SG11202013166YA - Electrolyte for the cyanide-free deposition of silver - Google Patents

Electrolyte for the cyanide-free deposition of silver

Info

Publication number
SG11202013166YA
SG11202013166YA SG11202013166YA SG11202013166YA SG11202013166YA SG 11202013166Y A SG11202013166Y A SG 11202013166YA SG 11202013166Y A SG11202013166Y A SG 11202013166YA SG 11202013166Y A SG11202013166Y A SG 11202013166YA SG 11202013166Y A SG11202013166Y A SG 11202013166YA
Authority
SG
Singapore
Prior art keywords
cyanide
electrolyte
silver
free deposition
deposition
Prior art date
Application number
SG11202013166YA
Inventor
Sascha Berger
Klaus Bronder
Mario Tomazzoni
Uwe Manz
Original Assignee
Umicore Galvanotechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102018120357.8A external-priority patent/DE102018120357A1/en
Priority claimed from DE102019106004.4A external-priority patent/DE102019106004B4/en
Application filed by Umicore Galvanotechnik Gmbh filed Critical Umicore Galvanotechnik Gmbh
Publication of SG11202013166YA publication Critical patent/SG11202013166YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/66—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
    • C07D233/72—Two oxygen atoms, e.g. hydantoin
    • C07D233/74—Two oxygen atoms, e.g. hydantoin with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to other ring members
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SG11202013166YA 2018-08-21 2019-08-20 Electrolyte for the cyanide-free deposition of silver SG11202013166YA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018120357.8A DE102018120357A1 (en) 2018-08-21 2018-08-21 Electrolyte for the deposition of silver and silver alloy coatings
DE102019106004.4A DE102019106004B4 (en) 2019-03-08 2019-03-08 Additive for the cyanide-free deposition of silver
PCT/EP2019/072275 WO2020038948A1 (en) 2018-08-21 2019-08-20 Electrolyte for the cyanide-free deposition of silver

Publications (1)

Publication Number Publication Date
SG11202013166YA true SG11202013166YA (en) 2021-02-25

Family

ID=67742396

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202013166YA SG11202013166YA (en) 2018-08-21 2019-08-20 Electrolyte for the cyanide-free deposition of silver

Country Status (7)

Country Link
US (1) US11846036B2 (en)
EP (1) EP3841233A1 (en)
JP (2) JP7405827B2 (en)
KR (1) KR20210044866A (en)
CN (1) CN112469847A (en)
SG (1) SG11202013166YA (en)
WO (1) WO2020038948A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111575750B (en) * 2020-07-13 2022-03-15 南昌航空大学 Cyanide-free electroplating nano-silver additive
CN114059112A (en) * 2021-08-04 2022-02-18 中国科学院宁波材料技术与工程研究所 Cyanide-free silver plating electroplating solution and application thereof
CN114438557B (en) * 2022-02-15 2023-04-11 嘉兴学院 Electroplating solution for etching silver plating of lead frame and preparation method thereof

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0225422A1 (en) 1985-12-12 1987-06-16 LeaRonal, Inc. Alkaline baths and methods for electrodeposition of palladium and palladium alloys
JPH0690432B2 (en) * 1986-11-18 1994-11-14 富士写真フイルム株式会社 Silver halide photographic light-sensitive material
JPH08104993A (en) 1994-10-04 1996-04-23 Electroplating Eng Of Japan Co Silver plating bath and its silver plating method
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
JPH11302893A (en) * 1998-04-22 1999-11-02 Okuno Chem Ind Co Ltd Non-cyanide silver electroplating liquid
DE19928047A1 (en) * 1999-06-19 2000-12-21 Gerhard Hoffacker Use of pollutant-deficient to pollutant-rich aqueous systems for the galvanic deposition of precious metals and precious metal alloys
US20050183961A1 (en) 2004-02-24 2005-08-25 Morrissey Ronald J. Non-cyanide silver plating bath composition
EP1918426A1 (en) 2006-10-09 2008-05-07 Enthone, Inc. Cyanide free electrolyte composition und process for plating silver or alloys thereof on substrates
DE102009029558A1 (en) 2009-09-17 2011-03-31 Schott Solar Ag electrolyte composition
CN101665963B (en) * 2009-09-23 2011-08-24 福建师范大学 Environmental non-cyanide plating solution for silver-plating
EP2431501B1 (en) 2010-09-21 2013-11-20 Rohm and Haas Electronic Materials LLC Method of electroplating silver strike over nickel
JP5854727B2 (en) 2010-09-21 2016-02-09 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ Silver electroplating solution without cyanide
CN102168290B (en) 2011-04-08 2012-10-17 哈尔滨工业大学 Cyanide-free silver plating electroplating solution and preparation method and electroplating method thereof
JP6046406B2 (en) 2011-07-26 2016-12-14 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ High temperature resistant silver coated substrate
CN102268701B (en) * 2011-08-02 2013-10-09 南京大学 Non-cyanide bright silver electroplating bath and preparation method thereof
CN102277601B (en) * 2011-08-09 2013-07-24 南京大学 Cyanogen-free silver-plating electroplating liquid containing auxiliary complexing agent
EP2634293B1 (en) 2012-03-02 2018-07-18 Rohm and Haas Electronic Materials, L.L.C. Composites of carbon black and metal
CN103806060A (en) * 2012-11-12 2014-05-21 无锡三洲冷轧硅钢有限公司 Electroplating method of improving binding force of silver coating and matrix
CN104342726A (en) * 2013-07-23 2015-02-11 深圳中宇昭日科技有限公司 Cyanide-free silver plating method
DE102013215476B3 (en) 2013-08-06 2015-01-08 Umicore Galvanotechnik Gmbh Electrolyte for the electrodeposition of silver-palladium alloys and process for their deposition
PL3159435T3 (en) 2015-10-21 2018-10-31 Umicore Galvanotechnik Gmbh Additive for silver palladium alloy electrolytes
CN105506683A (en) * 2015-12-23 2016-04-20 苏州市金星工艺镀饰有限公司 Cyanide-free silver plating electroplating bath
JP2018009227A (en) * 2016-07-14 2018-01-18 日本高純度化学株式会社 Electrolytic palladium silver alloy plated film and electrolytic plating liquid for forming the same
CN106222633A (en) * 2016-07-25 2016-12-14 嘉兴学院 A kind of alkalescence half light is without cyanogen displacement chemical silver plating plating solution and preparation method thereof
CN107841771A (en) * 2017-10-25 2018-03-27 厦门大学 It is a kind of based on the non-cyanide plating silvering solution composition of complexing ligands system and its application

Also Published As

Publication number Publication date
JP7405827B2 (en) 2023-12-26
JP2023174667A (en) 2023-12-08
US11846036B2 (en) 2023-12-19
KR20210044866A (en) 2021-04-23
WO2020038948A1 (en) 2020-02-27
EP3841233A1 (en) 2021-06-30
CN112469847A (en) 2021-03-09
US20220205122A1 (en) 2022-06-30
JP2021535276A (en) 2021-12-16

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