EP3733934A4 - Electroplating assembly mechanism - Google Patents

Electroplating assembly mechanism Download PDF

Info

Publication number
EP3733934A4
EP3733934A4 EP17936813.9A EP17936813A EP3733934A4 EP 3733934 A4 EP3733934 A4 EP 3733934A4 EP 17936813 A EP17936813 A EP 17936813A EP 3733934 A4 EP3733934 A4 EP 3733934A4
Authority
EP
European Patent Office
Prior art keywords
assembly mechanism
electroplating assembly
electroplating
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP17936813.9A
Other languages
German (de)
French (fr)
Other versions
EP3733934A1 (en
Inventor
Potao HUANG
Yaochung LIU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hallmark Technology Co Ltd
Original Assignee
Hallmark Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hallmark Technology Co Ltd filed Critical Hallmark Technology Co Ltd
Publication of EP3733934A1 publication Critical patent/EP3733934A1/en
Publication of EP3733934A4 publication Critical patent/EP3733934A4/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/22—Apparatus for electrolytic coating of small objects in bulk having open containers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/18—Apparatus for electrolytic coating of small objects in bulk having closed containers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
EP17936813.9A 2017-12-26 2017-12-26 Electroplating assembly mechanism Pending EP3733934A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/118619 WO2019127014A1 (en) 2017-12-26 2017-12-26 Electroplating assembly mechanism

Publications (2)

Publication Number Publication Date
EP3733934A1 EP3733934A1 (en) 2020-11-04
EP3733934A4 true EP3733934A4 (en) 2021-07-14

Family

ID=67063822

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17936813.9A Pending EP3733934A4 (en) 2017-12-26 2017-12-26 Electroplating assembly mechanism

Country Status (5)

Country Link
EP (1) EP3733934A4 (en)
JP (1) JP6800308B2 (en)
KR (1) KR102221652B1 (en)
CN (1) CN111630210B (en)
WO (1) WO2019127014A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7340441B2 (en) 2019-12-19 2023-09-07 Koa株式会社 Rotary plating equipment and plating method using it
CN113201786B (en) * 2021-03-25 2022-07-01 浙江机电职业技术学院 Barrel-plating device for part machining

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0220419A1 (en) * 1985-09-17 1987-05-06 Siemens Aktiengesellschaft Apparatus for the electrolytic treatment of bulk articles
GB2259523A (en) * 1991-09-13 1993-03-17 Murata Manufacturing Co Electroplating miniature parts in bulk
US20090045069A1 (en) * 2005-07-28 2009-02-19 Tdk Corporation Plating apparatus and plating method
EP3611293A1 (en) * 2017-04-14 2020-02-19 YKK Corporation Plated material and manufacturing method therefor

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3359195A (en) * 1963-10-29 1967-12-19 Hojyo Kazuya Automatic chromium plating apparatus
JPS59205499A (en) * 1983-05-09 1984-11-21 Tetsuya Hojo Automatic plating method and apparatus of small parts
JP3128459B2 (en) * 1995-02-28 2001-01-29 上村工業株式会社 Rotary plating equipment for small items
JPH11279800A (en) * 1998-03-26 1999-10-12 Hitachi Metals Ltd Method for plating small-sized electronic parts
JP4458056B2 (en) * 2005-07-28 2010-04-28 Ｔｄｋ株式会社 Plating equipment
JP4832970B2 (en) * 2006-07-06 2011-12-07 上村工業株式会社 Small surface treatment equipment
JP5038024B2 (en) * 2007-06-06 2012-10-03 上村工業株式会社 Work surface treatment system
JP2009065005A (en) * 2007-09-07 2009-03-26 Panasonic Corp Manufacturing method of chip-like electronic component
JP5672717B2 (en) * 2010-02-25 2015-02-18 Tdk株式会社 Plating apparatus, plating method and chip type electronic component manufacturing method
JP5514591B2 (en) * 2010-03-15 2014-06-04 孝志 上市 Plating equipment
JP4998578B2 (en) * 2010-03-29 2012-08-15 Ｔｄｋ株式会社 Plating apparatus, plating method and chip type electronic component manufacturing method
JP5598754B2 (en) * 2010-06-08 2014-10-01 日立金属株式会社 Plating equipment
CN106884198B (en) * 2017-04-18 2019-02-05 湖南省鎏源新能源有限责任公司 A kind of electroplanting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0220419A1 (en) * 1985-09-17 1987-05-06 Siemens Aktiengesellschaft Apparatus for the electrolytic treatment of bulk articles
GB2259523A (en) * 1991-09-13 1993-03-17 Murata Manufacturing Co Electroplating miniature parts in bulk
US20090045069A1 (en) * 2005-07-28 2009-02-19 Tdk Corporation Plating apparatus and plating method
EP3611293A1 (en) * 2017-04-14 2020-02-19 YKK Corporation Plated material and manufacturing method therefor

Also Published As

Publication number Publication date
EP3733934A1 (en) 2020-11-04
CN111630210B (en) 2022-01-25
CN111630210A (en) 2020-09-04
JP2020506284A (en) 2020-02-27
WO2019127014A1 (en) 2019-07-04
JP6800308B2 (en) 2020-12-16
KR20190082191A (en) 2019-07-09
KR102221652B1 (en) 2021-03-02

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