermetallic compound layer thickness V1
The Sn-based plated rectangular conductor according to claim 1, wherein the ratio of 2 is defined by the following formula (1). 2 <V1 / V2 <20 (1)
導体を１本配置または複数本並列配置し、絶縁性のプラ
スチックフィルムでラミネートして形成されてなるフラ
ットケーブル。3. A flat cable formed by arranging one or a plurality of Sn-plated rectangular flat conductors according to claim 1 or 2 in parallel and laminating them with an insulating plastic film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001278322A JP2003086024A (en) | 2001-09-13 | 2001-09-13 | Sn PLATING FLAT CONDUCTOR AND FLAT CABLE USING THE SAME |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001278322A JP2003086024A (en) | 2001-09-13 | 2001-09-13 | Sn PLATING FLAT CONDUCTOR AND FLAT CABLE USING THE SAME |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003086024A true JP2003086024A (en) | 2003-03-20 |
Family
ID=19102709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001278322A Pending JP2003086024A (en) | 2001-09-13 | 2001-09-13 | Sn PLATING FLAT CONDUCTOR AND FLAT CABLE USING THE SAME |
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| Country | Link |
|---|---|
| JP (1) | JP2003086024A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005206869A (en) * | 2004-01-22 | 2005-08-04 | Sumitomo Electric Ind Ltd | Electrically conductive component, and its production method |
| JP2005286240A (en) * | 2004-03-30 | 2005-10-13 | Dowa Mining Co Ltd | Semiconductor device component and its manufacturing method, and semiconductor device using same |
| JP2008059814A (en) * | 2006-08-29 | 2008-03-13 | Sumitomo Electric Ind Ltd | Manufacturing method of rectangular conductor, and manufacturing method of flat cable |
| JP2009231065A (en) * | 2008-03-24 | 2009-10-08 | Fujikura Ltd | Tin-system plated rectangular conductor and flexible flat cable |
| CN102543249A (en) * | 2010-12-08 | 2012-07-04 | 日立电线株式会社 | Plating coating copper wire and method for making the same |
| JP6489257B1 (en) * | 2018-03-14 | 2019-03-27 | 日立金属株式会社 | Tin-plated copper wire, method of manufacturing the same, insulated wire, cable |
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2001
- 2001-09-13 JP JP2001278322A patent/JP2003086024A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005206869A (en) * | 2004-01-22 | 2005-08-04 | Sumitomo Electric Ind Ltd | Electrically conductive component, and its production method |
| JP2005286240A (en) * | 2004-03-30 | 2005-10-13 | Dowa Mining Co Ltd | Semiconductor device component and its manufacturing method, and semiconductor device using same |
| JP2008059814A (en) * | 2006-08-29 | 2008-03-13 | Sumitomo Electric Ind Ltd | Manufacturing method of rectangular conductor, and manufacturing method of flat cable |
| JP2009231065A (en) * | 2008-03-24 | 2009-10-08 | Fujikura Ltd | Tin-system plated rectangular conductor and flexible flat cable |
| CN102543249A (en) * | 2010-12-08 | 2012-07-04 | 日立电线株式会社 | Plating coating copper wire and method for making the same |
| JP6489257B1 (en) * | 2018-03-14 | 2019-03-27 | 日立金属株式会社 | Tin-plated copper wire, method of manufacturing the same, insulated wire, cable |
| JP2019157224A (en) * | 2018-03-14 | 2019-09-19 | 日立金属株式会社 | Tin plated copper wire, method for manufacturing the same, insulated wire and cable |
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