PL3483307T3 - Kompozycje powlekające do elektrolitycznego osadzania miedzi, ich zastosowanie i sposób elektrolitycznego osadzania warstwy miedzi lub stopu miedzi na co najmniej jednej powierzchni podłoża - Google Patents

Kompozycje powlekające do elektrolitycznego osadzania miedzi, ich zastosowanie i sposób elektrolitycznego osadzania warstwy miedzi lub stopu miedzi na co najmniej jednej powierzchni podłoża

Info

Publication number
PL3483307T3
PL3483307T3 PL17200836T PL17200836T PL3483307T3 PL 3483307 T3 PL3483307 T3 PL 3483307T3 PL 17200836 T PL17200836 T PL 17200836T PL 17200836 T PL17200836 T PL 17200836T PL 3483307 T3 PL3483307 T3 PL 3483307T3
Authority
PL
Poland
Prior art keywords
copper
substrate
alloy layer
layer onto
electrolytically depositing
Prior art date
Application number
PL17200836T
Other languages
English (en)
Inventor
Philipp Wachter
Christina Pfirrmann
Stefan Kretschmer
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of PL3483307T3 publication Critical patent/PL3483307T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B17/00—Azine dyes
    • C09B17/02—Azine dyes of the benzene series
PL17200836T 2017-11-09 2017-11-09 Kompozycje powlekające do elektrolitycznego osadzania miedzi, ich zastosowanie i sposób elektrolitycznego osadzania warstwy miedzi lub stopu miedzi na co najmniej jednej powierzchni podłoża PL3483307T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP17200836.9A EP3483307B1 (en) 2017-11-09 2017-11-09 Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate

Publications (1)

Publication Number Publication Date
PL3483307T3 true PL3483307T3 (pl) 2020-11-16

Family

ID=60293883

Family Applications (1)

Application Number Title Priority Date Filing Date
PL17200836T PL3483307T3 (pl) 2017-11-09 2017-11-09 Kompozycje powlekające do elektrolitycznego osadzania miedzi, ich zastosowanie i sposób elektrolitycznego osadzania warstwy miedzi lub stopu miedzi na co najmniej jednej powierzchni podłoża

Country Status (11)

Country Link
US (1) US10982343B2 (pl)
EP (1) EP3483307B1 (pl)
JP (1) JP6836016B2 (pl)
KR (1) KR102161944B1 (pl)
CN (1) CN111295468B (pl)
BR (1) BR112020003856B1 (pl)
ES (1) ES2800292T3 (pl)
MX (1) MX2020004882A (pl)
PL (1) PL3483307T3 (pl)
PT (1) PT3483307T (pl)
WO (1) WO2019091721A1 (pl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110438531B (zh) * 2019-08-12 2021-12-24 湖北中一科技股份有限公司 一种应用于锂电池的超薄铜箔制备方法及系统
CN110396704B (zh) * 2019-08-12 2021-07-20 湖北中一科技股份有限公司 一种超薄电解铜箔及制备方法
CN114250489B (zh) * 2022-01-05 2023-09-22 三门峡宏鑫新材料科技有限公司 一种基于电沉积法制备铜铁合金的方法
CN114351195A (zh) * 2022-03-19 2022-04-15 深圳市创智成功科技有限公司 一种脉冲通孔填孔的电镀铜配方及其电镀工艺
CN115142113B (zh) * 2022-08-08 2023-10-13 哈尔滨工业大学 一种用于镍基合金的电解抛光液添加剂、抛光液及抛光方法

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NL83873C (pl) 1952-05-26
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
DE2039831C3 (de) 1970-06-06 1979-09-06 Schering Ag, 1000 Berlin Und 4619 Bergkamen Saures Bad zur galvanischen Abscheidung glänzender Kupferüberzüge
US4347108A (en) * 1981-05-29 1982-08-31 Rohco, Inc. Electrodeposition of copper, acidic copper electroplating baths and additives therefor
DE4344387C2 (de) 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
DE19545231A1 (de) 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten
JP2000248397A (ja) * 1999-02-26 2000-09-12 Electroplating Eng Of Japan Co 硫酸銅めっき液及びそれを用いた電解めっき方法
US6444110B2 (en) * 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
KR100659544B1 (ko) * 1999-11-12 2006-12-19 에바라 유지라이토 코포레이션 리미티드 비아 필링 방법
JP2003129274A (ja) * 2001-10-29 2003-05-08 Applied Materials Inc 電解めっき方法
DE10261852B3 (de) * 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
US20050133376A1 (en) * 2003-12-19 2005-06-23 Opaskar Vincent C. Alkaline zinc-nickel alloy plating compositions, processes and articles therefrom
US7442286B2 (en) * 2004-02-26 2008-10-28 Atotech Deutschland Gmbh Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys
JP4499502B2 (ja) * 2004-08-05 2010-07-07 荏原ユージライト株式会社 めっき用レベリング剤、酸性銅めっき浴用添加剤組成物、酸性銅めっき浴および該めっき浴を用いるめっき方法
JP5442188B2 (ja) 2007-08-10 2014-03-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 銅めっき液組成物
JP2009041097A (ja) * 2007-08-10 2009-02-26 Rohm & Haas Electronic Materials Llc 銅めっき方法
US8691987B2 (en) 2010-09-24 2014-04-08 Andrew M. Krol Method of producing polymeric phenazonium compounds
JP5981938B2 (ja) 2010-12-21 2016-08-31 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ レベリング剤を含有する金属電解めっき組成物
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JP5903706B2 (ja) 2011-08-25 2016-04-13 石原ケミカル株式会社 銅フィリング方法及び当該方法を適用した電子部品の製造方法
CN103179806B (zh) * 2011-12-21 2019-05-28 奥特斯有限公司 组合的通孔镀覆和孔填充的方法
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content
US20140238868A1 (en) 2013-02-25 2014-08-28 Dow Global Technologies Llc Electroplating bath
CN106637311A (zh) * 2017-02-09 2017-05-10 济南德锡科技有限公司 一种凹印制版电镀硬铜镀液的制备方法

Also Published As

Publication number Publication date
CN111295468B (zh) 2021-03-30
ES2800292T3 (es) 2020-12-29
US20200347504A1 (en) 2020-11-05
EP3483307B1 (en) 2020-04-01
BR112020003856B1 (pt) 2024-01-09
MX2020004882A (es) 2020-08-06
PT3483307T (pt) 2020-07-03
US10982343B2 (en) 2021-04-20
WO2019091721A1 (en) 2019-05-16
BR112020003856A2 (pt) 2020-09-08
KR20200035317A (ko) 2020-04-02
CN111295468A (zh) 2020-06-16
KR102161944B1 (ko) 2020-10-06
JP2020536168A (ja) 2020-12-10
JP6836016B2 (ja) 2021-02-24
EP3483307A1 (en) 2019-05-15

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