PL3581684T3 - Kwasowa kąpiel galwaniczna cynkowa lub stopu cynkowo-niklowego do osadzania warstwy cynku lub stopu cynkowo-niklowego - Google Patents

Kwasowa kąpiel galwaniczna cynkowa lub stopu cynkowo-niklowego do osadzania warstwy cynku lub stopu cynkowo-niklowego

Info

Publication number
PL3581684T3
PL3581684T3 PL18177041T PL18177041T PL3581684T3 PL 3581684 T3 PL3581684 T3 PL 3581684T3 PL 18177041 T PL18177041 T PL 18177041T PL 18177041 T PL18177041 T PL 18177041T PL 3581684 T3 PL3581684 T3 PL 3581684T3
Authority
PL
Poland
Prior art keywords
zinc
nickel alloy
depositing
acidic
electroplating bath
Prior art date
Application number
PL18177041T
Other languages
English (en)
Inventor
Michal Kaczmarek
Zdenek Starkbaum
Sebastian Hahn
Ercan Karapinar
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of PL3581684T3 publication Critical patent/PL3581684T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/22—Electroplating: Baths therefor from solutions of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
PL18177041T 2018-06-11 2018-06-11 Kwasowa kąpiel galwaniczna cynkowa lub stopu cynkowo-niklowego do osadzania warstwy cynku lub stopu cynkowo-niklowego PL3581684T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP18177041.3A EP3581684B1 (en) 2018-06-11 2018-06-11 An acidic zinc or zinc-nickel alloy electroplating bath for depositing a zinc or zinc-nickel alloy layer

Publications (1)

Publication Number Publication Date
PL3581684T3 true PL3581684T3 (pl) 2021-06-14

Family

ID=62599504

Family Applications (1)

Application Number Title Priority Date Filing Date
PL18177041T PL3581684T3 (pl) 2018-06-11 2018-06-11 Kwasowa kąpiel galwaniczna cynkowa lub stopu cynkowo-niklowego do osadzania warstwy cynku lub stopu cynkowo-niklowego

Country Status (13)

Country Link
US (1) US11214882B2 (pl)
EP (1) EP3581684B1 (pl)
JP (1) JP6972394B2 (pl)
KR (1) KR102289776B1 (pl)
CN (2) CN112272716B (pl)
BR (1) BR112020025027A2 (pl)
CA (1) CA3103309C (pl)
ES (1) ES2847957T3 (pl)
MX (1) MX2020013490A (pl)
PL (1) PL3581684T3 (pl)
RU (1) RU2749321C1 (pl)
TW (1) TWI782207B (pl)
WO (1) WO2019238454A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114085428B (zh) * 2021-12-03 2023-09-19 江苏万纳普新材料科技有限公司 一种塑料改性用抗菌剂及其制备方法

Family Cites Families (21)

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JPS4919978B1 (pl) * 1970-10-30 1974-05-21
SU876798A1 (ru) * 1979-04-16 1981-10-30 Ворошиловградский Сельскохозяйственный Институт Электролит цинковани
DE3839824A1 (de) * 1987-11-28 1989-06-08 Lpw Chemie Gmbh Verfahren zur galvanischen abscheidung von zinkschichten und/oder von glanz-zinkschichten
RU2093613C1 (ru) * 1991-05-21 1997-10-20 Московский химико-технологический институт им.Д.И.Менделеева Электролит для осаждения цинковых покрытий
FR2765247B1 (fr) * 1997-06-26 1999-07-30 Lorraine Laminage Bain aqueux d'electrodeposition a base de chlorures pour la preparation d'un revetement a base de zinc ou d'alliage de zinc
US6773573B2 (en) * 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
DE10164671A1 (de) * 2001-12-27 2003-07-10 Basf Ag Derivate von Polymeren für die Metallbehandlung
DE10227362A1 (de) * 2002-06-19 2004-01-08 Basf Ag Komplexbildner für die Behandlung von Metall- und Kunstoffoberflächen
US20050133376A1 (en) * 2003-12-19 2005-06-23 Opaskar Vincent C. Alkaline zinc-nickel alloy plating compositions, processes and articles therefrom
US7442286B2 (en) 2004-02-26 2008-10-28 Atotech Deutschland Gmbh Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys
KR101134610B1 (ko) * 2004-08-18 2012-04-09 에바라 유지라이토 가부시키가이샤 동도금용 첨가제 및 이를 이용한 전자회로기판의 제조방법
DE102005049789A1 (de) * 2005-10-18 2007-04-19 Basf Ag Wässriges, alkylisches, cyanidfreies Bad zur galvanischen Abscheidung von Zink- und Zinklegierungsüberzügen
JP2007308761A (ja) 2006-05-18 2007-11-29 Fujifilm Corp めっき処理方法、導電性金属膜およびその製造方法、並びに透光性電磁波シールド膜
EP1870495A1 (de) 2006-06-21 2007-12-26 Atotech Deutschland Gmbh Wässriges alkalisches cyanidfreies Bad zur galvanischen Abscheidung von Zink- und Zinklegierungsüberzügen
JP5503111B2 (ja) * 2007-04-03 2014-05-28 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 金属メッキ組成物および方法
JP4919978B2 (ja) 2008-01-26 2012-04-18 三洋電機株式会社 歪補正装置
MY156728A (en) 2009-04-07 2016-03-15 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
CN101876081B (zh) * 2009-04-28 2011-09-07 武汉风帆电镀技术有限公司 有氰转无氰碱性环保镀锌添加剂
EP2292679B1 (de) * 2009-09-08 2020-03-11 ATOTECH Deutschland GmbH Polymere mit Aminoendgruppen und deren Verwendung als Additive für galvanische Zink- und Zinklegierungsbäder
ES2808109T3 (es) * 2014-07-04 2021-02-25 Basf Se Aditivo para enchapado de cinc alcalino
SI3015571T1 (sl) * 2014-10-27 2018-09-28 Atotech Deutschland Gmbh Kisli sestavek cinkove in zlitinske cink-nikljeve platirne kopeli in galvanizirni postopek

Also Published As

Publication number Publication date
CN112272716B (zh) 2021-06-15
BR112020025027A2 (pt) 2021-03-23
JP6972394B2 (ja) 2021-11-24
ES2847957T3 (es) 2021-08-04
KR102289776B1 (ko) 2021-08-13
CN112272716A (zh) 2021-01-26
US11214882B2 (en) 2022-01-04
TWI782207B (zh) 2022-11-01
JP2021521347A (ja) 2021-08-26
EP3581684A1 (en) 2019-12-18
CA3103309C (en) 2021-08-17
MX2020013490A (es) 2021-09-23
KR20210003286A (ko) 2021-01-11
CN113445085A (zh) 2021-09-28
WO2019238454A1 (en) 2019-12-19
TW202000997A (zh) 2020-01-01
US20210246565A1 (en) 2021-08-12
CA3103309A1 (en) 2019-12-19
EP3581684B1 (en) 2020-11-18
RU2749321C1 (ru) 2021-06-08

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